• Korean Journal of Materials Research
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• v.23 no.3
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• pp.199-205
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• 2013

The mechanical properties and microstructures of aluminum-matrix composites fabricated by the dispersion of fine alumina particles less than $20{\mu}m$ in size into 6061 aluminum alloys are investigated in this study. In the as-quenched state, the yield stress of the composite is 40~85 MPa higher than that of the 6061 alloy. This difference is attributed to the high density of dislocations within the matrix introduced due to the difference in the thermal expansion coefficients between the matrix and the reinforcement. The difference in the yield stress between the composite and the 6061 alloy decreases with the aging time and the age-hardening curves of both materials show a similar trend. At room temperature, the strain-hardening rate of the composite is higher than that of the 6061 alloy, most likely because the distribution of reinforcements enhances the dislocation density during deformation. Both the yield stress and the strain-hardening rate of the T6-treated composite decrease as the testing temperature increases, and the rate of decrease is faster in the composite than in the 6061 alloy. Under creep conditions, the stress exponents of the T6-treated composite vary from 8.3 at 473 K to 4.8 at 623 K. These exponents are larger than those of the 6061 matrix alloy.

• Proceedings of the Korean Nuclear Society Conference
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• 2002.05a
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• pp.242-242
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• 2002

Two MIMAS MaX fuel rods base-irradiated in a commercial PWR have been reinstrumented and irradiated at a test reactor. The fabrication data for two MOX roda are characterized together with base irradiation information. Both Rods were reinstrumented to be fitted with thermocouple to measure centerline temperature of fuel. One rod was equipped with pressure transducer for rod internal pressure whereas the other with cladding elongation detector. The post irradiation examinations for various items were performed to determine fuel and cladding in-pile behavior after base irradiation. By using well characterized fabrication and re-instrumentation data and power history, the fuel performance code, COSMOS, is verified with measured in-pile and PIE information. The COMaS code shows good agreement for the cladding oxidation and creep, and fission gas release when compared with PIE dad a after base irradiaton. Based on the re-instrumention information and power history measured in-pile, the COSMOS predicts re-instrumented in-pile thermal behaviour during power up-ramp and steady operation with acceptable accuracy. The rod internal pressure is also well simulated by COSMOS code. Therfore, with all the other verification by COSMOS code up to now, it can be concluded that COSMOS fuel performance code is applicable for the design and license for MaX fuel rods up to high burnup.

• Journal of Powder Materials
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• v.31 no.3
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• pp.255-262
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• 2024

Nano-oxide dispersion-strengthened (ODS) superalloys have attracted attention because of their outstanding mechanical reinforcement mechanism. Dispersed oxides increase the material's strength by preventing grain growth and recrystallization, as well as increasing creep resistance. In this research, atomic layer deposition (ALD) was applied to synthesize an ODS alloy. It is useful to coat conformal thin films even on complex matrix shapes, such as nanorods or powders. We coated an Nb-Si-based superalloy with TiO₂ thin film by using rotary-reactor type thermal ALD. TiO₂ was grown by controlling the deposition recipe, reactor temperature, N₂ flow rate, and rotor speed. We could confirm the formation of uniform TiO₂ film on the surface of the superalloy. This process was successfully applied to the synthesis of an ODS alloy, which could be a new field of ALD applications.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Nuclear Engineering and Technology
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• v.20 no.2
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• pp.88-104
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• 1988

The FUel Rod Analysis(FURA) code is developed using two-dimensional finite element methods for axisymmetric and plane stress analysis of fuel rod. It predicts the thermal and mechanical behavior of fuel rod during normal and load follow operations. To evaluate the exact temperature distribution and the inner gas pressure, the radial deformation of pellet and clad, the fission gas release are considered over the full-length of fuel rod. The thermal element equation is derived using Galerkin's techniques. The displacement element equation is derived using the principle of virtual works. The mechanical analysis can accommodate various components of strain: elastic, plastic, creep and thermal strain as well as strain due to swelling, relocation and densification. The 4-node quadratic isoparametric elements are adopted, and the geometric model is confined to a half-pellet-height region with the assumption that pellet-pellet interaction is symmetrical. The pellet cracking and crack healing, pellet-cladding interaction are modelled. The Newton-Raphson iteration with an implicit algorithm is applied to perform the analysis of non-linear material behavior accurately and stably. The pellet and cladding model has been compared with both analytical solutions and experimental results. The observed and predicted results are in good agreement. The general behavior of fuel rod is calculated by axisymmetric system and the cladding behavior against radial crack is used by plane stress system. The sensitivity of strain aging of PWR fuel cladding tube due to load following is evaluated in terms of linear power, load cycle frequency and amplitude.

