• Title/Summary/Keyword: Thermal Density

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Influence of Thermal Aging in Change of Crosslink Density and Deformation of Natural Rubber Vulcanizates

  • Choe, Seong Sin
    • Bulletin of the Korean Chemical Society
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    • v.21 no.6
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    • pp.628-634
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    • 2000
  • Crosslink is the most important chemistry in a rubber vulcanizate. Degree and type of crosslinks of the vulcanizate determine its physical properties. Change of crosslink density and deformation of a rubber vulcanizate by thermal aging were studied using natural rubber (NR) vulcanizates with various cure systems (conventional, semi-EV, and EV) and different cure times (under-, optimum-, and overture). All the NR vulcanizates were deformed by the thermal aging at 60-100 $^{\circ}C.$ The higher the aging temperature is, the more degree of the deformation is. The undercured NR vulcanizates after the thermal aging were deformed more than the optimumand overcured ones. The NR vulcanizates with the EV cure system were less deformed than those with the conventional and semi-EV cure systems. The deformation of the NR vulcanizates was found to be due to change of the crosslink density of the vulcanizates. The crosslink densities of all the vulcanizates after the extraction of organic materials were also changed by the thermal ging. The sources to change the crosslink densities of the vulcanizates by the thermal aging were found to be dissociation of the existing sulfur crosslink and the formation of new crosslinks by free sulfur, reaction products of curing agents, and pendent sulfide groups.

A Study on Cooling for High Thermal Density Electronics Using Heat Sink and Heat Spreader (히트싱크 및 히트 스프레더를 이용한 고밀도 발열 전자부품의 방열 구조에 관한 연구)

  • Kang, Sung-Wook;Kim, Ho-Yong;Kim, Jin-Cheon
    • Proceedings of the KSME Conference
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    • 2008.11b
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    • pp.2286-2291
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    • 2008
  • Some electronics component, which is adopted as components of antenna for radar or satellite system and used for amplifying signals to transmit, is accompanied by very significant heat dissipation levels because of the inefficiencies inherent in radio frequency wave generation. So, proper cooling performance for that system is base requirement for thermal design. On this paper, we applied heat spreading structures to reduce thermal density and find the optimum values of heat sink design factors through theoretically, numerically and evaluated by product test. As the results, the performance of the cooling system shows the propriety of cooling high density heat dissipation electronics components.

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Insulation Properties of CLC according to Mixing Ratio of EPS Bead (EPS Bead 혼입비율에 따른 CLC의 단열특성)

  • Lee, Jeong-Taek;Lee, Sang-Soo
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2023.05a
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    • pp.45-46
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    • 2023
  • CLC is used as a filling material for many buildings, and according to energy saving design standards, CLC also requires insulation performance. However, it shows lower insulation performance compared to organic insulation, so additional research is needed. Therefore, in this study, the insulation properties of CLC were analyzed by incorporating EPS beads with high insulation performance into CLC. In this experiment, EPS beads and blast furnace slag were replaced, and W/B was fixed at 33%. The EPS Bead mixing ratio was divided into 5 levels: 0, 0.5, 1.0, 1.5, 2.0 (%), and the experimental items were measured for apparent density and thermal conductivity. As a result of the experiment, the apparent density and thermal conductivity tended to decrease as the mixing ratio of EPS beads increased. It is judged that the density decreased due to the low density and the micropores inside, and the thermal conductivity also decreased.

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DENSITY STRUCTURE AND STABILITY OF THE SUBCOMPONENTS IN GIANT MOLECULAR CLOUD COMPLEXES

  • Yoo, Chin-Woo;Hong, Seung-Soo
    • Journal of The Korean Astronomical Society
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    • v.19 no.1
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    • pp.33-49
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    • 1986
  • Radial distribution of internal density has been determined for thirteen subclouds in the three giant molecular cloud complexes accompanying Mon OB1, Mon OB2 and CMa OB1 associations, We modeled their radial density structures with the density distribution of isothermal gas spheres. Most of the subclouds, nine out of the thirteen, are well described by isothermal spheres of single component; while the rest four require an additional component. Total mass and potential energy of each subcloud are also derived from the radial density structure; thermal energy and internal velocity dispersion required for sustaining the density structure are deduced from the isothermal gas model. Our derived masses of the clouds are comparable to the values determined by Blitz (1978) under LTE assumption. This agreement suggests that the correction factor for non-LTE effect on mass-estimate is not far from unity. The ratio of the gravitational potential energy to the kinetic energy of thermal motion is as large as 250; hence the thermal motion alone cannot support these clouds against the gravity. Being supported by turbulence motion with velocities of six to seven times the thermal velocity, the clouds of one-component type seem to be in equilibrium with the gravity; while the clouds of two-component type are likely to be in the stage of gravitational collapse.

