• 설비공학논문집
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• 제10권6호
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• pp.721-731
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• 1998

Recently, many researchers are studying the relation between thermal environment and human comfort. The purpose of this study was to obtain basic data which are necessary to determine the thermal comfort sensation and physiological responses for men in winter indoor environment. From January to February 1998, subject experiment was 40 times proceeded under twenty different conditions of air temperature and relative humidity with early-twenty male university students. We examined subjective evaluation, Electrocardiogram(ECG), Electroencephalogram(EEG) of subjects. The results of this study can be summarized as follows : The comfort zone of people in winter was achieved at Standard new effective temperature($SET^*$) $ 25.2^{\circ}C$, PMV range was obtained by Fanger's statistical calculation was －0.27＜PMV＜＋0.62, TSV range obtained subjects vote was －0.76＜TSV＜＋0.36. The largest difference of skin temperature was found at the calf area as air temperature changes. vote rate of human body presented calflongrightarrowheadlongrightarrowforearmlongrightarrowchestlongrightarrowabdo men in turn. Heart rate was decreased at low $SET^*$ and heart rate was increased at high $SET^*$ But there was no change at EEG.

• 설비공학논문집
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• 제22권6호
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• pp.413-418
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• 2010

The amount of heat loss of a refrigerator through the gasket is nearly 30% of total refrigerator heat loss. In this paper, quantitative evaluation for the effects of various effort to reduce heat losses through the gasket. The first trial is to extend the inner gasket to prevent the heat loss flowing from the inner of refrigerator. The effects of thermal conductivity changes of gasket and magnet are investigated by the numerical heat transfer analysis. The position change of hot line is also examined in the present research. From the present result of the numerical simulation of heat transfer, we are able to reduce the heat loss about 20~40% by using inner gasket extension. The reducing of thermal conductivity of gasket is considerable in the heat loss reduction. On the other hand, the thermal conductivity change of magnet has no apparent effect in heat loss reduction. The position change of hot line has considerable positive effect in the reduction of heat loss near gasket region.

• 대한화학회지
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• 제6권2호
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• pp.158-161
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• 1962

Three kinds of acid clay are chosen as samples; sample-I is the Korean acid clay, Sample-II is prepared by heating the mixure of the Korean acid clay with 20% $H_2SO_4$ for 4 hrs., and the sample-III, the reference sample, is the Japanes acid clay supplied by Katayama Chem. Co.. 15 samples are prepared by heating them at temperatures of $100^{\circ}C$, $300^{\circ}C$, $500^{\circ}C$, $700^{\circ}C$, and $900^{\circ}C$ for 6 hrs. separately.The adsorption experiments are carried out on these samples using bromphenol blue water soln.(conc., 0.001%) as adsorbate. It is found that the degree of decoloration depends upon the temperature of thermal treatment, i.e., the higher the temperature the lower the degree of decoloration is. At any specified temperature of thermal treatment, the degree of decoloration is in following order: sample II>sample I>sample III.The X-ray photographs of the samples show that the intensities of a few specified lines decrease with increasing temperatures of thermal treatment.

• 한국정밀공학회지
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• 제20권10호
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• pp.183-190
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• 2003

Major device failures such as die cracking, interfacial delamination and warpage in flip chip packages are due to excessive heat and thermal gradients- There have been significant researches toward understanding the thermal performance of electronic packages, but the majority of these studies do not take into account the combined effects of thermo-mechanical interactions of the different package constituents. This paper investigates the thermo-mechanical performance of flip chip package constituents based on the finite element method with thermo-mechanically coupled elements. Delaminations with different lengths between the silicon die and underfill resin interfaces were introduced to simulate the defects induced during the assembly processes. The temperature gradient fields and the corresponding stress distributions were analyzed and the results were compared with isothermal case. Parametric studies have been conducted with varying thermal conductivities of the package components, substrate board configurations. Compared with the uniform temperature distribution model, the model considering the temperature gradients provided more accurate stress profiles in the solder interconnections and underfill fillet. The packages with prescribed delaminations resulted in significant changes in stress in the solder. From the parametric study, the coefficients of thermal expansion and the package configurations played significant roles in determining the stress level over the entire package, although they showed little influence on stresses profile within the individual components. These observations have been implemented to the multi-board layer chip scale packages (CSP), and its results are discussed.