• Journal of Korea Foundry Society
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• v.38 no.5
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• pp.103-110
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• 2018

The effects of a heat treatment on the carbide formation behavior and mechanical properties of the cobalt-based superalloy X-45 were investigated here. Coarse primary carbides formed in the interdendritic region in the as-cast specimen, along with the precipitation of fine secondary carbides in the vicinity of the primary carbides. Most of the carbides formed in the interdendritic region were dissolved into the matrix by a solution treatment at $1274^{\circ}C$. Solutionizing at $1150^{\circ}C$ led to the dissolution of some carbides at the grain boundaries, though this also caused the precipitation of fine carbides in the vicinity of coarse primary carbides. A solution treatment followed by an aging treatment at $927^{\circ}C$ led to the precipitation of fine secondary carbides in the interdendritic region. Very fine carbides were precipitated in the dendritic region by an aging heat treatment at $927^{\circ}C$ and $982^{\circ}C$ without a solution treatment. The hardness value of the alloy solutionized at $1150^{\circ}C$ was somewhat higher than that in the as-cast condition; however, various aging treatments did not strongly influence the hardness value. The specimens as-cast and aged at $927^{\circ}C$ showed the highest hardness values, though they were not significantly affected by the aging time. The specimens aged only at $982^{\circ}C$ showed outstanding tensile and creep properties. Thermal exposure at high temperatures for 8000 hours led to the precipitation of carbide at the center of the dendrite region and an improvement of the creep rupture lifetimes.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Asian-Australasian Journal of Animal Sciences
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• v.16 no.2
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• pp.269-276
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• 2003

We studied the gel properties of porcine collagen with microbial transglutaminase (MTGase) as a catalyst. A creep meter was used to measure the mechanical properties of gel. The results showed samples with high concentration of MTGase gelled faster than those with a low concentration of MTGase. The gel strength increased with incubation time and the peaks of breaking strength for 0.1, 0.2 and 0.5% MTGase were obtained at 40, 20 and 10 min incubation time, respectively. According to SDS-PAGE, the MTGase was successfully created a collagen polymer with an increase in molecular weight, whereas no change in formation was shown without MTGase. The sample with 0.5% MTGase began to polymerize after 10 or 20 min incubation at $50^{\circ}C$, and complete polymerization occurred after 40-60 min incubation. Scanning electron microscopic analysis revealed that the gel of porcine collagen in the presence of MTGase produced an extremely well cross-linked network. The differential scanning calorimetric analysis showed the peak thermal transition of porcine collagen gel was at $36^{\circ}C$, and that with MTGase no peak was detected during heating from 20 to $120^{\circ}C$. The melting point of porcine collagen gel could be controlled by MTGase concentration, incubation temperature and protein concentration. Knowledge of the structural and physicochemical properties of porcine collagen gel catalyzed with MTGase could facilitate their use in food products.

• Journal of the Korea institute for structural maintenance and inspection
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• v.20 no.6
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• pp.91-97
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• 2016

Evaluation on the test of actual concrete member to confirm the fire resistance of the concrete member using ultra-high strength concrete is required. However, test equipment which has large loading capacity is needed to the actual member experiment. So, many researchers evaluated the fire performance through analytical studies using the material models. This study experimentally evaluated strain properties on ultra-high-strength concrete of 80, 130 and 180 MPa with heating and examined to apply the existing strain model about ultra-high-strength concrete. As a results, constants are drawn by method of least squares applying experimental values and calculated values by the existing strain model, it proposed strain model that can be applied to ultra-high-strength concrete.