• Korean Journal of Metals and Materials
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• v.56 no.11
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• pp.822-828
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• 2018

P-type Ce/Yb-filled skutterudites were synthesized, and their charge transport and thermoelectric properties were investigated with partial double filling and charge compensation. In the case of $(Ce_{1-z}Yb_z)_{0.8}Fe_4Sb_{12}$ without Co substitution, the marcasite ($FeSb_2$) phase formed alongside the skutterudite phase, but the generation of the marcasite phase was inhibited by increasing Co concentration. The electrical conductivity decreased with increasing temperature, exhibiting degenerate semiconductor behavior. The Hall and Seebeck coefficients were positive, which confirmed that the specimens were p-type semiconductors with holes as the major carriers. The carrier concentration decreased as the concentration of Ce and Co increased, which led to decreased electrical conductivity and increased Seebeck coefficient. The thermal conductivity decreased due to a reduction in electronic thermal conductivity via Co substitution, and due to decreased lattice thermal conductivity via double filling of Ce and Yb. $(Ce_{0.25}Yb_{0.75})_{0.8}Fe_{3.5}Co_{0.5}Sb_{12}$ exhibited the greatest dimensionless figure of merit (ZT = 0.66 at 823 K).

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.3
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• pp.113-121
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• 2021

In this study, the thermal characteristics of cold and hot water mattress units equipped with thermoelectric modules were investigated via numerical analyses. Cold and hot water mattress products that are currently in existence use manual methods requiring refrigerants to be added to the hot water boiler. However, the cold and hot water mattress units using thermoelectric modules can provide improved efficiency via energy savings and actively resolving environmental pollution problems. To determine the efficiency of the thermoelectric module, the mattress was modeled and its efficiency was analyzed for the cooling and heating processes using two 100-W-class and one 200-W-class thermoelectric modules, respectively. From the results of this study, it was confirmed that when two 100-W-class modules were used, the application area was larger than when a single 200-W-class module was used, with uniform temperature distribution and improved performance compared to existing products in terms of electrical energy.

• Korean Journal of Metals and Materials
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• v.46 no.6
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• pp.363-369
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• 2008

Effects of top coat morphology and thickness on thermal fatigue behavior of thermal barrier coatings (TBC) were investigated in this study. Thermal fatigue tests were conducted on three coating specimens with different top coat morphology and thickness, and then the test data were compared via microstructures, cycles to failure, and fracture surfaces. In the air plasma spray specimens (APS1, APS2), top coat were 200 and $300{\mu}m$ respectively. The thickness of top coat was about $700{\mu}m$ in the perpendicular cracked specimen (PCS). Under thermal fatigue condition at $1,100^{\circ}C$, the cycles to top coat failure of APS1, APS2, and PCS were 350, 560 and 480 cycles, respectively. The cracks were initiated at the interface of top coat and thermally grown oxide (TGO) and propagated into TGO or top coat as the number of thermal fatigue cycles increased. For the PCS specimen, additive cracks were initiated and propagated at the starting points of perpendicular cracks in the top coat. Also, the thickness of TGO and the decrease of aluminium concentration in bond coat do not affect the cycles to failure.

• Journal of the Korean Ceramic Society
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• v.54 no.1
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• pp.43-48
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• 2017

In this study, we investigate the effect of additive size on the densification and thermal conductivity of AlN ceramics with $MgO-CaO-Al_2O_3-SiO_2$ (MCAS) additives. Micro-sized MCAS powder prepared via melting and nano-sized MCAS powder synthesized via the polymeric complex method are used as sintering additives. We analyze the densification behavior of AlN added with 5 wt.% of MCAS by dilatometry as well as by isothermal sintering in the temperature range of $1300{\sim}1700^{\circ}C$. AlN exhibits higher sinterability with nano-MCAS than with micro-MCAS, and both specimens approach their maximum densities when sintered at $1600^{\circ}C$ for 4 h. The thermal conductivities of AlN with 5 wt% of nano- and micro-MCAS additives sintered at $1600^{\circ}C$ are 82.6 and 32.0 W/mK, respectively. We find that nano-MCAS is more effective in sintering of AlN ceramics at lower temperatures, and thus for enhancing their thermal conductivities.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• Nuclear Engineering and Technology
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• v.53 no.6
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• pp.1769-1785
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• 2021