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Characterizations of Interface-state Density between Top Silicon and Buried Oxide on Nano-SOI Substrate by using Pseudo-MOSFETs

  • Cho, Won-Ju
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.5 no.2
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    • pp.83-88
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    • 2005
  • The interface-states between the top silicon layer and buried oxide layer of nano-SOI substrate were developed. Also, the effects of thermal treatment processes on the interface-state distributions were investigated for the first time by using pseudo-MOSFETs. We found that the interface-state distributions were strongly influenced by the thermal treatment processes. The interface-states were generated by the rapid thermal annealing (RTA) process. Increasing the RTA temperature over $800^{\circ}C$, the interface-state density considerably increased. Especially, a peak of interface-states distribution that contributes a hump phenomenon of subthreshold curve in the inversion mode operation of pseudo-MOSFETs was observed at the conduction band side of the energy gap, hut it was not observed in the accumulation mode operation. On the other hand, the increased interface-state density by the RTA process was effectively reduced by the relatively low temperature annealing process in a conventional thermal annealing (CTA) process.

Ozone Density Estimation and Stable Supply in the Thin Film Growth

  • Lim, Jung-Kwan;Park, Yong-Pil;Oh, Geum-Gon
    • Transactions on Electrical and Electronic Materials
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    • v.2 no.2
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    • pp.42-45
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    • 2001
  • An ozone condensation system is evaluated from the viewpoint of an ozone supplier for Bi-superconductor thin film growth. An ozone condenser by a selective adsorption on the silica gel surface is constructed. Ozone density is evaluated by three methods; ultraviolet absorption, thermal decomposition and Q-mass analyzing methods. Thermal decomposition method is found to be available to the density evaluation from dilute to highly condensed ozone. The highest ozone density condensed by the adsorption method is evaluated to be 97 mol%.

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The Lithium Ion Battery Technology

  • Lee, Ki-Young
    • Carbon letters
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    • v.2 no.1
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    • pp.72-75
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    • 2001
  • The performance of Li-ion system based on $LiCoO_2$ and Graphite is well optimized for the 3C applications. The charge-discharge mode, the manufacturing process, the cell performance and the thermal reactions affecting safety has been explained in the engineering point of view. The energy density of the current LIB system is in the range of 300~400 Wh/l. In order to achieve the energy density higher than 500 Wh/l, the active materials should be modified or changed. Adopting new high capacity anode materials would be effective to improve energy density.

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Mechanical and Thermal Properties of Needle Punched Nonwoven Carbon/Phenol Composite (니들펀칭 부직포 탄소/페놀 복합재료의 역학적 성질 및 열적 성질에 관한 연구)

  • 정경호;강태진
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.50-53
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    • 2000
  • The effect of punching density on the mechanical and thermal properties of nonwoven needle-punched carbon/phenol composite was studied. The carbonized preforms were farmed into composites with phenol resin. The interlaminar shear, tensile and flexural strengths were increased with increasing punching density. However, excessive punching density decreased interlaminar shear and tensile strengths. Erosion rate of carbon/phenol composite was decreased with increasing punching density

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Thermal Conductivity Measurement of Sand-Water Mixtures Used for Backfilling Materials of Vertical Boreholes or Horizontal Trenches (지중열교환기 수직 보어홀 및 수평 트렌치 뒤채움재로서 모래-물 혼합물의 열전도도 측정)

  • Sohn, Byong-Hu
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.20 no.5
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    • pp.342-350
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    • 2008
  • This paper presents the results of a laboratory study on the thermal conductivity of sand (silica, quartzite, limestone and masonry sand)-water mixtures used in ground heat exchanger backfilling materials. Nearly 150 tests were performed in a thermal conductivity measuring system (TPSYS02) to characterize the relationships between the thermal conductivity of mixtures and the water content. The results show that the thermal conductivity of mixtures increases with increasing dry density and with increasing water content. The results also show that for constant water contents and a dry density value, the thermal conductivity of mixtures increases with increasing thermal conductivity of solid particles. The measurement results were also compared with the most widely used empirical prediction models for the thermal conductivity of soils.

Predictions of Phonon and Electron Contributions to Thermal Conductivity in Silicon Films with Varying Doping Density (박막 실리콘 내 도핑 농도 변화에 따른 포논과 전자의 열전도율 기여도에 대한 수치해석)

  • Jin, Jae-Sik;Lee, Joon-Sik
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2182-2187
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    • 2007
  • The relative contributions of phonon and electron to the thermal conductivity of silicon film with varying doping density are evaluated from the modified electron-phonon interaction model, which is applicable to the micro/nanoscale simulation of energy transport between energy carriers. The thermal conductivities of intrinsic silicon layer thicknesses from 20 nm to 500 nm are calculated and extended to the variation in n-type doping densities from 1.0 ${\times}$ $10^{18}$ to 5.0 ${\times}$ $10^{20}$ $cm^{-3}$, which agree well with the experimental data and theoretical model. From simulation results, the phonon and electron contributions to thermal conductivity are extracted. The electron contribution in the silicon is found to be not negligible above $10^{19}$ $cm^{-3}$, which can be classified as semimetal or metal by the value of its electrical resistivity at room temperature. The thermal conductivity due to electron is about 57.2% of the total thermal conductivity at doping concentration 5.0 ${\times}$ $10^{20}$ $cm^{-3}$ and silicon film thickness 100 nm.

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