• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.53-53
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• 2018

Thermoelectric materials can convert directly waste heat to electricity and vice versa. The improvement of the thermoelectric efficiency strongly depends on the dimensionless figure of merit, $ZT=S^2{\sigma}T/{\kappa}$, where S is the Seebeck coefficient, ${\sigma}$ is the electrical conductivity, T is the absolute temperature, and ${\kappa}$ is the thermal conductivity. The thermal conductivity consists of the electronic contribution (${\kappa}_e$) and phonon contribution (${\kappa}_{ph}$). It is very challenge to increase the power factor, $S^2{\sigma}$ and to reduce the thermal conductivity simultaneously because the power factor and electronic thermal conductivity are coupled. One strategy is to decrease the phonon thermal conductivity. The phonon thermal conductivity can be decreased by controlling the grain size and structural defects such as dislocations and twinning. In order to achieve enhancements in thermoelectric efficiency, microstructures that can form numerous interfaces have been investigated intensively for controlling the transport of charge carriers and heat carrying phonons. In this presentation, we report the heterogeneous microstructure of $Mg_2Si_{0.6}Sn_{0.4}$ thermoelectric materials and investigation of its influence on thermoelectric properties.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2182-2187
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• 2007

The relative contributions of phonon and electron to the thermal conductivity of silicon film with varying doping density are evaluated from the modified electron-phonon interaction model, which is applicable to the micro/nanoscale simulation of energy transport between energy carriers. The thermal conductivities of intrinsic silicon layer thicknesses from 20 nm to 500 nm are calculated and extended to the variation in n-type doping densities from 1.0 ${\times}$ $10^{18}$ to 5.0 ${\times}$ $10^{20}$ $cm^{-3}$, which agree well with the experimental data and theoretical model. From simulation results, the phonon and electron contributions to thermal conductivity are extracted. The electron contribution in the silicon is found to be not negligible above $10^{19}$ $cm^{-3}$, which can be classified as semimetal or metal by the value of its electrical resistivity at room temperature. The thermal conductivity due to electron is about 57.2% of the total thermal conductivity at doping concentration 5.0 ${\times}$ $10^{20}$ $cm^{-3}$ and silicon film thickness 100 nm.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.8
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• pp.1165-1173
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• 2003

The effects of (1) phonon dispersion on thermal conductivity model and (2) differentiation of group velocity and phase velocity are examined for germanium. The results show drastic change of thermal conductivity regardless of the same relaxation time model. Also the contribution of transverse acoustic (TA) phonon and longitudinal acoustic (LA) phonon on the thermal conductivity at high temperatures is reassessed by considering more rigorous dispersion model. Holland model, which is commonly used for modeling thermal conductivity, underestimates the scattering rate for TA phonon at high frequency. This leads the conclusion that TA is dominant heat transfer mode at high temperatures. But according to the rigorous consideration of phonon dispersion, the reduction of thermal conductivity is much larger than the estimation of Holland model, thus the TA at high frequency is expected to be no more dominant heat transfer mode. Another heat transfer mechanism may exist at high temperatures. Two possible explanations we the roles of (1) Umklapp scattering of LA phonon at high frequency and (2) optical phonon.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1627-1632
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• 2003

The effect of (1) phonon dispersion in thermal conductivity model and (2) the differentiation of group velocity and phase velocity for Ge is examined. The results show drastic change of thermal conductivity regardless of using same relaxation time model. Also the contribution of transverse acoustic (TA) phonon and longitudinal acoustic (LA) phonon is changed by considering more rigorous dispersion model. Holland model underestimates the scattering rate for high frequency TA, so misleading conclusion, i.e. TA is dominant heat transfer mode at high temperature. But the actual reduction of thermal conductivity is much larger than the estimation by Holland model and high frequency TA is no more dominant heat transfer mode. Another heat transfer mechanism may exist for high temperature. Two possible explanations are (1) high frequency LA by Umklapp scattering and (2) optical phonon.

• Journal of the Korean Ceramic Society
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• v.45 no.12
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• pp.827-831
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• 2008

Spark plasma sintering (SPS) of AlN ceramics were carried out with ${Y_2}{O_3}$ as sintering additive at a sintering temperature $1,550{\sim}1,700^{\circ}C$. The effect of ${Y_2}{O_3}$ addition on sintering behavior and thermal conductivity of AlN ceramics was studied. ${Y_2}{O_3}$ added AlN showed higher densification rate than pure AlN noticeably, but the formation of yttrium aluminates phases by the solid-state reaction of ${Y_2}{O_3}$ and ${Al_2}{O_3}$ existed on AlN surface could delay the densification during the sintering process. The thermal conductivity of AlN specimens was promoted by the addition of ${Y_2}{O_3}$ up to 3 wt% in spite of the formation of YAG secondary phase in AlN grain boundaries because ${Y_2}{O_3}$ addition could reduced the oxygen contents in AlN lattice which is primary factor of thermal conductivity. However, the thermal conductivity rather decreased over 3 wt% addition because an immoderate formation of YAG phases in grain boundary could decrease thermal conductivity by a phonon scattering surpassing the contribution of ${Y_2}{O_3}$ addition.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.539-542
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• 2008

