• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2007년도 춘계학술대회B
• /
• pp.2044-2049
• /
• 2007

In order to predict the thermal radiation induced from alumina particle cloud in the plume of solid propellant motor, view factor method is applied to space shuttle SRB and the result is compared with that of monte carlo method. For this purpose, radiative characteristics, such as particle cloud temperature distribution, effective emissivity or emissive power of particle cloud are studied. In the case of effective emissivity, inverse wavelength method is applied and plume reduction characteristic length is used for emissive power distribution. As a result, thermal radiation using view factor method gives more conservative results than that using monte carlo method. So it can be used for preliminary design of thermal protection system.

• ETRI Journal
• /
• 제37권1호
• /
• pp.118-127
• /
• 2015

The power consumption of 3D many-core processors can be reduced, and the power delivery of such processors can be improved by introducing voltage island (VI) design using on-chip voltage regulators. With the dramatic growth in the number of cores that are integrated in a processor, however, it is infeasible to adopt per-core VI design. We propose a 3D many-core processor architecture that consists of multiple voltage clusters, where each has a set of cores that share an on-chip voltage regulator. Based on the architecture, the steady state temperature is analyzed so that the thermal characteristic of each voltage cluster is known. In the voltage scaling and task scheduling stages, the thermal characteristics and communication between cores is considered. The consideration of the thermal characteristics enables the proposed VI formation to reduce the total energy consumption, peak temperature, and temperature gradients in 3D many-core processors.

• 한국전기전자재료학회논문지
• /
• 제19권10호
• /
• pp.894-900
• /
• 2006

This paper reports the fabrication and characterization of $32{\times}32$ thermal cantilever array for nano-scaled memory device applications. The $32{\times}32$ thermal cantilever array with integrated tip heater has been fabricated with micro-electro-mechanical systems(MEMS) technology on silicon on insulator(SOI) wafer using 9 photo masking steps. All of single-level cantilevers(1,024 bits) have a p-n junction diode in order to eliminate any electrical cross-talk between adjacent cantilevers. Nonlinear electrical characteristic of fabricated thermal cantilever shows its own thermal heating mechanism. In addition, n-channel high-voltage MOSFET device is integrated on a wafer for embedding driver circuitry.

• 한국에너지공학회:학술대회논문집
• /
• 한국에너지공학회 1996년도 추계학술발표회 논문집
• /
• pp.171-175
• /
• 1996

thermal diode is a device which allows heat to be transferred in one direction by convection due to difference of density of fluid. Vertical plate for heat collection and radiation are of utility for design of thermal diode. It was considered the transient process of air filled thermal diode with guide vane which combined rectangular and parallelogrammic shape enclosures. Gr was kept constantly on 1.60$\times$1010 and error range was $\pm$2% during the experiment. Nu was examined when inclined angle are 15$^{\circ}$and 45$^{\circ}$and, also the experiments was carried out with and without guide vane as well. Specially, The effect of guide vane was sensitive. Developed region inclined angle, which is characteristic of system.

• 한국태양에너지학회:학술대회논문집
• /
• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
• /
• pp.170-175
• /
• 2009

Apartment housing block has been spreaded according to rapid economic development and urbanization in Korea. A parking lot is located at underground, artificial ground is inevitably created in apartment housing block. Artificial ground creates different thermal environment compared to natural ground, because the composition and coverage of artificial ground are diverse. In this study, the effect of the artificial ground on building thermal environment will be disscussed by simulation. Considering the result of simulation, surface albedo is more important for building energy performance. A purpose of this study is to examine how the characteristic of surface effect to thermal environment, and to develop design method for sustainable outdoor space.

• 한국정밀공학회지
• /
• 제27권12호
• /
• pp.119-124
• /
• 2010

In this paper, thermal stabilization design of a new concept compact machining center has been investigated. A new concept machining center adopted a new X-axis as a NC rotary table. A New concept compact machining center is designed that spindle speed, feed rate and NC Rotary table speed are 12,000rpm, 60m/min and 110rpm each. The analysis is carried out by using FEM simulation Solidworks, CATIA and ANSYS. This paper is focused on the thermal deformation according to temperature distribution of a spindle system and feed drive system. Heat transfer analysis is performed according to heat source and atmosphere contact parts. As a result, this compact machining center is designed as a thermally stable structure.

• Tribology and Lubricants
• /
• 제18권1호
• /
• pp.34-41
• /
• 2002

This paper presents the contact thermal behaviors of mechanical seals depending on the contacting face geometry. Using the finite element analysis, the temperature distribution, thermal distortion and leakage have been analyzed as functions of sealing gap and rotating speed of the seal ring shaft. The FE results indicate that the inclined contacting face may be more effective and stable based on the results of thermal characteristic analysis if the seal ring has been designed with a same thermal capacity between conventional rectangular sealing faces and inclined seating surface of seal rings.

• 한국산업정보학회:학술대회논문집
• /
• 한국산업정보학회 1997년도 추계학술대회 발표논문집:21세기를 향한 정보통신 기술의 전망
• /
• pp.451-462
• /
• 1997

A 2-dimensional numerical analysis is presented for thermal-electron heat conduction effects upon the electron transport and the drain current-voltage characteristics of submicron GaAs MESFETs, based on the use of a nonstationary hydrodynamic transport model. It is shown that for submicron GaAs MESFETs, electron heat conduction effects are significant on their internal electronic properties and also drain current-voltage characteristics. Due to electron heat conduction effects, the electron energy is greatly one-djmensionalized over the entire device region. Also, the drain current decreases continuously with increasing thermal conductivity in the saturation region of large drain voltages above 1 V. However, the opposite trend is observed in the linear region of small drain voltages below 1 V. Accordingly, for a large thermal conductivity, negative differential resistance drain current characteristics are observed with a pronounced peak of current at the drain voltage of 1 V. On the contrary, for zero thermal conductivity, a Gunn oscillation characteristic is observed at drain voltages above 2 V under a zero gate bias condition.

• 제어로봇시스템학회논문지
• /
• 제12권5호
• /
• pp.419-424
• /
• 2006

In this study, a thermal control system which applied a Peltier device for the polymerase chain reaction(PCR) machine is to be designed. Here in order for it to easily follow the characteristics of the thermal cycle existing for gene amplification of the PCR sample, a PCR control board utilizing a thermal sensor, a Peltier, and a 8 bit microprocessor is made up. Especially a fuzzy type PD control algorithm is applied periodically in time response, and control system is implemented. For that matter, the characteristic data of subject system is obtained and analysed to begin with. Based on this analysed data, the proposed control algorithm is applied and an evaluation of the performance of the whole system take place through the PC.

• 한국전기전자재료학회논문지
• /
• 제20권12호
• /
• pp.1077-1081
• /
• 2007

Thermal expanded core (TEC) fiber can reduce, being advantaged from thermal diffusion technology, connection loss by expanding the tolerance in relation to axial offset and gap when making optical connection having mode field diameter (MFD) of optical fiber expanded locally. In this paper, TEC fiber fabrication system based on the frame brushing techniques using twin-torch tip was designed and developed in order to maintain a stable thermal diffusion and single-mode when manufacturing TEC fiber. We were able to obtain that varied kinds of TEC fibers of which MFD could have been extended between $20\;{\mu}m$ and $40\;{\mu}m$ by TEC fiber fabrication system. In addition, the characteristic of connection loss was measured by alignment two TEC fibers of which MFD was $30\;{\mu}m$.