• Title/Summary/Keyword: Thermal Transfer Analysis

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A new consideration for the heat transfer coefficient and an analysis of the thermal stress of the high-interim pressure turbine casing model (열전달계수에 대한 새로운 고찰 및 고-중압 터빈 케이싱 모형의 열응력 해석)

  • Um, Dall-Sun
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.425-429
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    • 2004
  • In real design of the high & interim pressure turbine casing, it is one of the important things to figure out its thermal strain exactly. In this paper, with the establishment of the new concept for the heat transfer coefficient of steam that is one of the factors in analysis of the thermal stress for turbine casing, an analysis was done for one of the high & interim pressure turbine casings in operating domestically. The sensitivity analysis of the heat transfer coefficient of steam to the thermal strain of the turbine casing was done with a 2-D simple model. The analysis was also done with switching of the material properties of the turbine casing and resulted in that the thermal strain of the turbine casing was not so sensitive to the heat transfer coefficient of steam. On the basis of this, 3-D analysis of the thermal strain for the high and interim pressure turbine casing was done.

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Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages (전자장비 회로기판의 열응력해석)

  • Kwon Y. J.;Kim J. A.
    • Korean Journal of Computational Design and Engineering
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    • v.9 no.4
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

A Study on the Thermal Stress Analysis of a Piston in a Turbocharged Diesel Engine (터보 디젤엔진 피스톤의 열응력 해석에 관한 연구)

  • 국종영
    • Transactions of the Korean Society of Automotive Engineers
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    • v.9 no.2
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    • pp.92-98
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    • 2001
  • We determined the transfer coefficient through the analysis of three dimensional temperature distribution in comparison with the measured temperature on the piston in the turbocharged diesel engine. And we analyzed the thermal stress and the thermal deformation with that heat transfer coefficient by using finite element method. According to this results, we found that maximum tempetature range of the piston appeared at the upper part of the piston crown and that the heat transfer coefficient of the upper part of the piston is smaller than that of the lower one. It showed that the maximum thermal deformation is shown at the edge of the upper part of piston and that the maximum thermal stress was shown on the lower part of the piston crown. Finally, we defined the method of determination of a piston heat transfer analysis by using measured temperature on the piston and analyzed temperature with finite element method.

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A Study on the Thermal Stress Analysis of Thermally Sprayed Ceramic Coating (세라믹 용사시의 열응력해석에 관한 연구)

  • 정동원;김귀식;오맹종;조종래
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.11
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    • pp.227-232
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    • 1998
  • The purpose of this study is to develop a numerical method for analyzing the transient heat transfer and evaluating the residual stress. The analysis of heat transfer and thermal stress are carried out by three-dimensional finite element method. Thermal spraying is one of the most common surface coating techniques to be used for many applications. In order to improve the mechanical properties of flame-sprayed ceramic coating layer, the accurate and effective analysis of heat transfer and thermal stress is essentially required.

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Tension/Heat/Thermal Deformation Analysis of a Cold Coiled Strip in Coiling Process (냉연 판재의 권취공정에 있어서 장력/열/변형 해석)

  • 정영진;이규택;강충길
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.05a
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    • pp.39-43
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    • 2002
  • A new model for heat transfer and thermal deformation analysis according to strip mm in coiling process has been proposed. Finite difference analyses for heat transfer of cold rolled coil have been carried out under various coiling tensions and strip crown using the equivalent thermal conductivity for the radial direction of cold rolled coil which is a function of strip thickness, surface characteristics and compressive pressure. The compressive pressure is calculated from a equation expressed as a function of hoop stress and coil tension considering strip mm obtained by experiment. Finite element method for thermal deformation of cold rolled coil has been performed to investigate the effects of the strip crown, the coil tension and temperature. From these analyses, it is found that the axial inhomogeneity of thermal deformation is increased as the strip crown, compressive pressure, and temperature drop in cold coiled strip increase.

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Evaluation of Thermal Characteristics of a Direct-Connection Spindle Using Finite Element Co-Analysis (유한 요소 해석을 활용한 직결 주축의 열적 특성 평가)

  • Kim, Tae-Won;Choi, Jin-Woo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.22 no.2
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    • pp.228-234
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    • 2013
  • This study focuses on development of a finite element model for analysis of thermal characteristics of a direct-connection spindle of a machining center by joint simulation of heat transfer and thermal deformation. Two finite element analyses were carried out procedurally for heat transfer, first, to identify temperature distribution of components of the spindle and then for thermal deformation to identify their structural behavior based on the temperature distribution. It was assumed that the heat transfer between a component revolving and the surrounding air is identical to that between a flat plate and the running air on it and the heat transfer is based on a uniform surface heat flux for turbulent flow. The results from the analyses were compared with those from experiments to validate the finite element model.

Thermal Resistance Modeling of Linear Motor Driven Stages for Chip Mounter Applications (칩 마운터용 리니어 모터 스테이지의 열저항 모델링)

  • Jang, Chang-Su;Kim, Jong-Yeong;Kim, Yeong-Jun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.26 no.5
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    • pp.716-723
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    • 2002
  • Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

Thermal Resistance Modeling of Linear Motor Driven Stages for Chip Mounter Applications (칩 마운터용 리니어 모터 스테이지의 열저항 모델링)

  • Jang, Chang-Soo;Kim, Jong-Young;Kim, Yung-Joon
    • Proceedings of the KSME Conference
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    • 2001.11b
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    • pp.96-101
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    • 2001
  • Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

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Analysis of Transient Heat Transfer Characteristics of Dish-Type Solar Receiver System (접시형 태양열 흡수기의 Transient 열전달 특성에 대한 수치해석 연구)

  • Lee, Ju-Han;Seo, Joo-Hyun;Oh, Sang-June;Lee, Jin-Kyu;Seo, Tae-Beom
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2094-2099
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    • 2008
  • A numerical and experimental studies are carried out to investigate the transient heat transfer characteristics of 5kWth dish-type solar air receiver. Measured solar radiation and temperatures at several different locations are used as boundary conditions for numerical simulation. Many parameters' effects (reflectivity of the reflector, the thermal conductivity of the receiver body, transmissivity of the quartz window, etc.) on the thermal performance are investigated. Discrete Transfer Method is used to calculate the radiation heat exchange in the receiver. A transient heat transfer model is developed and the rate of radiation, convection and conduction heat transfer are calculated. Comparing the experimental and numerical results, good agreement is obtained. Using the numerical model, the transient heat transfer characteristics of volumetric air receiver for dish-type solar thermal systems are known and the transient thermal performance of the receiver can be estimated.

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Thermal Behavior Analysis in Continuous Bloom Casting Mold (Bloom용 연속주조 몰드의 열거동 해석)

  • 정영진;김성훈;김영모;강충길
    • Transactions of Materials Processing
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    • v.13 no.4
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    • pp.319-325
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    • 2004
  • Continuous casting machine has been experienced a rapid development to increase productivity with high casting speed and to meet consumer's strict demands for high quality. However, because most of defects and cracks are initially formed in mold and grown into surface cracks during the post process, more specific and clear investigations upon heat transfer mechanism between mold and solidified shell are necessarily needed. In this study heat transfer coefficients which shows the characteristic of heat transfer mechanism are calculated with temperatures measured in bloom mold using optimal algorithm, and thermal analysis are investigated using the calculated heat transfer coefficients. Finally uniformity of solidified shell is investigated for high carbon steel, 0.187%C from thermal analysis.