• 한국항공우주학회지
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• 제33권6호
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• pp.39-44
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• 2005

섬유금속적층판(Fiber Metal Laminates, 이하 FML)에서 알루미늄과 유리섬유/에폭시 복합재료 사이의 열팽창 계수의 차이는 경화공정 시 FML내부에 열 잔류응력을 남기게 되며, 이러한 열 잔류응력은 FML의 피로특성과 항복강도에 영향을 주게 된다. 잔류응력을 예측하기 위해 두 가지 실험법이 제안 되었으며, 이론식을 통해 그 결과를 예측하고, 실제 실험을 수행하여 그 값을 확인 하였다. 또한, 열 잔류응력의 제거 및 응력의 역전을 위하여 후-인발 가공이 수행 되었으며, 가공 이후 발생한 FML내의 잔류응력이 측정 되었다. 예측된 열 잔류응력 결과와 실험을 통한 값이 일치함을 보이며, 후-인발 가공을 통하여 열 잔류응력 제거 및 항복강도의 증가가 발생하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.361-361
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• 2009

KEPCO High Temperature Superconducting (HTS) cable system rated with $3\Phi$, 22.9kV, 1250A was laid in 2006, and the long term test is in progress. The HTS cable system with the cooling system has been operated below cryogenic temperature. That environment exposes the system to the thermo-mechanical stress due to the significant temperature difference, and the cooling system has moving parts for the forced circulation of the coolant. Therefore the HTS cable system experiences thermal fatigue and moving part such as liquid nitrogen pump need a regular replacement every 5000 hours Building the assessment criterion, the maintenance procedure was established and regular preventive maintenance was done; improvement of the termination structure and the replacement of the bearing of liquid nitrogen pump. Following the proper process, the reliability assessment test including He leakage detection and the stability of flow rate was performed. This paper describes the process and result of the first regular maintenance of KEPCO HTS cable system

• Composites Research
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• 제26권5호
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• pp.303-308
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• 2013

탄소섬유(CF) 강화 폴리프로필렌(PP) 복합재료의 수요는 증가되고 있다. 본 연구에서는 재활용 횟수에 따라 변화되는 복합재료의 물성 변화를 관찰하였다. CF 함량을 20% 함량으로 조성한 복합재료에 대해서 재활용 횟수에 따른 기계적 물성 평가를 진행하였다. 인장, 굴곡, Izod 동적 피로 실험에 따른 영향을 확인하였다. CF/PP 복합재료의 계면 물성을 평가하기 위해 젖음성 평가와 파단면을 FE-SEM으로 확인하였다. 재활용 횟수에 따라 섬유와 기지는 변화된다. CF/PP 복합재료는 재활용 할수록 섬유와 기지간의 계면에 열 데미지와 분쇄 과정에 의한 결합력 감소가 확인하였다.

• Journal of Welding and Joining
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• 제20권2호
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• 한국표면공학회지
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• 제34권2호
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• pp.161-168
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• 2001

A Thermal Barrier Coating (TBC) can play an important role in protecting parts from harmful environments at high temperatures such as oxidation, corrosion, and wear in order to improve the efficiency of aircraft engines by lowering the surface temperature of the turbine blade. The TBC can increase the life span of the product and improve the operating properties. Therefore, in this study the mechanical and thermal properties of the TBC such as oxidation, fatigue and shock at high temperatures were evaluated. A samples of a bond coat (CoNiCrAlY) produced by the High Velocity Oxygen Fuel (HVOF) and Low Pressure Plasma Spray (LPPS) method were used. The thickness of the HVOF coating layer was approximately $450\mu\textrm{m}$ to 500$\mu\textrm{m}$ and the hardness number of the coating layer was between 350Hv and 400Hv. The thickness of the LPPS coating was about 350$\mu\textrm{m}$ to 400$\mu\textrm{m}$ and the hardness number of the coating was about 370Hv to 420Hv. The X-ray diffraction analysis showed that CoNiCrAlY coating layer of the HVOF and LPPS was composed of the $\beta$and ${\gamma}$phase. After the high temperature oxidation test, the oxide scale with about l0$\mu\textrm{m}$ to 20$\mu\textrm{m}$ thickness appeared at the coating surface on the Al-depleted zone was observed under the oxide scale layer.

