• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.24-24
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• 2003

Research activity in the III-V nitrides materials system has increased markedly in the past several years ever since high-brightness blue light-emitting diodes (LEDs) became commercially available. Despite of excellent optical properties of the GaN, however, inherently poor thermal property of the sapphire used as a substrate material n these devices may lead to thermal degradation of devices, especially during their high power operation. Therefore, dependable thermal analysis and packaging schemes of GaN-based LEDs are necessary for solid lighting applications under high power operation. In this paper, emphasis will be placed upon thermal design of GaN-based LEDs. Thermal measurements of LEDs on chip and packaging scale were performed using the liquid crystal thermographic technology and micro thermocouples for different bias conditions. By a series of optical arrangement, hot spots with specific transition temperatures were obtained with increasing input power. Thermal design of LEDS was made using the finite element method and analytical unit temperature profile approach with optimal boundary conditions. The experimental results were compared to the simulated data and the results agree well enough for the establishment of dependable prediction of thermal behavior in these devices. The paper will present a more detailed understanding of the thermal analysis of the GaN-based blue and white LEDs for high power applications.

• Progress in Superconductivity and Cryogenics
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• v.19 no.2
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• pp.53-57
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• 2017

In superconducting power devices including power cables in which high temperature superconducting (HTS) tapes are utilized, a reliable electrical insulation should be achieved for its maximum performance. For an efficient design of HTS superconducting devices, a comparative evaluation of the mechanical and thermal propperties for various insulation materials at cryogenic temperatures is required. Especially, in the process of the property evaluation of the sheet-shaped insulation materials, anisotropy according to the machining direction should be considered because the mechanical and thermal properties are significantly influenced by the sample orientation. In this study, the cryogenic thermal and mechanical properties of various insulation material sheets such as PPLP, Cryoflex, Teflon, and Kapton were determined considering sample orientation. All samples tested at cryogenic temperature showed significantly higher tensile strength as compared with that of room temperature. The ultimate tensile strength at both temperature conditions significantly depended upon the sample orientation. The thermal properties of the insulation materials exhibited a slight difference among samples depending on the orientation: for the PPLP and Cryoflex, the CD orientation showed larger thermal contraction up to 77 K as compared to the MD one. MD samples in PPLP and Cryoflex showed a lower CTE and thermal contraction which made it more promising as an insulation material due to its comparable CTE with HTS CC tapes.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.5 s.311
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• pp.60-67
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• 2006

Thermal analysis and prediction of electronic components is required to predict and optimize the reliability of onboard electronic unit employed in space vehicles. This paper introduces a methodology on thermal prediction that uses isothermal PCB model, thermal force model, thermal resistance matrix and superposition principle to calculate electronic devices temperatures undergoing thermal conduction environment. An example is Presented including a prediction result by this method and simulation results performed by commercial program.

• Journal of information and communication convergence engineering
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• v.1 no.4
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• pp.199-204
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• 2003

In this paper, we present the thermal annealing effects of the W/$SiO_2$ multi-layer reflectors in ZnO-based FBAR devices with cobalt (Co) electrodes in comparison with those with aluminum (Al) electrodes. Various thermal annealing conditions have been implemented on the W/$SiO_2$ multi-layer reflectors formed on p-type (100) silicon substrates. The resonance characteristics could be significantly improved due to the thermal annealing and were observed to depend strongly on the annealing conditions applied to the reflectors. Particularly, the FBAR devices with the W/$SiO_2$ multi- layer reflectors annealed at $400^{\circ}C$/30min have shown superior resonance characteristics in terms of return loss and quality-factor (Q-factor). In addition, the use of Co electrodes has resulted in further improvement of the resonance characteristics as compared with the Al electrodes. As a result, the combined use of both the thermal annealing and Co electrodes seems very useful to more effectively improve the resonance characteristics of the FBAR devices with the W/$SiO_2$ multi-layer reflectors.