The Integral Pressurized Water Reactors (IPWRs) as the innovative advanced and generation-III + reactors are under study and developments in a lot of countries. This paper is aimed at the thermal hydraulic study of the hot and average fuel sub-channel in a Generation III + IPWR by loose external coupling to the neutronic simulation. The power produced in fuel pins is calculated by the neutronic simulation via MCNPX2.6 then fuel and coolant temperature changes along fuel sub-channels evaluated by computational fluid dynamic thermal hydraulic calculation through an iterative coupling. The relative power densities along the fuel pin in hot and average fuel sub-channel are calculated in sixteen equal divisions. The highest centerline temperature of the hottest and the average fuel pin are calculated as 633 K (359.85 ℃) and 596 K (322.85 ℃), respectively. The coolant enters the sub-channel with a temperature of 557.15 K (284 ℃) and leaves the hot sub-channel and the average sub-channel with a temperature of 596 K (322.85 ℃) and 579 K (305.85 ℃), respectively. It is shown that the spacer grids result in the enhancement of turbulence kinetic energy, convection heat transfer coefficient along the fuel sub-channels so that there is an increase in heat transfer coefficient about 40%. The local fuel pin temperature reduction in the place and downstream the space grids due to heat transfer coefficient enhancement is depicted via a graph through six iterations of neutronic and thermal hydraulic coupling calculations. Working in a low fuel temperature and keeping a significant gap below the melting point of fuel, make the IPWR as a safe type of generation -III + nuclear reactor.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.4
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• pp.160-166
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• 2019

Cerium oxide ($CeO_2$, often called as Ceria) is one of the valuable rare earth oxide materials, which has been widely used for high temperature applications such as solid oxide fuel cells, automotive three-way catalysts and oxygen storage capacity. Considering those application, it is important to improve high redox and thermal stability with high surface morphology because the high surface area of $CeO_2$ could improve the catalytic reactivity at high temperature conditions. Herein we successfully fabricated hierarchical flower-like $CeO_2$ deposited via controlling pathway of precipitation reaction to supply carbonate ion lead to the flower-like morphology. The hexagonal lattice system of precipitated precursor shows better thermal stability then orthorhombic one during thermal cycling condition.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.61-67
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• 2017

As transistor density increases rapidly, a heat flux from IC device rises at fast rate. Thermal issues raised by high heat flux cause IC's performance and reliability problems. To solve these thermal management problems, the conventional cooling methods of IC devices were reached their thermal limit. As a result, alternative cooling methods such as liquid heat pipe, thermoelectric cooler, thermal Si via and etc. are currently emerging. In this paper microchannel liquid cooling system with TSV was investigated. The effects of 2 coolants (DI water and ethylene glycol 70 wt%) and 3 metal bumps (Ag, Cu, Cr/Au/Cu) on cooling performance were studied, and the total heat flux of various coolant and bump cases were compared. Surface temperature of liquid cooling system was measured by infrared microscopy, and liquid flowing through microchannel was observed by fluorescence microscope. In the case of ethylene glycol 70 wt% at $200^{\circ}C$ heating temperature, the total heat flux was $2.42W/cm^2$ and most of total heat flux was from liquid cooling effect.

• Journal of the Korean Society for Geothermal and Hydrothermal Energy
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• v.11 no.1
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• pp.7-14
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• 2015

This study has been purposed to provide thermal comfort range in accordance with the residential style of radiant floor heating space, and to compare it with the thermal comfort range at predicted mean vote. The survey for the thermal sensation vote to the subjects and the measurement of environmental factors has been executed, and regression analysis has been performed. It is interpreted that the combination of the physical factor and the psychological factor results lower neutral point of the floor sitting style than that of the chair sitting style. There are some difference between the measured predicted mean vote and the thermal sensation vote via survey, which appears to be caused by distinctive heat transfer characteristic of floor radiant heating space, such as, high radiant temperature and contact thermal sensation of floor surface.

• Korean Journal of Materials Research
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• v.27 no.4
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• pp.221-228
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• 2017

Various morphologies of copper oxide (CuO) have been considered to be of both fundamental and practical importance in the field of electronic materials. In this study, using Cu ($0.1{\mu}m$ and $7{\mu}m$) particles, flake-type CuO particles were grown via a wet oxidation method for 5min and 60min at $75^{\circ}C$. Using the prepared CuO, AlN, and silicone base as reagents, thermal interface material (TIM) compounds were synthesized using a high speed paste mixer. The properties of the thermal compounds prepared using the CuO particles were observed by thermal conductivity and breakdown voltage measurement. Most importantly, the volume of thermal compounds created using CuO particles grown from $0.1{\mu}m$ Cu particles increased by 192.5 % and 125 % depending on the growth time. The composition of CuO was confirmed by X-ray diffraction (XRD) analysis; cross sections of the grown CuO particles were observed using focused ion beam (FIB), field emission scanning electron microscopy (FE-SEM), and energy dispersive analysis by X-ray (EDAX). In addition, the thermal compound dispersion of the Cu and Al elements were observed by X-ray elemental mapping.