• Structural Engineering and Mechanics
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• 제27권3호
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• pp.277-292
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• 2007

Based on the composite finite element simulation and a series of hydrostatic pressure and burst tests, autofrettage effects on strength and deformation of fiber reinforced pressure vessel with metallic liners have been studied in the paper (autofrettage: during the course of one pressure taking effect, the increasing internal stress in metallic liner can surpass the yielding point and the plastic deformation will happen, which result in that when there is no internal pressure, there are press stress in liner while tensile stress in fiber lamination). By making use of a composite finite element Ansys code and a series of experiments, the autofrettage pressure is determined in order to make the aluminium liner be totally in elastic state, under given hydrostatic test pressure. The stress intensity factors of the longitudinal crack in aluminum liner end under internal pressure and thermal loads have been computed and analyzed before and after the autofrettage processing. Through numerical calculation and experiment investigations, it is found that a correct choice for autofrettage pressure can improve the gas-tightness and fatigue strength of FRP vessel.

• 대한환경공학회지
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• 제39권12호
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• pp.733-740
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• 2017

환경부에서 수립한 "상수도 시설기준(2004)"은 관로 신축이음관 설치기준에 있어서는 용접이음 강관에는 설치하지 않는 것으로 규정하고 있으며, 이에 대한 근거가 명확하지 않고 관로 안정성이 충분히 확보되었는지 확인하기가 어렵다. 금번 연구에서는 강관의 거동 분석을 통한 관로 안정성을 연구하여 신축이음관의 필요여부를 검증하는 것을 목적으로 하였다. 검토결과는 아래와 같다. 첫째, 아스팔트 도복장강관(D2,400 mm)은 온도변화에 따라 4-cycle로 관로 신 수축이 반복되며, 연장 1.24 km에 있어 최대 13.03 mm의 변위를 나타내었다. 둘째, 수도용 강관의 신 수축으로 발생되는 온도응력은 매설깊이(최대 4 m)에 따라 $13.7{\sim}36.1kgf/cm^2$로 발생되며, 강관(STWW 400)의 안정성에 큰 영향을 키치는 주요 비교인자인 허용 인장강도와 피로한도는 $4,100kgf/cm^2$와 $1,840kgf/cm^2$로 산출되었다. 마지막으로, 수도용 강관의 온도응력은 허용 인장강도와 피로한도와 비교시 매우 작음에 따라, 온도변화에 의한 관로의 신 수축이 발생하여도 관로 안정성에는 영향을 끼치지 못함을 알 수 있었다. 결론적으로 금번 연구를 통하여 수도용 강관의 관로부에는 신축이음관을 설치할 필요가 없는 것으로 증명되었다.

• 대한기계학회논문집A
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• 제38권12호
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• pp.1431-1434
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• 2014

가스터빈에 적용되는 열차폐코팅은 가동 중 반복적인 열피로에 의하여 파손되므로, 열차폐코팅의 내구성평가가 필요하다. 고온 환경에 노출된 열차폐코팅의 내부에는 열생성산화물(TGO)이 성장하게 되는데, 이러한 열생성산화물(TGO)의 성장은 열차폐코팅의 주요 파손 원인으로 알려져 있다. 따라서 TGO의 성장을 고려한 열차폐코팅의 내구성평가는 반드시 선행되어야 하는 연구이다. 본 연구에서는 김대진등의 연구 결과로부터 열화시간에 따른 TGO 성장을 고려하여 유한요소해석을 수행하였으며, 이로부터 응력과 열화시간 사이의 관계를 도출하였다. 또한 열화시간에 따른 유한요소해석 결과와 김대진 등의 접착강도 시험 결과의 비교를 통하여 열차폐코팅의 내구성을 평가하였다.