• 한국공작기계학회논문집
• /
• 제18권2호
• /
• pp.144-153
• /
• 2009

It is widely known that no-slip assumptions are often violated on regular basis in micrometer- or nanometer-scale fluid flow. In the case of cavity-filling process of nanoimprint lithography(NIL), slip phenomena take place naturally at the solid-to-liquid boundaries, that is, at the mold-to-polymer or polymer-to-substrate boundaries. If the slip or partial slip phenomena are promoted at the boundaries, the processing time of NIL, especially of thermal-NIL which consumes more tact time than that of UV-NIL, can be significantly improved. In this paper it is aimed to elucidate how the cavity-filling process of NIL can be influenced by the slip phenomena at boundaries and to what degree those phenomena increase the process rate. To do so, computational fluid dynamics(CFD) analysis of cavity filling process has been carried out. Also, the effect of mold pattern shape and initial thickness of polymer resist were considered in the analysis, as well.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
• /
• pp.236.2-236.2
• /
• 2005

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2007년도 춘계학술대회A
• /
• pp.343-348
• /
• 2007

Molecular dynamics study of thermal NIL (Nano Imprint Lithography) process is performed to examine stamp-resist interactions. A layered structure consists of Ni stamp, poly-(methylmethacrylate) thin film resist and Si substrate was constructed for isothermal ensemble simulations. Imposing confined periodicity to the layered unit-cell, sequential movement of stamp followed by NVT simulation was implemented in accordance with the real NIL process. Both vdW and electrostatic potentials were considered in all non-bond interactions and resultant interaction energy between stamp and PMMA resist was monitored during stamping and releasing procedures. As a result, the stamp-resist interaction energy shows repulsive and adhesive characteristics in indentation and release respectively and irregular atomic concentration near the patterned layer were observed. Also, the spring back and rearrangement of PMMA molecules were analyzed in releasing process.

• 한국정밀공학회지
• /
• 제28권2호
• /
• pp.239-244
• /
• 2011

Nano Imprint Lithography(NIL) is technique for copying a pattern from stamp with nano size pattern in order to replicated the materials. It is very important to demold in order to make NIL process effectively. Self Assembled Monolayers(SAM) coater is manufactured by means of decreasing surface energy with the stamp surface treatment to improve release characteristics. Manufactured device contains tilting and rotation option for increasing process life time by coating on the sidewall of the pattern in stamp. The stamp coated with optimized tilting angle $30^{\circ}$ and rotation speed of 10rpm has more imprinting cycles than the stamping coated without tilting and rotation. Effective SAM coating on the sidewall of the pattern in stamp will improve by 50% of process life time.

• 마이크로전자및패키징학회지
• /
• 제14권4호
• /
• pp.1-7
• /
• 2007

최근 나노임프린트 리소그래피 공정이 마이크로/나노스케일의 소자 개발에 있어서 경제적으로 대량 생산할 수 있는 기술로 주목 받고 있다. 나노 스케일의 패턴을 성공적으로 전사하기 위해서는 폴리머의 기계적 거동에 대한 이해를 바탕으로, 적절한 공정 조건 즉, 압력, 온도, 시간 등의 선택이 필요하다. 본 연구에서는 열-나노임프린트 공정에서의 충전과정을 해석하기 위하여 비선형 유한요소법을 이용하였으며, 폴리머의 거동을 점탄성으로 가정하여 재료의 응력완화 효과를 고려하였다. 해석을 통하여 온도 및 몰드의 패턴형상이 열-나노임프린트 공정에 미치는 영향을 살펴보았다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2012년도 추계학술대회 논문집
• /
• pp.341-342
• /
• 2012

• 한국정밀공학회지
• /
• 제28권4호
• /
• pp.513-520
• /
• 2011

The NIL processes have been studied to implement low cost, high throughput and high resolution application. A RNIL(roller NIL) is an alternative approach to flat nanoimprint lithography. RNIL process is necessary to transfer patterns on flexible substrates. Compared with flat NIL, RNIL has the advantages of better uniformity, less pressing force, and the ability to repeat the patterning process continuously on a large substrate. This paper studies the design, construction and verification of a thermal RNIL system. The proposed RNIL system can easily adopt the flat shaped hot plate which is one of the most important technologies for NIL. The NIL system can be used to transfer patterns from a flexible stamp to a flexible substrate, from a flexible stamp to a Si substrate, and from a roller stamp to a flexible substrate, etc. Patterning on flexible substrates is one of the key technologies to produce bendable displays, solar cells and other applications.

• 한국소성가공학회:학술대회논문집
• /
• 한국소성가공학회 2007년도 추계학술대회 논문집
• /
• pp.364-367
• /
• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집A
• /
• pp.441-446
• /
• 2001

In the integral type reactor, SMART, all the major components such as steam generators, pressurizer and pumps are located inside the single reactor pressure vessel. The objective of this study is to evaluate the structural integrity for RPV of SMART under the postulated pressurized thermal shock by applying the finite element analysis. Input data for the finite element analysis were generated using the commercial code I-DEAS, and the fracture mechanics analysis was performed using the ABAQUS. The crack configurations, the crack aspect ratio and the clad thickness were considered in the parametric study. The effects of these parameters on the reference nil-ductility transition temperature were also investigated.

• 전산구조공학
• /
• 제11권1호
• /
• pp.153-160
• /
• 1998

본 연구에서는 가압열충격 사고로 소형 냉각재 상실사고를 가정하여 냉각재의 온도와 압력의 이력으로 부터 용기 벽의 온도분포를 구하고, 이로 부터 열응력과 압응력을 해석적으로 구하였다. 또 균열 선단에서의 응력강도계수와 파괴인성치를 ASME코드의 방법을 이용하여 구하였고, 이들을 시간에 따라 비교하여 균열의 진전여부를 평가하였다. 원자로 용기 벽에 존재하는 여러 형태의 균열이 견딜 수 있는 최대 기준무연성천이온도를 결정하였으며 평가 결과에 대하여 고찰하였다.