• Journal of Welding and Joining
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• v.13 no.2
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• pp.82-95
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• 1995

This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

• Fire Science and Engineering
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• v.10 no.2
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• pp.28-39
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• 1996

A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.10
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• pp.107-114
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• 1996

Monte carlo method is especially a useful method for the analysis of thermal noise of semiconductor devices since the time dependence of microscopic details is simulated directly. Recently, a mthod for the calculation of the instantaneous currents of 2-dimensional devices, which is numerically more accurate than the conventional method, has been proposed using the generalized ramo-shockley theorem. Using this mehtod we investage the validity of the existing thermal noise theories of field-effect transistors. First, the 1-dimensional analysis of thermal noise theories of field-effect transistors. First, the 1-dimensional analysis of thermal noise theories of field-effect transistors. First, the 1-dimensional analysis of thermal noise using ramo-shockley theorem is shown to be applicable to 2 dimensional devices if the frequency of interest is low enough. The correlation between electrons in different regions of th echannel is shown not to be negligible. And we also obtian the spatial map of the noise in the channel region. By doing so, we show that the steady state nyquist theorem is the correct theory rather than the theory by van der ziel et.al.

• Journal of Institute of Control, Robotics and Systems
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• v.17 no.12
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• pp.1203-1209
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• 2011

In this paper, the degradation evaluation method of VLC (Visible Light Communication) wireless module after high dose rate gamma-ray irradiation using the thermal infrared camera is proposed. First, the heating characteristics of the active devices embedded in the VLC wireless module during the condition of normal operation is monitored by thermal infrared camera. By the image processing technique, the trends of the intensity of the heat emitted by the active devices are calculated and stored. The feature of the blob area including the area of the active devices in the thermal infrared image is extracted and stored. The feature used in this paper is the mean value of the gray levels in the blob area. The same VLC module has been gamma irradiated at the dose rate of about 4.0 kGy/h during 72 hours up to a total dose of 288 kGy. And then, the heating characteristics of the active devices embedded in the VLC wireless module after high dose gamma ray irradiation is observed by thermal infrared camera. The high dose gamma-ray induced degradation of the active devices embedded in the VLC module was evaluated by comparing the mean value of the blob area to the one of the same blob area of the VLC module before the gamma ray irradiation.

• Journal of Sensor Science and Technology
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• v.22 no.2
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• pp.124-129
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• 2013

In this paper, we manufactured the regenerated FBG by the thermal annealing of seed FBG based on UV irradiation. The writing conditions of regenerated FBGs were investigated in four types of optical fiber. FBGs written in $H_2$-free fiber were erased and not regenerated during the thermal annealing. FBG written in $H_2$ loaded Boron co-doped fiber was erased at the temperature of about $580^{\circ}C$ and regenerated about $590^{\circ}C$. However, the extinction of regenerated FBG started at the temperature over $900^{\circ}C$ and then FBG disappeared out. FBG written in $H_2$ loaded Ge high doped fiber was erased and regenerated around the temperature of $800^{\circ}C$ and maintained until the end of the thermal annealing. The reflection of the regenerated FBG was decreased about 12 dB and the center wavelength of the regenerated FBG was shifted about 0.7 nm compared with that of the seed FBG. The thermal characteristics of the regenerated FBG were analyzed by reheating from room temperature to $980^{\circ}C$. As results, the regenerated FBG had survived without a decrease of reflection and the thermal sensitivity was $15pm^{\circ}C$.

• KIEAE Journal
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• v.15 no.6
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• pp.101-109
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• 2015

Purpose: Glazing and shading devices influence a lot on the thermal and visual environment in office buildings. Solar heat and daylight are contrary concept, therefore proper arrangement of thermal and optical performance is needed when designing a glazing and shading devices. The purpose of this study is to examine the conditions of the glazing and shading devices available for promoting the reduction of cooling loads + lighting loads and the improvement in thermal comfort and visual comfort for the summer season in an office building installed with venetian blind. Method: This study established 12 simulation cases which have different glazings and the positions of venetian blind for evaluating different thermal and optical performance. And by using EnergyPlus v8.1 and Window v7.2 program, we quantitatively analyzed cooling loads + lighting loads, thermal comfort and visual comfort in an office building installed with the glazing and shading devices. Result: Consequently, Case 9(Double Low-E+Exterior Blind) is the best arrangement of solar heat gain and daylight influx, thereby becomes the most excellent case of reducing cooling+lighting loads(46.8%) and simultaneously becomes the enhancement case in thermal comfort. Also, DGI(Daylight glare index) under clear sky conditions in summer was evaluated to be 19.6, and thereby satisfied the recommendation level of allowing visual comfort.