• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.2
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• pp.157-162
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• 2010

This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with $300{\mu}m$ bump pitch had a longer thermal fatigue life than solder joints with $150{\mu}m$ bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Applied Chemistry for Engineering
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• v.21 no.2
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• pp.115-128
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• 2010

Recently the use heat sink material grows where the polymer filled with thermal conductive fillers effectively dissipates heat generated from electronic components. Therefore the management of heat is directly related to the lifetime of electronic devices. For the purpose of improving thermal conductivity of composites, fillers with excellent thermaly conductive behavior are commonly used. Polymer composites filled with thermally conductive particles have advantages due to their processibility, cheap price, and durability to the corrosion. This paper aims to review the thermal interface materials and their model equations for predicting the thermal conductivity of polymer composites, and to introduce the commercial thermal conductive fillers and their applications.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.10 no.4
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• pp.281-294
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• 2012

The current status of the computer codes for the analysis of coupled thermal-hydrological-mechanical behavior occurred in a high-level waste repository was investigated. Based on the reported results on the comparison between the predictions using the computer codes and the experimental data from the in-situ tests, the reliability of the existing computer codes was analyzed. The presented codes simulated considerably well the coupled thermal-hydrological-mechanical behavior in the near-field rock of the repository without buffer, but the predictions for the engineered barrier system of the repository located at saturated hard rock were not satisfactory. To apply the current thermal-hydrological-mechanical models to the assessment of the performance of engineered barrier system, a major improvement on the mathematical models which analyze the distribution of water content and total pressure in the buffer is required.

• Journal of Electrical Engineering and Technology
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• v.11 no.3
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• pp.781-789
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• 2016

Busbar has been used as electric conductor within extra high voltage (EHV) gas insulated switchgear (GIS), which makes EHV GIS higher security, smaller size and lower cost. However, the main fault of GIS is overheating of busbar connection parts, circuit breaker and isolating switch contact parts, which has been already restricting development of GIS to a large extent. In this study, a coupled magneto-flow-thermal analysis is used to investigate the thermal properties of GIS busbar in steady-state. A three-dimensional (3-D) finite element model (FEM) is built to calculate multiphysics fields including electromagnetic field, flow field and thermal field in steady-state. The influences of current on the magnetic flux density, flow velocity and heat distribution has been investigated. Temperature differences of inner wall and outer wall are investigated for busbar tank and conducting rod. Considering the end effect in the busbar, temperature rise difference is compared between end sections and the middle section. In order to obtain better heat dissipation effect, diameters of conductor and tank are optimized based on temperature rise simulation results. Temperature rise tests have been done to validate the 3-D simulation model, which is observed a good correlation with the simulation results. This study provides technical support for optimized structure of the EHV GIS busbar.

• Wind and Structures
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• v.27 no.6
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• pp.369-380
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• 2018

In this research work, nonlinear thermal buckling behavior of functionally graded (FG) plates is explored based a new higher-order shear deformation theory (HSDT). The present model has just four unknowns, by using a new supposition of the displacement field which enforces undetermined integral variables. A shear correction factor is, thus, not necessary. A power law distribution is employed to express the disparity of volume fraction of material distributions. Three kinds of thermal loading, namely, uniform, linear, and nonlinear and temperature rises over z-axis direction are examined. The non-linear governing equations are resolved for plates subjected to simply supported boundary conditions at the edges. The results are approved with those existing in the literature. Impacts of various parameters such as aspect and thickness ratios, gradient index, type of thermal load rising, on the non-dimensional thermal buckling load are all examined.

• Structural Engineering and Mechanics
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• v.47 no.1
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• pp.1-25
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• 2013

A combined thermal and mechanical action in roller compacted concrete (RCC) dam analysis is carried out using a three-dimensional finite element method. In this work a numerical procedure for the simulation of construction process and service life of RCC dams is presented. It takes into account the more relevant features of the behavior of concrete such as hydration, ageing and creep. A viscoelastic model, including ageing effects and thermal dependent properties is adopted for the concrete. The different isothermal temperature influence on creep and elastic modulus is taken into account by the maturity concept, and the influence of the change of temperature on creep is considered by introducing a transient thermal creep term. Crack index is used to assess the risk of occurrence of crack either at short or long term. This study demonstrates that, the increase of the elastic modulus has been accelerated due to the high temperature of hydration at the initial stage, and consequently stresses are increased.

• Structural Engineering and Mechanics
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• v.90 no.1
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• pp.1-18
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• 2024

The present study conducts a thorough analysis of thermal vibrations in functionally graded porous nanocomposite beams within a thermal setting. Investigating the temperature-dependent material properties of these beams, which continuously vary across their thickness in accordance with a power-law function, a finite element approach is developed. This approach utilizes a nonlocal strain gradient theory and accounts for a linear temperature rise. The analysis employs four different patterns of porosity distribution to characterize the functionally graded porous materials. A novel two-variable shear deformation beam nonlocal strain gradient theory, based on trigonometric functions, is introduced to examine the combined effects of nonlocal stress and strain gradient on these beams. The derived governing equations are solved through a 3-nodes beam element. A comprehensive parametric study delves into the influence of structural parameters, such as thicknessratio, beam length, nonlocal scale parameter, and strain gradient parameter. Furthermore, the study explores the impact of thermal effects, porosity distribution forms, and material distribution profiles on the free vibration of temperature-dependent FG nanobeams. The results reveal the substantial influence of these effects on the vibration behavior of functionally graded nanobeams under thermal conditions. This research presents a finite element approach to examine the thermo-mechanical behavior of nonlocal temperature-dependent FG nanobeams, filling the gap where analytical results are unavailable.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.11
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• pp.1096-1103
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• 2009

The predictions of the material behavior for the structural stability of thrust chamber mixing head at very-low temperatures are very important since the head is highly pressurized by the liquid oxygen with very-low temperatures and experiences impact load by the thrust of combustion chamber. The constitutive equation to express tensile deformation behavior of the material at very-low temperature to predict deformation behavior of the mixing head is formulated by composition of thermal component and athermal component based on dislocation energy barrier model suggested by Kocks. Also, increase of thermal stress components by the increase of obstacles at low temperatures is formulated to the equation similar with Ramberg-Osgood equation. The suggested model predicted well the material's behavior at the wide temperature ranges from very-low temperature to ambient temperature.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2009.10a
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• pp.45-52
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• 2009

The research on miniature devices based on non-silicon materials, in particular polymeric materials has been attracting more and more attention in the research field of the micro/nano fabrication in recent years. Lost of applications and many literatures have been reported. However, the study on the micro thermal imprint process of glassy polymer is still not systematic and inadequate. The aim of this research I to obtain a numerical material model for an amorphous glassy polymer, polycarbonate (PC), which can be used in finite element analysis (FEA) of the micro thermal imprint process near the glass transition temperature (Tg). An understanding of the deformation behavior of the PC specimens was acquired by performing tensile stress relaxation tests. The viscoelastic material model based on generalized Maxwell model was introduced for the material near Tg to establish the FE model based on the commercial FEA code ABAQUS/Standard with a suitable set of parameters obtained for this material model form the test data. As a result, the feasibility of the established viscoelastic model for PC near Tg was confirmed and this material model can be used in FE analysis for the prediction and improvement of the micro thermal imprint process for pattern replication.