• Title/Summary/Keyword: Thermal Stress Breakage

Search Result 13, Processing Time 0.023 seconds

Improving Lifetime Prediction Modeling for SiON Dielectric nMOSFETs with Time-Dependent Dielectric Breakdown Degradation (SiON 절연층 nMOSFET의 Time Dependent Dielectric Breakdown 열화 수명 예측 모델링 개선)

  • Yeohyeok Yun
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
    • /
    • v.16 no.4
    • /
    • pp.173-179
    • /
    • 2023
  • This paper analyzes the time-dependent dielectric breakdown(TDDB) degradation mechanism for each stress region of Peri devices manufactured by 4th generation VNAND process, and presents a complementary lifetime prediction model that improves speed and accuracy in a wider reliability evaluation region compared to the conventional model presented. SiON dielectric nMOSFETs were measured 10 times each under 5 constant voltage stress(CVS) conditions. The analysis of stress-induced leakage current(SILC) confirmed the significance of the field-based degradation mechanism in the low electric field region and the current-based degradation mechanism in the high field region. Time-to-failure(TF) was extracted from Weibull distribution to ascertain the lifetime prediction limitations of the conventional E-model and 1/E-model, and a parallel complementary model including both electric field and current based degradation mechanisms was proposed by extracting and combining the thermal bond breakage rate constant(k) of each model. Finally, when predicting the lifetime of the measured TDDB data, the proposed complementary model predicts lifetime faster and more accurately, even in the wider electric field region, compared to the conventional E-model and 1/E-model.

A Study on Optimization of Vacuum Glazing Encapsulating Process using Frit inside a Vacuum Chamber (진공챔버 내 프리트 이용 진공유리 봉지공정 최적화에 관한 연구)

  • Park, Sang Jun;Lee, Young Lim
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.14 no.2
    • /
    • pp.567-572
    • /
    • 2013
  • In houses that use heating and cooling system, most of heat loss occurs through the windows, so that low-E glass, double-layered glass, and vacuum glazing are used to minimize the heat loss. In this paper, an encapsulating process that is a final process in manufacturing the vacuum glazing has been studied, and bonding in a vacuum chamber rather than atmospheric bonding was considered. For the efficiency of the encapsulating process, frit-melting temperature and bonding time were optimized with heater temperature, and the glass preheating temperature was optimized to prevent glass breakage due to thermal stress. Thus the vacuum glass was successfully manufactured based on these results and heat transmission coefficient measured was about $5.7W/m^2K$ which indicates that the internal pressure of the vacuum glazing is $10^{-2}$ torr.

Evaluation of Thermal Degradation of CFRP Flexural Strength at Elevated Temperature (온도 상승에 따른 탄소 복합재의 굽힘 강도 저하 평가)

  • Hwang Tae-Kyung;Park Jae-Beom;Lee Sang-Yun;Kim Hyung-Geun;Park Byung-Yeol;Doh Young-Dae
    • Composites Research
    • /
    • v.18 no.2
    • /
    • pp.20-29
    • /
    • 2005
  • To evaluate the flexural deformation and strength of composite motor case above the glass transition temperature$(T_g),\;170^{\circ}C$, of resin material, a finite element analysis(FEA) model in which material non-linearity and progressive failure mode were considered was proposed. The laminated flexural specimens which have the same lay-up and thickness as the composite motor case were tested by 4-point bending test to verify the validity of FEA model. Also. mechanical properties in high temperature were evaluated to obtain the input values for FEA. Because the material properties related to resin material were highly deteriorated in the temperature range beyond $T_g$, the flexural stiffness and strength of laminated flexural specimen in $200^{\circ}C$ were degraded by also $70\%\;and\;80\%$ in comparison with normal temperature results. Above $T_g$, the failure mode was changed from progressive failure mode initiated by matrix cracking at $90^{\circ}$ ply in bottom side and terminated by delamination at the center line of specimen to fiber compressive breakage mode at top side. From stress analysis, the progressive failure mechanism was well verified and the predicted bending stiffness and strength showed a good agreement with the test results.