• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2005년도 전기학술대회논문집
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• pp.1102-1107
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• 2005

The analysis of the thermal boundary resistance is very important in the both cases of microscale and macroscale systems because it plays a role of thermal barrier against a heat flow. Especially, since fairly large heat energy is generated in microscale or nanoscale systems with electronic chips, the thermal boundary resistance is a key factor to guarantee the performance of those devices. In this study, the transfer of the oscillator's motion information with 2 degrees of freedom is investigated for clarifying the mechanism of a thermal boundary resistance. We found that the transfer of the oscillator's motion information is defined as a cross-correlation coefficient and the magnitude of it determines the temperature jump over a solid interface. That is, the temperature jump over an interface increases as the magnitude of a cross-correlation coefficient decreases and vice versa.

• 대한기계학회논문집
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• 제19권1호
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• pp.193-201
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• 1995

The role of thermal contact resistance between a casting and a metal mold as well as natural convection in the melt during solidification of a pure metal is numerically studied. Numerical simulation is performed for a rectangular cavity using the coordinate transformation by boundary-fitted coordinate and pure aluminum is used as the phase- change material. The influences of thermal contact resistance on the interface shape and position, solidified volume fraction, temperature field and local heat transfer are investigated.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1382-1387
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• 2004

From the viewpoint of a macro state, there is no thermal boundary resistance (TBR) at an interface if both surfaces at an interface are perfectly contacted. However, recent molecular dynamics (MD) studies reported that there still exists the TDR at the interface in an ideal epitaxial superlttice. Our previous studies suggested the model to predict the TBR not only quantitatively also qualitatively in superlattices. The suggested model was based on the classical theory of a wave reflection, and provided highly satisfactory results for an engineering purpose. However, it was not the complete model because our previous model was derived by considering only the effects from a mass ratio and a potential ratio of two species. The interaction of two species presented by the Lennard-Jones (L-J) potential is governed by the mutual ratio of the masses, the potential well depths, and the diameters. In this study, we performed the preliminary simulations to investigate the effect resulting from the diameter ratio of two species for the completion of our model and confirmed that it was also a ruling factor to the TBR at an interface in superlattices.

• Journal of Mechanical Science and Technology
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• 제19권6호
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• pp.1338-1346
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• 2005

Effects of thermal contact resistance between heater and susceptor, susceptor and graphite board in a MOCVD reactor on temperature distribution and film growth rate were analyzed. One-dimensional thermal resistance model considering thermal contact resistance and heat transfer area was made up at first to find the temperature drop at the surface of graphite board. This one-dimensional model predicted the temperature drop of 18K at the board surface. Temperature distribution of a reactor wall from the three-dimensional computational fluid dynamics analysis including the gap at the wafer position showed the temperature drop of 20K. Film growth rates of InP and GaAs were predicted using computational fluid dynamics technique with chemical reaction model. Temperature distribution from the three-dimensional heat transfer calculation was used as a thermal boundary condition to the film growth rate simulations. Temperature drop due to the thermal contact resistance affected to the GaAs film growth a little but not to the InP film growth.

• 한국표면공학회지
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• 제46권6호
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• pp.235-241
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• 2013

In this study, the effects of alloying elements and thermal aging on the contact resistance of electroplated gold alloy layers were investigated by surface analysis using X-ray photoelectron spectroscopy (XPS). The contact resistance of Au-Ag alloy was lower than that of Au-Ni or Au-Co alloy after thermal aging. The XPS results show that nickel and oxygen present as nickel oxides such as NiO and $Ni_2O_3$ on the surface of gold layers after thermal aging. The increase in the contact resistance after thermal aging is attributable to the nickel oxide layer formed on the surface of the gold layers. The content of nickel diffused from the underlayer during the thermal aging was high in the order of Au-Co, Au-Ni and Au-Ag alloy because the area of grain boundary was large in the order of Au-Ag, Au-Ni and Au-Co alloy.

