• 제목/요약/키워드: Thermal Transfer Analysis

검색결과 1,366건 처리시간 0.039초

열전달계수에 대한 새로운 고찰 및 고-중압 터빈 케이싱 모형의 열응력 해석 (A new consideration for the heat transfer coefficient and an analysis of the thermal stress of the high-interim pressure turbine casing model)

  • 엄달선
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2004년도 추계학술대회
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    • pp.425-429
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    • 2004
  • In real design of the high & interim pressure turbine casing, it is one of the important things to figure out its thermal strain exactly. In this paper, with the establishment of the new concept for the heat transfer coefficient of steam that is one of the factors in analysis of the thermal stress for turbine casing, an analysis was done for one of the high & interim pressure turbine casings in operating domestically. The sensitivity analysis of the heat transfer coefficient of steam to the thermal strain of the turbine casing was done with a 2-D simple model. The analysis was also done with switching of the material properties of the turbine casing and resulted in that the thermal strain of the turbine casing was not so sensitive to the heat transfer coefficient of steam. On the basis of this, 3-D analysis of the thermal strain for the high and interim pressure turbine casing was done.

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전자장비 회로기판의 열응력해석 (Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages)

  • 권영주;김진안
    • 한국CDE학회논문집
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    • 제9권4호
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    • pp.416-424
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    • 2004
  • In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

터보 디젤엔진 피스톤의 열응력 해석에 관한 연구 (A Study on the Thermal Stress Analysis of a Piston in a Turbocharged Diesel Engine)

  • 국종영
    • 한국자동차공학회논문집
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    • 제9권2호
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    • pp.92-98
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    • 2001
  • We determined the transfer coefficient through the analysis of three dimensional temperature distribution in comparison with the measured temperature on the piston in the turbocharged diesel engine. And we analyzed the thermal stress and the thermal deformation with that heat transfer coefficient by using finite element method. According to this results, we found that maximum tempetature range of the piston appeared at the upper part of the piston crown and that the heat transfer coefficient of the upper part of the piston is smaller than that of the lower one. It showed that the maximum thermal deformation is shown at the edge of the upper part of piston and that the maximum thermal stress was shown on the lower part of the piston crown. Finally, we defined the method of determination of a piston heat transfer analysis by using measured temperature on the piston and analyzed temperature with finite element method.

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세라믹 용사시의 열응력해석에 관한 연구 (A Study on the Thermal Stress Analysis of Thermally Sprayed Ceramic Coating)

  • 정동원;김귀식;오맹종;조종래
    • 한국정밀공학회지
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    • 제15권11호
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    • pp.227-232
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    • 1998
  • The purpose of this study is to develop a numerical method for analyzing the transient heat transfer and evaluating the residual stress. The analysis of heat transfer and thermal stress are carried out by three-dimensional finite element method. Thermal spraying is one of the most common surface coating techniques to be used for many applications. In order to improve the mechanical properties of flame-sprayed ceramic coating layer, the accurate and effective analysis of heat transfer and thermal stress is essentially required.

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냉연 판재의 권취공정에 있어서 장력/열/변형 해석 (Tension/Heat/Thermal Deformation Analysis of a Cold Coiled Strip in Coiling Process)

  • 정영진;이규택;강충길
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2002년도 춘계학술대회 논문집
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    • pp.39-43
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    • 2002
  • A new model for heat transfer and thermal deformation analysis according to strip mm in coiling process has been proposed. Finite difference analyses for heat transfer of cold rolled coil have been carried out under various coiling tensions and strip crown using the equivalent thermal conductivity for the radial direction of cold rolled coil which is a function of strip thickness, surface characteristics and compressive pressure. The compressive pressure is calculated from a equation expressed as a function of hoop stress and coil tension considering strip mm obtained by experiment. Finite element method for thermal deformation of cold rolled coil has been performed to investigate the effects of the strip crown, the coil tension and temperature. From these analyses, it is found that the axial inhomogeneity of thermal deformation is increased as the strip crown, compressive pressure, and temperature drop in cold coiled strip increase.

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유한 요소 해석을 활용한 직결 주축의 열적 특성 평가 (Evaluation of Thermal Characteristics of a Direct-Connection Spindle Using Finite Element Co-Analysis)

  • 김태원;최진우
    • 한국생산제조학회지
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    • 제22권2호
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    • pp.228-234
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    • 2013
  • This study focuses on development of a finite element model for analysis of thermal characteristics of a direct-connection spindle of a machining center by joint simulation of heat transfer and thermal deformation. Two finite element analyses were carried out procedurally for heat transfer, first, to identify temperature distribution of components of the spindle and then for thermal deformation to identify their structural behavior based on the temperature distribution. It was assumed that the heat transfer between a component revolving and the surrounding air is identical to that between a flat plate and the running air on it and the heat transfer is based on a uniform surface heat flux for turbulent flow. The results from the analyses were compared with those from experiments to validate the finite element model.

칩 마운터용 리니어 모터 스테이지의 열저항 모델링 (Thermal Resistance Modeling of Linear Motor Driven Stages for Chip Mounter Applications)

  • 장창수;김종영;김영준
    • 대한기계학회논문집B
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    • 제26권5호
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    • pp.716-723
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    • 2002
  • Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

칩 마운터용 리니어 모터 스테이지의 열저항 모델링 (Thermal Resistance Modeling of Linear Motor Driven Stages for Chip Mounter Applications)

  • 장창수;김종영;김영준
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 추계학술대회논문집B
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    • pp.96-101
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    • 2001
  • Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

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접시형 태양열 흡수기의 Transient 열전달 특성에 대한 수치해석 연구 (Analysis of Transient Heat Transfer Characteristics of Dish-Type Solar Receiver System)

  • 이주한;서주현;오상준;이진규;서태범
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회B
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    • pp.2094-2099
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    • 2008
  • A numerical and experimental studies are carried out to investigate the transient heat transfer characteristics of 5kWth dish-type solar air receiver. Measured solar radiation and temperatures at several different locations are used as boundary conditions for numerical simulation. Many parameters' effects (reflectivity of the reflector, the thermal conductivity of the receiver body, transmissivity of the quartz window, etc.) on the thermal performance are investigated. Discrete Transfer Method is used to calculate the radiation heat exchange in the receiver. A transient heat transfer model is developed and the rate of radiation, convection and conduction heat transfer are calculated. Comparing the experimental and numerical results, good agreement is obtained. Using the numerical model, the transient heat transfer characteristics of volumetric air receiver for dish-type solar thermal systems are known and the transient thermal performance of the receiver can be estimated.

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Bloom용 연속주조 몰드의 열거동 해석 (Thermal Behavior Analysis in Continuous Bloom Casting Mold)

  • 정영진;김성훈;김영모;강충길
    • 소성∙가공
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    • 제13권4호
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    • pp.319-325
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    • 2004
  • Continuous casting machine has been experienced a rapid development to increase productivity with high casting speed and to meet consumer's strict demands for high quality. However, because most of defects and cracks are initially formed in mold and grown into surface cracks during the post process, more specific and clear investigations upon heat transfer mechanism between mold and solidified shell are necessarily needed. In this study heat transfer coefficients which shows the characteristic of heat transfer mechanism are calculated with temperatures measured in bloom mold using optimal algorithm, and thermal analysis are investigated using the calculated heat transfer coefficients. Finally uniformity of solidified shell is investigated for high carbon steel, 0.187%C from thermal analysis.