• Journal of Information Display
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• v.4 no.1
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• pp.17-23
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• 2003

A thermoset type anisotropic conductive adhesive film (ACAF) comprising epoxy resin and natural butyl rubber (NBR) as the binder, micro-encapsulated imidazole as the curing agent, and Ni/Au coated polymer bead as a conductive particle has been studied. These films have been prepared to respond to requirements such as improved contact resistance, current status less of than 60 ${\mu}m$ and reliability. These films can also be used for connection between the ITO glass for LCD panel and the flexible circuit board. The curing conditions for the connection were 40, 20 and 15 seconds at 150, 170 and 190 $^{\circ}C$, respectively. The initial contact resistance and adhesion strength were 0.5 ${\Omega}/square$ and 0.4 kg/cm under the condition of 30 kgf/$^{cm}^2}$, respectively. After completing one thousand thermal shock cycling tests between -15 $^{\circ}C$ and 100 $^{\circ}C$, the contact resistance was maintained below 0.7 ${\Omega}/square$. Durability against high temperature (80$^{\circ}C$) and high humidity (85 % RH) was also tested to confirm long-term stability (1000 hrs) of the conduction.

• Polymer(Korea)
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• v.28 no.5
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• pp.391-396
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• 2004

In order to overcome drawbacks in the conventional preparation of epoxy/silica nanocomposites, such as formation of micro voids and dimensional instability caused by evolution of volatile by-products during curing reaction, a novel preparation method using Si-N precursor has been proposed. When prepared through in-situ reaction of epoxy curing reaction with sol-gel reaction of Si-N precursor, methyltripiperidinylsilane (MTPS) which does not produce by-products during reaction, epoxy/silica nanocomposites of extremely even dispersion of inorganic phase could be successfully prepared, resulting in high enhancement of mechanical and thermal properties as well as outstanding transparency.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• Elastomers and Composites
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• v.37 no.4
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• pp.234-243
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• 2002

A general scheme of a rubber structure is proposed. Using the thermomechanical method(TMA), some changes in the molecular and topological structures for uncured and cured, and unfilled and filled rubbers during processing are shown. In our investigations as region it is understood a complex structure, which is expressed at the thermomechanical curve(TMC) as a zone differed from others in thermal expansion properties. This zone is between the noticed temperatures of relaxation transitions, usually on the level like those determined by DMTA at 1Hz. These regions, which shares, are not stable, and differ in molecular-weight distribution(MWD) of chain fragments between the junctions. Differences in dynamics of the formation of the molecular and topological structures of a vulcanizate are dependent on the rubber formulation, mixing technology and curing time. Some of characteristics of these regions correlate with mechanical properties of vulcanizates what is shown for NR rubbers containing ENR or CPE as a polymeric additive. It is well known that the state of order influences diffusivity of low-molecular substances into the polymer matrix. Because of this, the two topological amorphous regions should influence the distribution of the ingredients and resulting in rubber compounds' heterogeneity, and related properties of cured rubber. Investigation of this problem is expected to be, in the future, one of the essential factors in determining further improvement of polymeric materials properties by compounding with additives and in reprocessing of rubber scrap.

• Journal of Korean Neurosurgical Society
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• v.30 no.3
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• pp.272-277
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• 2001

Objective : Polymethylmethacrylate(PMMA) is often used to reconstruct the spine after total corpectomy, but the exothermic curing of liquid PMMA poses a risk of thermal injury to the spinal cord. The purposes of this study are to analyze the heat blocking effect of pre-polymerized PMMA sheet in the corpectomy model and to establish the minimal thickness of PMMA sheet to protect the spinal cord from the thermal injury during PMMA cementation of vertebral body. Materials & Methods : An experimental fixture was fabricated with dimensions similar to those of a T12 corpectomy defect. Sixty milliliters of liquid PMMA were poured into the fixture, and temperature recordings were obtained at the center of the curing PMMA mass and on the undersurface(representing the spinal cord surface) of a prepolymerized PMMA sheet of variable thickness(group 1 : 0mm, group 2 : 5mm, or group 3 : 8mm). Six replicates were tested for each barrier thickness group. Results : Consistent temperatures($106.8{\pm}3.9^{\circ}C$) at center of the curing PMMA mass in eighteen experiments confirmed the reproducibility of the experimental fixture. Peak temperatures on the spinal cord surface were $47.3^{\circ}C$ in group 2, and $43.3^{\circ}C$ in group 3, compared with $60.0^{\circ}C$ in group 1(p<0.00005). So pre-polymerized PMMA provided statistically significant protection from heat transfer. The difference of peak temperature between theoretical and experimental value was less than 1%, while the predicted time was within 35% of experimental values. The data from the theoretical model indicate that a 10mm barrier of PMMA should protect the spinal cord from temperatures greater than $39^{\circ}C$(the threshold for thermal injury in the spinal cord). Conclusion : These results suggest that pre-polymerized PMMA sheet of 10mm thickness may protect the spinal cord from the thermal injury during PMMA reconstruction of vertebral body.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of Pharmaceutical Investigation
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• v.41 no.2
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• pp.67-73
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• 2011