• 대한기계학회논문집B
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• 제24권12호
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• pp.1635-1643
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• 2000

The present work investigates a heat transfer phenomenon at the interface between a porous medium and an impermeable wall. In an effort to appropriately describe the heat transfer phenomenon at the interface, the heat transfer at the interface between the microchannel heat sink, which is an ideally organized porous medium, and the finite-thickness substrate is examined. From the examination, it is clarified that the he heat flux distribution at the interface is not uniform for the impermeable wall with finite thickness. On the other hand, the first approach, based on the energy balance for the representative elementary volume in the porous medium, is physically reason able. When the first approach is applied to the thermal boundary condition, and additional boundary condition based on the local thermal equilibrium assumption at the interface is used. This additional boundary condition is applicable except for the very th in impermeable wall. Hence, for practical situations, the first approach in combination with the local thermal equilibrium assumption at the interface is suggested as an appropriate thermal boundary condition. In order to confirm our suggestion, convective flows both in a microchannel heat sink and in a sintered porous channel subject to a constant heat flux condition are analyzed. The analytically obtained thermal resistance of the microchannel heat sink and the numerically obtained overall Nusselt number for the sintered porous channel are shown to be in close agreement with available experimental results when our suggestion for the thermal boundary conditions is applied.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 2000년도 Proceedings of 2000 International Nano Crystals/Ceramics Forum and International Symposium on Intermaterials
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• pp.179-193
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• 2000

Aluminium titanate (Al₂TiO5) with an excellent thermal shock resistant and a low the expansion coefficient was obtained by solid solution with MgO, SiO₂, and ZrO₂ in the Al₂TiO5 lattice or in the grain boundary solution through electrofusion in an arc furnace. However, these materials have low mechanical strength due to the presence of microcracks developed by a large difference in thermal expansion coefficients along crystallographic axes. Pure Al₂TiO5 tends to decompose into α-Al₂O₃ and TiO₂-rutile in the temperature range of 750-1300℃ that rendered it apparently useless for industrial applications. Several thermal shock tests were performed: Long therm thermal annealing test at 1100℃ for 100h; and water quenching from 950 to room temperature (RT). Cyclic thermal expansion coefficients up to 1500℃ before and after decomposition tests was also measured using a dilatometer, changes in the microstructure, thermal expansion coefficients, Young's modulus and strengths were determined. The role of microcracks in relation to thermal shock resistance and thermal expansion coefficient is discussed.

• 한국항공우주학회지
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• 제49권5호
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• pp.355-363
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• 2021

리오셀계 탄소/페놀릭 복합재료의 항공우주용 내열 부품 적용 가능성을 확인하기 위하여 내열성능 평가 및 열 해석을 수행하였다. 탄소/페놀릭의 열반응 평가는 내열성능평가모터(Thermal Protection Evaluation Motor, TPEM)로 수행되었다. 본 논문에서는 열 해석을 위해 유체의 경계층 해석을 고려한 경계층 적분 코드와 삭마 및 열분해를 고려한 MSC-Marc 2018 코드를 사용하였다. 추진기관의 압력 곡선, 연소 시험 후 절개된 목삽입재 시편을 통하여 삭마 및 단열성능을 분석하였고, 리오셀계 탄소/페놀릭 복합재료의 열반응은 레이온계 탄소/페놀릭 재료와 유사하였다. 연소시험을 통한 결과를 바탕으로 국산 리오셀계 탄소/페놀릭의 항공우주용 내열 부품으로의 적용 가능성을 확인하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.172-174
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• 2003

In this paper, a 2D axisymmetric model of thermoelectric Finite Element Method (FEM) is developed to analyze the transient thermal behavior of Resistance Spot Welding (RSW) process using commercial software, called ANSYS. The determination of the contact resistance at the faying surface is moderately simplified to reduce the calculating time, while the temperature dependent material properties, phase change and convectional boundary conditions are taken account fur the improvement of the calculated accuracy. The thermal history of the whole process (including cooling) and temperature distributions for any position in the weldment is obtained through the analysis.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 춘계학술대회 논문집
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• pp.635-640
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• 1996

A thermo-elastic system in the production machine has highly nonlinear dynamic characteristics. In general, the finite element method is utilized for accurate analysis. However, it requires large computing time. Thus, thermo-elastic systems are usuallymodeled as electric and fluid system using lumped para,eter. In this paper. we propose the bondgraph model and transient simulation methodology of thermo-elastic system in consideration of various boundary and joint contact conditions. Consequently, the proposed method ensures a possibility of its on-line compensation about undesirable phenomena by using real time estimate process and electronic cooling device for thermal appropriate behavior. Thermo-elastic model consisting of bush and shaft including contact condition is presented.