• Title/Summary/Keyword: Thermal deformation processing

Search Result 89, Processing Time 0.027 seconds

The Crack Behavior in the Planar Solid Oxide Fuel Cell under the Fabricating and Operating Temperature (제조 및 작동온도에서 평판형 고체연료전지에 발생한 균열 거동)

  • Park, Cheol Jun;Kwon, Oh Heon;Kang, Ji Woong
    • Journal of the Korean Society of Safety
    • /
    • v.29 no.4
    • /
    • pp.34-41
    • /
    • 2014
  • The goal of this study is to investigate some crack behaviors which affect the crack propagation angle at the planar solid oxide fuel cell with cracks under the fabricating and operating temperature and analyze the stresses by 3 steps processing on the solid oxide fuel cell. Currently, there are lots of researches of the performance improvement for fuel cells, and also for the more powerful efficiency. However, the planar solid oxide fuel cell has demerits which the electrode materials have much brittle properties and the thermal condition during the operating process. It brings some problems which have lower reliability owing to the deformation and cracks from the thermal expansion differences between the electrolyte, cathode and anode electrodes. Especially the crack in the corner of the electrodes gives rise to the fracture and deterioration of the fuel cells. Thus it is important to evaluate the behavior of the cracks in the solid oxide fuel cell for the performance and safety operation. From the results, we showed the stress distributions from the cathode to the anode and the effects of the edge crack in the electrolyte and the slant crack in the anode. Futhermore the crack propagation angle was expected according to the crack length and slant angle and the variation of the stress intensity factors for the each fracture mode was shown.

Magnetism of Nanocomposite Quartz Powder by use of MCR Method

  • Soh, Deawha;Lim, Byoungjae;Soh, Hyunjun;Mofa, N.N.;Ketegenov, T.A.;Mansurov, Z.A.
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2004.05a
    • /
    • pp.113-116
    • /
    • 2004
  • The materials showing high structure dispersion with functional properties were developed on the quartz base and those were obtained by mechano-chemical reaction technology. Depending on the processing conditions and subsequent applications the materials produced by mechano-chemical reaction show concurrently magnetic, dielectric and electrical properties. The obtained magnetic-electrical powders classified by aggregate complex of their features as segnetomagnetics, containing a dielectric material as a carrying nucleus, particularly the quartz on that surface one or more layers of different compounds were synthesized having thickness up to 10~50 nm showing magnetic, electrical properties and others. The similarity of the structure of surface layers of quartz particles subjected to mechano-chemical processing and nano-structure cluspol (clusters in a polymer matrics) material was also confirmed by the fact that the characteristics of ferromagnetic quartz of insulating nano-composite powder were changed with time, after its preparing process was completed. The magnetic permeability of the sample was decreasing within first two months down by 15~20 %. Then, the magnetic characteristics were almost stabilized steadily and continuously. The observed changes were related with defective structure of the particles, elastic stress relief, and changes of electron density and magnetic moment in deformation zones. This process of stabilization of the investigated properties could be intensified by the thermal annealing heat treatment in short time period of the nano-composite quartz powders at the temperature ranges of 100~15$0^{\circ}C$.

  • PDF

Recent Trends in Low-Temperature Solution-Based Flexible Organic Synaptic Transistors Fabrication Processing (저온 용액 기반 유연 유기 시냅스 트랜지스터 제작 공정의 최근 연구 동향)

  • Kwanghoon Kim;Eunho Lee;Daesuk Bang
    • Journal of Adhesion and Interface
    • /
    • v.25 no.2
    • /
    • pp.43-49
    • /
    • 2024
  • In recent years, the flexible organic synaptic transistor (FOST) has garnered attention for its flexibility, biocompatibility, ease of processability, and reduced complexity, which arise from using organic semiconductors as channel layers. These transistors can emulate the plasticity of the human brain with a simpler structure and lower fabrication costs compared to conventional inorganic synaptic devices. This makes them suitable for applications in next-generation wearable devices and soft robotics technologies. In FOST, the organic substrate is sensitive to the device preparation temperature; high-temperature treatment processes can cause thermal deformation of the organic substrate. Therefore, low-temperature solution-based processing techniques are essential for fabricating high-performance devices. This review summarizes the current research status of low-temperature solution-based FOST devices and presents the problems and challenges that need to be addressed.

Development of Uniform Press for Wafer Bonder (웨이퍼 본딩 장비용 Uniform Press 개발)

  • Lee, Chang-Woo;Ha, Tae-Ho;Lee, Jae-Hak;Kim, Seung-Man;Kim, Yong-Jin;Kim, Dong-Hoon
    • Transactions of the KSME C: Technology and Education
    • /
    • v.3 no.4
    • /
    • pp.265-271
    • /
    • 2015
  • The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

Experimental and FE Analyses of Hot Curvature-Forming for Aluminum Thick Plate Using Grid-Typed Hybrid Die (격자형 하이브리드 금형에 의한 열간 알루미늄후판 곡면성형공정해석 및 실험)

  • Lee, I.K.;Lee, J.M.;Son, Y.K.;Lee, C.J.;Kim, B.M.
    • Transactions of Materials Processing
    • /
    • v.20 no.4
    • /
    • pp.316-323
    • /
    • 2011
  • The hot curvature-forming of large aluminum thick plate using a grid-typed hybrid die is a process for the production of a spherical LNG tank. Many variables such as the initial die surface quality, grid size, grid thickness, size of blank plate and cooling line design, control the success of the process. In addition, the plate used in this process is generally larger than $10{\times}10m$ in size. Thus, it is very difficult to predict the surface characteristics of the plate during forming and to measure the different parameters due to the high cost of the experiments. In order to optimize the process design for the grid-type die, the development of an analytical method to predict the surface characteristics of the final product in hot curvature-forming is needed. This paper described the development of the method and procedures for FE simulations of the hot curvature-forming process, including hot forming, air flow, cooling, and thermal deformation analyses. An experiment for a small scale model of the process was conducted to check the validity of the numerical method. The results showed that the curvature of the plate in the analysis agrees well with that of the experiment within 0.037 and 0.016% tolerance margins for its side and corner, respectively.

