• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.11a
• /
• pp.30-30
• /
• 2004

• Journal of the Microelectronics and Packaging Society
• /
• v.11 no.3 s.32
• /
• pp.71-76
• /
• 2004

The power consumption of TEC for Laser diode cooling was predicted by 3-D FEM simulation and verified by experiment. The operating conditions such as power consumption of Laser diode, set temperature, ambient temperature, resistance of thermal path was considered to estimate the TEC power consumption. Using 3-D FEM simulation, the relation between TEC configuration defined by the pellet dimension and the number and power consumption was investigated for low power consumption scheme. As a result, as the thermal resistance of the pellet increased, the power consumption decreased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.25-26
• /
• 2007

In this paper, we studied the shadow effect which is one of environmental cause for hot-spot phenomenon on PV by considering electrical effects. We fabricated PV module in case of existence and nonexistence of bypass diode. And maximum output power and thermal distribution was analyzed by shadowing solar cell by increase of 5%. From the results, the PV module's(without bypass diode) maximum output power was reduced by hot-spot gradually. But the PV module's(with bypass diode) maximum output power had no reduction by operation of bypass diode, though solar cell is shadowed more than 60%. The solar cell temperature of PV module(without bypass diode) was $10^{\circ}C$ higher compared to module's one. This is a reason for shortening of durability of PV module.

• Bulletin of the Korean Chemical Society
• /
• v.18 no.1
• /
• pp.108-109
• /
• 1997

• Bulletin of the Korean Chemical Society
• /
• v.17 no.6
• /
• pp.536-538
• /
• 1996

• Journal of Electrical Engineering and Technology
• /
• v.11 no.5
• /
• pp.1153-1164
• /
• 2016

• The Transactions of the Korean Institute of Electrical Engineers P
• /
• v.58 no.3
• /
• pp.357-361
• /
• 2009

This study performed analysis on the thermal pattern and current characteristics of an LED ((Light Emitting Diode) street lamp. It did this using a TVS (Thermal Video System) to analyze the LED street lamp's thermal pattern, and measured its characteristics using an oscilloscope. The ambient temperature and humidity during the experiment were maintained at $24{\pm}2[^{\circ}C]$ and 50~60[%]. The capacity of the LED street lamp was 120[W] and nine sets of modules were arranged at uniform intervals. On one module, 24 LED lamps were arranged in a radial pattern. The analysis of the thermal diffusion pattern at the front of the LED lamp showed that the maximum surface temperature was approximately $34[^{\circ}C]$. In addition, there was almost no change in the temperature of the upper cover, and the temperature at the side showed a uniform thermal diffusion pattern. The surface temperature of the converter converting AC to DC increased to approximately $46[^{\circ}C]$. The analysis results of the thermal characteristics of one LED indicated uniform thermal characteristics for an initial eight minutes. However, the temperature at the center of the LED increased to approximately $82[^{\circ}C]$ after 12 minutes had elapsed. It can be seen from this that the temperature at the center of the LED was higher than the allowable temperature, $70[^{\circ}C]$ of the insulating material for general electrical devices. Therefore, it is necessary to design a lamp in such a way that the plastic insulating material does not come into contact with or get close to the LED lamp. The voltage of the LED lamp converted by the AC/DC converter was measured at DC 27[V] and the current was DC 13[A]. Consequently, it can be seen that in order to secure an adequate light source, it is important to supply a stable current that was greater than the current of other light sources. Therefore, appropriate radiation of heat is required to secure the stability and reliability of the system.

• Solar Energy
• /
• v.18 no.2
• /
• pp.105-113
• /
• 1998

In general, the thermo-diode is a device designed to allow heat to be transferred only in one direction. However, the bidirectional thermo-diode devised to change the heat flow in the desired direction can be used for the reduction of the heating load in winter as well as the cooling load in summer. In this study, a solar heating system using loop-type bidirectional thermo-diodes is designed and set up, also it is successfully applied to an outdoor test cell for the verification of its usefulness.

• Electrical & Electronic Materials
• /
• v.8 no.6
• /
• pp.737-743
• /
• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• Transactions of the Society of Information Storage Systems
• /
• v.2 no.1
• /
• pp.21-25
• /
• 2006

The new multimedia information environment requires smaller optical data storage systems. However, one of the difficulties encountered in designing small form factor(SFF) optical pick-up is to emit the heat which is generated from laser diode(LD). Heat generated at the LD can reduce the optical performance of the system and the lifetime of LD. Therefore, it is important to include the thermal design in the design stage of SFF optical pick-up system for high performance and the longer lifetime of LD, and furthermore, to analyze the thermal characteristics of LD in detail micro heat transfer analysis is necessary. In the present study, micro heat transfer analysis was performed using the finite element method for the $28{\times}11{\times}2mm^3$ super slim swing-arm type optical pick-up actuator for Blu-ray disk. Two different materials were used for a swing-arm; a double layer polycarbonate/steel structure and a single aluminum structure.