• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.5
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• pp.402-409
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• 2006

For the design of a liquid direct contact cooling system, thermal and hydraulic analysis has been carried out. Well-known Zukauskas correlations are used to estimate the Nusselt number between the liquid refrigerant columns and the inlet airflow. The inlet air velocity is set at a typical value used in an actual showcase. For a constant column number, the best nozzle arrangement is determined for the maximum heat transfer. Heat transfer increases as the transverse pitch of the refrigerant column decreases. Among all the cases dealt with in the present study, the staggered arrangement with 140-columns of $14{\times}10$ shows the best thermal peformance and the expected temperature drop is $27.8^{\circ}C$. The effect of downstream refrigerant columns on the overall thermal performance is investigated as well.

• Proceedings of the IEEK Conference
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• 2001.06b
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• pp.213-216
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• 2001

The use of a thin film of indium between the ITO and the $n^{+}$-InP contact layers for InP/InGaAs HPTs was studied without degrading its excellent optical transmittance properties. ITO/$n^{+}$-InP ohmic contact was successfully achieved by the deposition of Indium and thermal annealing. The specific contact resistance of about 6.6$\times$$10^{-4}$$\Omega\textrm{cm}^2$ was measured by use of the transmission line method (TLM). However, as the thermal annealing was just performed to ITO/$n^{+}$-InP contact without the deposition of Indium between ITO and $n^{+}$-InP, it exhibited schottky characteristics. In the applications, the DC characteristics of InP/InGaAs HPTs with ITO emitter contacts was compared with that of InP/InGaAs HBTs with the opaque emitter contacts.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.451-452
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• 2010

• Journal of the Korean Society of Safety
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• v.27 no.3
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• pp.36-41
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• 2012

Electrical Connections often cause fires due to poor contact. Occurrence rate of these fires tends to increase annually. The reason why poor contacts occur is often because it is the low mechanical pressure at the contact points. A typical connection method using mechanical pressure is a screw terminal type. This study reviewed these poor contact cases in the screw terminals. In order to get reproduction of such cases, two types of experiments were conducted. the first one was conducted under the normal contact condition, and the other one was conducted under the poor contact condition that screw terminal of breaker was loosen and did not meet the requirements of toque value. In both types of experiments, compulsory vibration was adopted as a variable to aggravate poor contacts. Each of various current values(4.5A, 9.0A, 13.5A) is input. In these experiments, relationships of a contact, electrical signal such as current and electric pulse by ZCT and thermal characteristics according to vibration effect are analyzed. The suggested data and results in this study provide the useful resources helping to investigate fires due to poor contact, and they develop the detector for poor contact and finally reduce the electrical fire occurrence rate.

• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.5
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• pp.145-154
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• 2006

Each part of drum brake system is loaded by continual mechanical force and thermal force every time of braking, so enough strength and stability are required. Thermal characteristic is one of the important factors in drum brake systems design. This paper presents the thermal performance such as temperature distribution and thermal contact stress of drum brake system considering several braking patterns; 80th heat braking test mode, heat fade braking test mode, general road mode, steep slope road mode and off road mode. Transient heat transfer analysis and Thermo elastic contact analysis is executed to obtain the temperature distribution, and to evaluate thermal stress of drum brake by using ABAQUS/Standard code. This procedure of analysis can effectively be used to improve the quality problem of brake system and to get design guideline of the new product.

• Journal of Applied Reliability
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• v.17 no.1
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• pp.78-82
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• 2017

Purpose: The purpose of this study is to evaluate failure characteristic and mechanism of four commercial water-repellent coatings for elevated temperature machinery applications. Method: Thermal degradation was performed for up to 64 thermal cycles. 1 cycle consists of 15 minute holding at 523K under 300rpm revolution and 15 minute-natural cooling. Contact angle was measured and microstructure of the coating layer was observed by using a scanning electron microscope. Results: Four kinds of commercial repellent coating showed hydrophobic or super-hydrophobic property implying that all coatings are suitable for room temperature application. Contact angle of three kinds of commercial coatings decreased rapidly after thermal exposure, while only one specimen having hydrophobic surface showed extremely slow degradation. Conclusion: Observed decrease in contact angle of the coatings were attributed to formation of macro-sized pores and disappearance of micro-protrusion during thermal exposure. Optimum water-repellent coating needs to be selected under the consideration of initial contact angle as sell as service temperature.