Analytical Study for the Prediction of Mechanical Properties of a Fiber Metal Laminate Considering Residual Stress (잔류응력을 고려한 섬유 금속 적층판의 기계적 물성치 예측에 관한 이론적 연구)

  • Kang, D.S.;Lee, B.E.;Park, E.T.;Kim, J.;Kang, B.S.;Song, W.J.
    • Transactions of Materials Processing
    • /
    • v.23 no.5
    • /
    • pp.289-296
    • /
    • 2014
  • Uniaxial tensile tests were conducted to accurately evaluate the in-plane mechanical properties of fiber metal laminates (FMLs). The FMLs in the current study are comprised of a layer of self-reinforced polypropylene (SRPP) sandwiched between two layers of aluminum alloy 5052-H34. The nonlinear tensile behavior of the FMLs under in-plane loading conditions was investigated using both numerical simulations and a theoretical analysis. The numerical simulation was based on finite element modeling using the ABAQUS/Explicit code and the theoretical constitutive model was based on the volume fraction approach using the rule of mixture and a modification of the classical lamination theory, which incorporates the elastic-plastic behavior of the aluminum alloy and the SRPP. The simulations and the model are used to predict the inplane mechanical properties such as stress-strain response and deformation behavior of the FMLs. In addition, a post-stretching process is used to reduce the thermal residual stresses before uniaxial tensile testing of the FMLs. Through comparison of both the numerical simulations and the theoretical analysis with the experimental results, it is concluded that the numerical simulation model and the theoretical approach can describe with sufficient accuracy the actual tensile stress-strain behavior of the FMLs.

Enhancement of Cu Wire Bondability by Increasing the Surface Roughness of Capillary (표면 요철이 발달된 캐필러리 적용에 따른 Cu 와이어의 본딩 특성)

  • Lee, Jong-Hyun;Kim, Ju-Hyung;Kang, Hong-Jeon;Kim, Hak-Bum;Moon, Jung-Tak;Riu, Doh-Hyung
    • Korean Journal of Metals and Materials
    • /
    • v.50 no.12
    • /
    • pp.913-920
    • /
    • 2012
  • In spite of some problems in processability and bondability, Au wires in the microelectronics industry are gradually being replaced by copper wires to reduce the cost of raw material. In this article, the effects of surface roughness enhanced capillaries on thermosonic Cu wire bonding were evaluated. The roughness-enhanced zirconia toughened alumina (ZTA) capillaries were fabricated via a thermal grooving technique. As a result, the shear bond strength of first bonds (ball bonds) bonded using the roughness-enhanced capillary was enhanced by 15% as compared with that of normal bonds due to more effective plastic deformation and flow of a Cu ball. In the pull-out test of second bonds (stitch bonds), processed at two limit conditions on combinations of process parameters, the bond strength of bonds formed using the roughness-enhanced capillary also resulted in values higher by 55.5% than that of normal bonds because of the increase in the bonding area, indicating the expansion of a processing window for Cu wire bonding. These results suggest that the adoption of roughness-enhanced capillaries is a promising approach for enhancing processability and bondability in Cu wire bonding.

Implementation of Low Frequency Welding Pre-heating System Using Induction Heating (유도가열 기법을 이용한 저주파 용접예열 시스템 구현)

  • Yang, Juyeong;Kim, Soochan;Park, Junmo
    • Journal of the Institute of Convergence Signal Processing
    • /
    • v.19 no.2
    • /
    • pp.61-67
    • /
    • 2018
  • Welding preheating means that the surface of the base material to which the metal is welded before the main welding is heated to a constant temperature. It prevents the cracks of the adjacent influences such as reduction of material hardening degree by controlling the cooling rate, suppression of segregation of impurities, prevention of thermal deformation, and moisture removal. For this reason, it is a necessary operation for high quality welding. Induction heating is an efficient heating method that converts electric energy into heat energy by applying electromagnetic induction phenomenon. Compared with combustion heat generated by gas and liquid, it is clean, stable, and economical as well as rapid heating. It can be heated regardless of the shape, depth and material of the heating body by modifying the shape of the frequency and the coil with a simple structure. In this paper, we implemented a low frequency welding preheating system using induction heating technique and observed the temperature changes of coil resistance, inductance and automotive transmission parts according to the height of each transmission in winding coil for three kinds of automotive transmission parts. We confirmed that the change of current is a very important factor in the low frequency heating.

High Strength Nanostructured Metastable Alloys

  • Eckert, Jurgen;Bartusch, Birgit;Schurack, Frank;He, Guo;Schultz, Ludwig
    • Journal of Powder Materials
    • /
    • v.9 no.6
    • /
    • pp.394-408
    • /
    • 2002
  • Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.