• 한국염색가공학회지
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• 제29권1호
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• pp.37-44
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• 2017

An issue of major concern in the utilization of laminated composites based epoxy resin is associated with the occurrence of delaminations or interlaminar cracks, which may be related to manufacturing defects or are induced in service by low-velocity impacts. A strong interfacial filament/brittle epoxy resin bonding can, however, be combined with the high fracture toughness of weak interfacial bonding, when the filaments are arranged to have alternate sections of shear stress. To improve this drawback of the epoxy resin, UV-thermal dual curable resin were developed. This paper presents UV-thermal dual curable resin which were prepared using epoxy acrylate oligomer, photoinitiators, a thermal-curing agent and thermoset epoxy resin. The UV curing behaviors and characteristics of UV-thermal dual curable epoxy resin were investigated using Photo-DSC, DMA and FTIR-ATR spectroscopy. The mechanical properties of UV-thermal dual curable epoxy resin impregnated CF prepreg by UV curable resin content were measured with Tensile, Flextural, ILSS and Sharpy impact test. The obtained results showed that UV curable resin content improves the epoxy toughness.

• 한국인쇄학회지
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• 제29권2호
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• pp.1-13
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• 2011

The recent spotlight on electronic touch-screen display, a rapid breakthrough in the information society is evolving. Touch panel input device such as a keyboard or mouse without the use of, the on-screen character or a specific location or object on the person's hand touches a particular feature to identify the location of a panel is to be handled. The touch screen on the touch panel is used in the Ag paste is used mostly for low-curable paste. The thermal-curing paste according to the drying process of thermal energy consumption and improve the working environment of organic solvents have problems. In this study, Ag paste used in the non-thermal curing friendly and cost-effective UV curable paste was prepared. Current commercially available thermal-curable binder, was used instead of the flow characteristics of UV-curable oligomers and monomers with functional groups to give a single conductive Ag paste with the addition of a pattern could be formed. Ag paste as a result, thermal-curing adhesive, hardness, resistance and excellent reproduction of fine patterns and was available with screen printing environmentally friendly could see its potential as a patterning technology.

• 한국정밀공학회지
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• 제17권2호
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• pp.130-136
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• 2000

Generally, the build-up printed circuit board manufactured by the sequential process with etching, plating, drilling etc. requires many types of equipments and lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing prototype in the developing stage. In this study, we introduce a screen printing technology to prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as the formation of liquid resin thin layer, the solidification by UV/IR light, and via filling with conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with to the conventional process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.475-476
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• 2012

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2010년도 추계학술발표논문집 1부
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• pp.478-481
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• 2010

Antimony doped tin oxide (ATO) nanoparticles were added as nanofillers to UV-curable polyester-acrylate (PEA) resin for coating to improve thermal, mechanical, and electrical properties. In this study, ATO nanoparticles were grafted by 3-glycidyloxypropyltrimethoxysilane and 3-methacryloxypropyltrimethoxysilane respectively to improve dispersion and interfacial adhesion. The physical properties and surface scratch hardness of the UV-curable nanocomposite coating were improved considerably by introducing the modified ATO nanoparticles.

• Journal of the Korean Wood Science and Technology
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• 제32권6호
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• pp.23-35
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• 2004

The goal of study was to investigate the influence of the acrylated urethane oligomer on mechanical properties, the chemical resistance and thermal resistance of the UV curable urethane acrylate coatings for fancy veneer overlayed plywood flooring. The pencil hardness and abrasion resistance of the coated fancy veneer overlayed plywood floorings increased with increasing the acrylate functionality of the acrylated urethane oligomer. In the case of the UV cured film containing hexa-functional acrylated aliphatic urethane oligomer, high discoloration of the coated fancy veneer overlayed plywood flooring was observed near the cracks at the beginning of the chemical treatment. In this study, it was found that the degradation of the UV cured film caused by an alkaline reagent was higher than that of the UV cured film caused by an acidic treatment.

• International Journal of Precision Engineering and Manufacturing
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• 제4권4호
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 추계학술대회 논문집
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• pp.485-486
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• 2012

• 한국응용과학기술학회지
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• 제29권1호
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• pp.141-148
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• 2012

본 연구에서는 초소수성 실리카 에어로겔을 이용하여 단열 성능을 갖는 투명 필름용 유/무기 복합 코팅물질을 제조하였다. 바인더 물질로 사용된 자외선 경화형 우레탄 아크릴레이트 수지와 에어로겔과의 상용성을 위해 계면활성제(Brij 56)를 이용하여 에어로겔의 표면을 개질하였다. 개질된 에어로겔을 고분자 수지와 복합화한 코팅 용액을 폴리카보네이트 기지재에 코팅한 후 자외선경화를 통해 코팅필름을 제조하였다. 에어로겔이 10 vol% 함량으로 첨가되었을 때, 코팅필름의 단열성능은 측정된 열전도도 기준으로 순수 기지재 대비 28% 정도로 향상되었다. 또한, 코팅필름의 광투과율은 에어로겔이 50 vol%로 과량 첨가된 경우에도 80% 이상 높은 수준을 유지하였으며, 우수한 접착성(5B) 및 연필 경도(4H)를 보여주었다.

• Macromolecular Research
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• 제16권2호
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• pp.128-133
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• 2008

Several dual-curable acrylic pressure-sensitive adhesives (PSA) were synthesized by the radical polymerization of acrylic monomers containing benzophenone, hydroxyl, and alkyl groups. The optimum extent of UV-induced cure was determined by varying the content of the benzophenone groups (the photoinitiator) from 0.5 to 1.5 wt%. The weight average molecular weight of the polymers obtained ranged from 300,000 to 700,000 amu. The coated pressure-sensitive adhesives were cured either by short UV exposure to induce the grafting of acrylic polymers, or by heating for 6 hat $60^{\circ}C$ to promote the reactions between the polyisocyanates and hydroxyl groups. The dual-curing behavior was determined by monitoring both processes quantitatively by infrared spectroscopy. The developed dual-curable acrylic pressure-sensitive adhesives were found to compensate for the limitations in UV-induced curing of thick coatings.