• 한국전기전자재료학회논문지
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• 제20권5호
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• pp.443-449
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• 2007

The structural and thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ electrode during cycling process was studied. The sample was prepared by simple combustion method. Although there were irreversible changes on the initial cycle, O3 stacking for $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ structure was retained during the first and subsequent cycling process. Impedance of the test cell was decreased after the first charge-discharge process, which would be of benefit to intercalation and deintercalation of lithium ion on subsequent cycling. As expected, cycling test for 75 times increased impedance of the cell a little, instead, thermal stability of $Li[Co_{0.1}Ni_{0.15}Li_{0.2}Mn_{0.55}]O_2$ was improved. Moreover, based on DSC analysis, the initial exothermic peak was shifted to high temperature range and the amount of heat was also decreased after cycling test, which displayed that thermal stability was not deteriorated during cycling.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 춘계학술대회논문집B
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• pp.949-955
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• 2000

Numerical study with detailed chemistry has been conducted to investigate the NOx formation and structure in $CH_4/Air-CO_2$ counterflow diffusion flames. The importance of radiation effect is identified and the role of $CO_2$ addition is addressed to thermal and chemical reaction effects, which can be precisely specified through the introduction of an imaginary species. Also NO separation technique is utilized to distinguish the contribution of thermal and prompt NO formation mechanisms. The results are as follows : The radiation effect is dominant at low strain rates and it is intensified by $CO_2$ addition. Thermal effect mainly contributes to the changes in flame structure and the amount of NO formation but the chemical reaction effect also cannot be neglected. It is noted that flame structure is changed considerably due to the addition of $CO_2$ in such a manner that the path of methane oxidation prefers to take $CH_4 {\rightarrow}CH_3{\rightarrow}C_2H_6{\rightarrow}C_2H_5$ instead of $CH_4 {\rightarrow}CH_3{\rightarrow}CH_2{\rightarrow}CH$. At low strain rate(a=10) the reduction of thermal NO is dominant with respect to reduction rate, but that of prompt NO is dominant with respect to total amount.

• 대한의용생체공학회:의공학회지
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• 제9권1호
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• pp.47-60
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• 1988

N-n-Propylacrylamide는 n-propyl bromide와 acrylamide로 부터 합성하였고, 합성된 N-n-propylacrylamide를 THF용매속에서 개시제로 AIBN을 사용하여 $60^{\circ}C$에서 acrylamide와 공중합시켰다. 그리고 합성된 단량체와 공중합체는 NMR과 IR에 의하여 확인하였다.

• 한국도로학회논문집
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• 제4권1호
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• pp.171-181
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• 2002

강상판의 포장에 사용되는 구스아스팔트는 시공시 $220^{\circ}C$에서 $260^{\circ}C$의 고온 상태에서 시공되기 때문에 강상판에 과도한 응력 및 변형을 발생시킬 수 있다. 따라서 구스아스팔트의 포설시 강상판에 미치는 열영향을 평가하고 그 영향의 최소화를 위한 포설폭과 패턴을 선정하여야 할 필요가 있다. 본 연구에서는 영종대교 상로도로의 구스아스팔트에 의한 열영향을 평가하기 위하여 일련의 수치해석을 수행하였으며 그 결과를 계측결과와 비교하여 수치해석방법의 타당성을 검증하고, 구스아스팔트가 강상판에 미치는 열영향을 검토하였다.

• 한국재료학회지
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• 제14권12호
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• pp.870-875
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• 2004

Heat flow characteristics in the newly developed Wave Heat Sink were analyzed under natural and forced convections by Icepak program using the finite volume method. Temperature distribution and thermal resistance of Wave Heat Sink with/without air vent hole on the top of fin were compared with those of a commercial Al extruded heat sink(Intel Heat Sink). Under the natural convection, the maximum temperature was $45.1^{\circ}C$ in the air vent hole typed Wave Heat Sink, which was superior to that of Intel Heat Sink. The thermal resistance was $2.51^{\circ}C/W$ in the air vent hole typed Wave Heat Sink, and it changed to $2.65^{\circ}C/W\;and\;2.16^{\circ}C/W$ with changes of gravity direction and fin height, respectively. Under the forced convection, the maximum temperature became lower than that under the natural convection. In addition, the thermal resistance lowered in the air vent hole typed Wave Heat Sink with higher fin height and it decreased with increasing the air flux.

• 한국염색가공학회지
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• 제24권1호
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• pp.39-44
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• 2012

To improve flame retardation of poly(ethylene terephthalate) (PET) against burning, resorcinol bis(diphenyl phosphate) (RDP), phosphorous containing flame retardant, was incorporated into PET backbone by radical reaction pathway. Radical endcapping of PET with RDP was confirmed by spectroscopic and thermal analysis. From 400 MHz $^{31}P$ solid state FT-NMR spectrum of PET with RDP (PET-RDP), phosphorus spectra peak in RDP was found at ca. -10 ppm. Furthermore, P-C bond stretching vibration peaks were found ca. $530cm^{-1}$ in FT-IR spectrums of PET-RDP. These results indicated that RDP can be chemically bound at the ends of PET by radical addition method. Thermal characteristics of pure PET (pPET) and PET-RDP were measured and evaluated by TGA thermal analysis. There was not significant changes in thermal characteristics of PET-RDP compared to that of pPET.