• Journal of Surface Science and Engineering
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• v.55 no.6
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• pp.408-416
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• 2022

In this study, the effect of Au-Sn alloy coating on reliability of electrical contacts was investigated via comparison with Au-Co alloy coating. The results show that Au-Sn alloy exhibited lower contact resistance and higher solder spreadability than those of Au-Co alloy after thermal aging. In the case of Au-Co alloy plating, the underlying Ni element diffused into Au-Co layer to form Ni oxides on surface during thermal aging, leading to increased contact resistance and decreased solder spreadability. Meanwhile, for Au-Sn alloy plating, Au-Ni-Sn metallic compound was formed at the interface between Au-Sn layer and underlying Ni layer. This compound acted as a diffusion barrier, thereby inhibiting the diffusion of Ni to Au-Sn layer during thermal aging. Consequently, Au-Sn alloy layer showed better contact reliability than that of Au-Co alloy layer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1391-1398
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• 2004

Railway wheels and axles belong to the most critical components in railway vehicles. The service conditions of railway vehicles became more severe in recent years due to the increase of speed. Therefore, a more precise evaluation of wheelset life and safety has been requested. Wheel/rail contact fatigue and thermal cracks due to braking heat are two main mechanisms of the railway wheel failure. In this paper, an evaluation procedure for the contact fatigue life of railway wheel is proposed. One of the main sources of the contact zone failure is the residual stress. The residual stress on wheel is formed during the manufacturing process which includes a heat treatment, and then is changed by contact stress developed by wheel/rail contact and thermal stress induced by braking. Also, the cyclic stress history for fatigue analysis is determined by applying finite elements analysis for the moving contact load. The objective of this paper is to estimate fatigue life by considering residual stress due to heat treatment, braking and repeated contact load, respectively.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.9
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• pp.78-88
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• 1994

The electrical properties of TiM/TiSi$_{2}$ bilayer formed by rapid thermal anneal in NH$_{3}$ ambient after the Ti film is deposited on silicon cubstrate are investigated. N$^{+}$ contact resistance slightly increases with increasing annealing temperature with P$^{+}$ contact resistance decreases. The contact resistance of N$^{+}$ contance was less than 24[.OMEGA.] but P$^{+}$ thatn that of N$^{+}$ contact but the leakage current indicates degradation of the contact at high annealing temperature for both N$^{+}$ and contacts. The leakage current of N$^{+}$ Junction was less than 0.06[fA/${\mu}m^{2}$] but P$^{+}$ contact was 0.11-0.15[fA/${\mu}m^{2}$]. The junction breakdown voltage for N$^{+}$ junction remains contant with increasing annealing temperature while P$^{+}$ junction slightly decreases. The Electrical properties of a two step annealing are better than that of one step annealing. The Tin/TiSi$_{2}$ bilayer formed by RTA in NH$_{3}$ ambient reveals good electrical properties to be applicable at ULSI contact.

• Tribology and Lubricants
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• v.39 no.1
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• pp.8-12
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• 2023

This study presents a molecular simulation of adhesion control between carbon nanotube (CNT) and Ag thin film deposited on silicon substrate. Rough and flat Ag thin film models were prepared to investigate the effect of surface roughness on adhesion force. Heat treatment was applied to the models to modify the adhesion characteristics of the Ag/CNT interface based on thermal wetting. Simulation results showed that the heat treatment altered the Ag thin film morphology by thermal wetting, causing an increase in contact area of Ag/CNT interface and the adhesion force for both the flat and rough models changed. Despite the increase in contact area, the adhesion force of flat Ag/CNT interface decreased after the heat treatment because of plastic deformation of the Ag thin film. The result suggests that internal stress of the CNT induced by the substrate deformation contributes in reduction of adhesion. Contrarily, heat treatment to the rough model increases adhesion force because of the expanded contact area. The contact area is speculated to be more influential to the adhesion force rather than the internal stress of the CNT on the rough Ag thin film, because the CNT on the rough model contains internal stress regardless of the heat treatment. Therefore, as demonstrated by simulation results, the heat treatment can prevent delamination or wear of CNT coating on a rough metallic substrate by thermal wetting phenomena.