Ion exchange resins can be one of the good carriers for sustained drug release. However, the sustained release may not be enough only with themselves and hence film coating with rate controlling polymers can be applied to have a further effect on the drug release. Due to the environmental and economic issues of organic solvent for the polymer coating, aqueous polymeric systems were selected to develop dosage forms. Among the many aqueous polymeric dispersions for the film coating, EC (ethylcellulose) based polymers such as Aquacoat$^{(R)}$ ECD and Surelease$^{(R)}$ were evaluated.A fluid-bed coating was applied as a processing method. The drug release rate was quite dependent on the coating level so the release rate could be modified easily by changing different levels of the coating. The drug release rate in the Aquacoat$^{(R)}$ coated resin particles was strongly dependent on curing, which is a thermal treatment to make homogeneous films and circumvent drug release changes during storage. After dissolution test using the compressed tablets in which the coated resin particles are contained, inhomogeneous coating and even pores could be observed showing that the mechanical properties of EC were not resistant to granulation and compaction process. However, when tablets were prepared in different batches, the release profiles were almost identical showing the feasibility of the coated resin particle as incorporated into the tablet formulation.

• Composites Research
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• v.26 no.5
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• pp.322-327
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• 2013

Carbon fiber-reinforced SiC matrix composites have good oxidation resistance and thermal shock resistance. These properties have allowed the composites to be applied to high-temperature structures. In this study, $C_f/SiC$ composites were fabricated via precursor infiltration and pyrolysis (PIP) process, including liquid phase infiltration and chemical vapor curing using cyclohexene. The final $C_f/SiC$ composites, which have gone through the PIP process five times, showed a density of $1.79g/cm^3$, as compared to a density of $0.43g/cm^3$ for pre-densified bare carbon fiber preform. As for the oxidation resistance characteristics, the weight of $C_f/SiC$ composite was maintained at 81% at $1400^{\circ}C$ in air for 6 hours. Chemical vapor curing (CVC) using cyclohexene has shown to be an effective method to achieve high densification, leading to increased oxidation resistance.

• Computers and Concrete
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• v.19 no.5
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• pp.443-449
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• 2017

Taking high geothermal tunnels as background, the deformation of concrete for shotcrete use was studied by simulating hot-humid and hot-dry environments in a laboratory. The research is made up by two parts, one is the influence of two kinds of high geothermal environments on the deformation of shotcrete, and the other is the shrinkage inhibited effect of fiber materials (steel fibers, polypropylene fibers, and the mixture of both) on the concrete in hot-dry environments. The research results show that: (1) in hot and humid environments, wet expansion and thermal expansion happened on concrete, but the deformation is smooth throughout the whole curing age. (2) In hot and dry environments, the concrete suffers from shrinkage. The deformation obeys linear relationship with the natural logarithm of curing age in the first 28 days, and it becomes stable after the $28^{th}$ day. (3) The shrinkage of concrete in a hot and dry environment can be inhibited by adding fiber materials especially steel fibers, and it also obeys linear relationship with the natural logarithm of curing age before it becomes stable. However, compared with no-fiber condition, it takes 14 days, half of 28 days, to make the shrinkage become stable, and the shrinkage ratio of concrete at 180-day age decreases by 63.2% as well. (4) According to submicroscopic and microscopic analysis, there is great bond strength at the interface between steel fiber and concrete. The fiber meshes are formed in concrete by disorderly distributed fibers, which not only can effectively restrain the shrinkage, but also prevent the micro and macro cracks from extending.

• Polymer(Korea)
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• v.35 no.2
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• pp.183-188
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• 2011

Pentaerytritol triacrylate (PETA) was synthesized by a condensation reaction between pentaerytritol and acrylic acid. The highest yield of PETA was obtained when heptane was used as a solvent under the 1:4 mole ratio of pentaerytritol and acrylic acid. The 6-functional urethane acrylates(UA) were also synthesized by a condensation reaction between PETA and diisocyanate. Cured films were prepared from the mixtures of UA oligomer, reactive diluents and UV initiator to investigate their physical properties. The thermal stability of the aliphatic urethane acrylate was better than that of the aromatic urethane acrylate. The UA-2 showed good hardness and scratch resistance properties while the UA-l with a high degree of curing density exhibited a better chemical resistance. All the UA oligomers showed fairly good adhesion strengths but the other physical properties of UA-3 were poor due to its low curing density.