• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.6
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• pp.1008-1012
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• 2012

Injection molds are fabricated by assembling a number of plates in which mold core and cavity components are inserted. The assembled structure causes a number of contact interfaces between each component where the heat transfer is affected by the thermal contact resistance. However, the mold assembly has been treated as a one body in numerical analyses of injection molding, which has a limitation in predicting the mold temperature distribution during the molding cycle. In this study, a numerical approach that considers the thermal contact effect is proposed to predict the heat transfer characteristics of an injection mold assembly. To find the thermal contact conductance between the mold core and plate, a number of finite element (FE) simulations were performed with the design of experiment (DOE) and statistical analysis. Thus, the heat transfer analyses using the obtained conductance values can provide more reliable results than conventional one-body simulations.

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Korean Journal of Computational Design and Engineering
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• v.9 no.4
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• Laser Solutions
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• v.6 no.1
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• pp.17-24
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• 2003

The purpose of this study is to evaluate thermal shock resistance and thermal shock fracture toughness for ATJ graphite. Thermal shock resistance and thermal shock fracture toughness of ATJ graphite are evaluated by using CO$_2$ laser irradiation technique. The laser heat source is irradiated at the center of specimens. Temperature distribution on the specimen surface is measured using the thermocouples of type K and C. SEM and radiographic images are used to observe the cracks which are formed at the thermal shock specimens.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.2
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• pp.136-142
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• 2008

Thermal management of a junction box of a passenger car has recently become more challenging due to its smaller size and larger current capacity. Thus, it is essential to perform the thermal optimization of a junction box in its design on an early stage of vehicle design. In this study, 3 dimensional CFD simulation with experimental measurement has been done to study for better thermal management of the junction box. First, the study of thermal characteristics of electric relays in the junction box has revealed that each surface of the relay has very different thermal resistance. In addition, an idea to install a cooling fan on the junction box has been studied and it was found that the forced cooling method was not effective on the system to keep the thermal resistance to the reasonable level of the junction box. Finally, the effect of external flows around the junction box on the temperatures of the relays, fuses, etc. has been studied and the result shows that the installation of the junction box at the proper place in an engine room can avoid any unnecessary overdesign in thermal management.

• Journal of ILASS-Korea
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• v.8 no.1
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• pp.23-28
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• 2003

When a cold HPSI (High Pressure Safety Injection) fluid associated with a design basis accident, such as LOCA (Loss of Coolant Accident), enters the cold legs of a stagnated primary coolant loop, thermal stratification phenomena may arise due to incomplete mixing. If the stratified flow enters a reactor pressure vessel downcomer, severe thermal stresses are created in a radiation embrittled vessel wall by local overcooling. Previous thermal-mixing analyses have assumed that the thermal stratification phenomena generated in stagnated loop of a partially stagnated collant loop are neutralized in the vessel downcomer by strong flow from unstagnated loop. On the basis of these reasons, this paper presents the thermal-mixing analysis results in order to identify the fact that the cold plume generated in the vessel downcomer due to the thermal stratification phenomena of the stagnated loop is affected by the strong flow of the unstagnated loop.

• Journal of the Korean Society of Clothing and Textiles
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• v.17 no.3
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• pp.470-474
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• 1993

This study carried out to get some fundamental data for designing lightweight bedding. In This study, the wool blanket, polyester/cotton blended blanket and down quilt were manufactured with a varied materials, structural factors such as yam count, fabric density respectivelyarn. And also, the thermal insulation value of the bedding were measured by warmth retaining tester. In addition, this paper examines the influence of varying materials, structural factors and blanket layers on the thermal insulation effect of the bedding. The main results obtained from this study are as follow : 1. The design of lightweight blankets make an attempting with a varying materials and structural factors such as yam count, fabric densityarn. 2. Almost, the design of lightweight blankets for polyester/cotton blended blanket and down quilt make an attempting without reduction in thermal insulation values. 3. The 6 layers of blanket have less thermal insulation value than the 6 times of blanket for under a layer have. About 27~32% decrease is observed in thermal insulation value of blanket for under 6 layer. 4. The thermal insulation value and areal weight of blankets have a positive relation between the thermal insulation value(Y) and areal weight(X) is based on the following equation. wool blanket : Y = 1.0850X + 0.4188 (r = 0.9992) PIC blended blanket : Y = 0.8845X + 0.3034 (r = 0.9999)

• The KSFM Journal of Fluid Machinery
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• v.10 no.5
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• pp.20-26
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• 2007

Some gate valves are susceptible to pressure locking and thermal binding which prevent the safety function. The safety related gate valves susceptible to pressure locking and thermal binding shall be identified and taken preventive actions to ensure the safety function. The identification of the gate valves susceptible to pressure locking and thermal binding needs the evaluation of system design, valve and piping arrangement, test requirements, and operating conditions. Application of preventive methods should consider the system safety function, applicability, effectiveness, interface with system design, and cost. The selection procedure of valves susceptible to pressure locking and thermal binding can be effectively used in industry including nuclear power plants. In order to prevent the pressure locking, the hole can be drilled through the one disc of upstream side or down stream and the external equalizing line can be installed from bonnet to downstream or upstream. The double disc parallel seat valve type can be used instead of flexible wedge gate valve to prevent the thermal binding. The identification of gate valves susceptible to pressure locking and thermal binding, and preventive actions will meet the regulatory requirements and enhance the availability and safety of plants.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.12
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• pp.2276-2280
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• 2008

In this paper, we present thermal dependancy of LED package element by changing temperature of MCPCB for design high efficiency LED lamp, and confirmed influence of LED chip against temperature with analysis of thermal resistance and thermal capacitance. As increasing temperature, WPOs were decreased from 25 to 22.5 [%] and optical power were also decreased. that is decreased reason of optical power that forward voltage was declined by decrease of energy bandgap. Therefore optical power by temperature of MCPCB should consider to design lamp for street light and security light. Moreover, compensation from declined optical efficiency is demanded when LED package is composed. Also, thermal resistances from chip to metal PCB were decreased from 12.18 to 10.8[$^{\circ}C/W$] by changing temperature. Among the thermal resistances, the thermal resistance form chip to die attachment was decreased from 2.87 to 2.5[$^{\circ}C/W$] and was decreased 0.72[$^{\circ}C/W$] in Heat Slug by chaning temperature. Therefore, because of thermal resistance gap in chip and heat slug, reliability and endurance of high power LED affect by increasing non-radiative recombination in chip from heat.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2171-2174
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• 2008

The design of thermal radiation shield cooled by a cryocooler is presented. This study is motivated mainly by our recent development of prototype superconducting magnet system for the Cyclotron K120. The superconducting magnet system is composed of the magnet cryostat, transfer line and supply cryostat. In order to minimize thermal radiation load, the superconducting coil form in the magnet cryostat is enclosed by the thermal radiation shield which is thermally connected to the first-stage cold head of a two-stage cryocooler in the supply cryostat. Since the supply cryostat is located far from the magnet cryostat large temperature gradient along the thermal shield is unavoidable. In this paper, the thermal radiation shield is optimized to minimize temperature gradient with taking into account the cryogenic load, system structure and electrical load. The effect of heat source from thermal conduction through mechanical supports on the temperature distribution of thermal radiation shield is also discussed.