Recently, GMP(Glass Molding Press) process is mainly used to produce aspheric glass lenses. Because glass lens is heated at high temperature above Ty (yielding point) for forming glass, the quality of aspheric glass lens is deteriorated by residual stresses which are generated in a aspheric glass lens after forming. Before this study, as a fundamental study to develop forming conditions for progressive GMP process, compression, strain relaxation and thermal conductivity tests were carried out to obtain the visco-rigid plastic, the visco-elastic and thermal properties of K-PBK40 which is newly developed and applied for precision molding glass material, In this study, using the experimental results we obtained, a glass lens forming simulation in progressive GMP process was carried out and we could forecast the shape of deformed glass lenses and residual stresses contribution in the structure of deformed glass lenses after forming.

• Proceedings of the Korean Nuclear Society Conference
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• 1995.05a
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• pp.636-643
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• 1995

The accurate determination of the fuel-cladding gap conductance as functions of rod burnup and power level may be a key to the design and safety analysis of a reactor. The incorporation of a sophisticated gap conductance model into nuclear design code for computing thermal hydraulic feedback effect has not been implemented mainly because of computational inefficiency due to complicated behavior of gap conductance. To avoid the time-consuming iteration scheme, simplification of the gap conductance model is done for the current design model. The simplified model considers only the heat conductance contribution to the gap conductance. The simplification is made possible by direct consideration of the gas conductivity depending on the composition of constituent gases in the gap and the fuel-cladding gap size from computer simulation of representative power histories. The simplified gap conductance model is applied to the various fuel power histories and the predicted gap conductances are found to agree well with the results of the design model.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.6
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• pp.390-395
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• 2015

Molded insulation materials are widely used from large electric power transformer apparatus to small electrical machinery and apparatus. In this study, by adding MgO with the average particle of several tens nm and the excellent thermal conductivity into molding material, we improved the problem of insulation breakdown strength decrease according to rising temperature in overload or in bad environmental condition. We confirmed the life evaluation by using the insulation breakdown and inverse involution to investigate the electrical characteristics of nano-composites materials. By using a scanning electron microscope, it is confirmed that MgO power with the average particle size of several tens nm is distributed and the filler particles is uniformly distributed in the cross section of specimens. And it is confirmed that the insulation breakdown strength of Virgin specimens is rapidly decreased at the high temperature area. But it is confirmed that the insulation breakdown strength of specimens added MgO slow decreased by thermal properties in the high temperature area improved by the contribution of the heat radiation of MgO and the suppression of tree. The results of life prediction using inverse involution, it is confirmed that the life of nano-composites is improved by contribution of MgO according to the predicted insulation breakdown strength after 10 years of specimens added 5.0 wt% of MgO is increased about 2.9 times at RT, and 4.9 times at $100^{\circ}C$ than Virgin specimen, respectively.

• Journal of the Korean institute of surface engineering
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• v.45 no.1
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• pp.1-7
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• 2012

Multi-walled carbon nanotube (MWCNT) aluminum composite powders were deposited to form coatings using a high velocity oxygen fuel (HVOF) spraying process. High thermal energy and contact with atmospheric oxygen were supplied as the MWCNT aluminum composite particles were exposed to a gas flow field at high temperature (${\sim}3.0{\times}10^3$ K) during HVOF spraying. As a result, the particles underwent full or partial melting and rapid solidification due to the high thermal energy, and the exposure to oxygen induced the interfacial reaction of MWCNTs within the particle. The electrical and mechanical properties of MWCNT aluminum composite coatings were evaluated based on microstructure analysis. Electrical resistivity, elastic modulus, and micro-hardness, of the MWCNT aluminum composite coatings were higher than those of pure aluminum coating. The contribution of MWCNTs to the aluminum matrix can be attributed to their high electrical conductivity, dispersion hardening and anchoring effects. The relationship among the properties and the interaction of the MWCNTs with the aluminum matrix is discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.143.2-143.2
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• 2013

Nanomechanical and electrical properties of vanadium dioxide (VO2) thin films across thermal-driven phase transition are investigated with ultra-high vacuum atomic force microscopy. VO2 thin films have been deposited on the n-type heavily doped silicon wafer by pulsed laser deposition. X-ray diffraction reveals that it is textured polycrystalline with preferential orientation of (100) and (120) planes in monoclinic phase. As the temperature increases, the friction decreased at the temperature below the transition temperature, and then the friction increased as increasing temperature above the transition temperature. We attribute this observation to the combined effect of the thermal lubricity and electronic contribution in friction. Furthermore, the dependence of nanoscale conductance on the local pressure was indicated at the various temperatures, and the result was discussed in the view of pressure-induced metal-insulator transition.