• Title/Summary/Keyword: Temperature Accuracy

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Ensemble Downscaling of Soil Moisture Data Using BMA and ATPRK

  • Youn, Youjeong;Kim, Kwangjin;Chung, Chu-Yong;Park, No-Wook;Lee, Yangwon
    • Korean Journal of Remote Sensing
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    • v.36 no.4
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    • pp.587-607
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    • 2020
  • Soil moisture is essential information for meteorological and hydrological analyses. To date, many efforts have been made to achieve the two goals for soil moisture data, i.e., the improvement of accuracy and resolution, which is very challenging. We presented an ensemble downscaling method for quality improvement of gridded soil moisture data in terms of the accuracy and the spatial resolution by the integration of BMA (Bayesian model averaging) and ATPRK (area-to-point regression kriging). In the experiments, the BMA ensemble showed a 22% better accuracy than the data sets from ESA CCI (European Space Agency-Climate Change Initiative), ERA5 (ECMWF Reanalysis 5), and GLDAS (Global Land Data Assimilation System) in terms of RMSE (root mean square error). Also, the ATPRK downscaling could enhance the spatial resolution from 0.25° to 0.05° while preserving the improved accuracy and the spatial pattern of the BMA ensemble, without under- or over-estimation. The quality-improved data sets can contribute to a variety of local and regional applications related to soil moisture, such as agriculture, forest, hydrology, and meteorology. Because the ensemble downscaling method can be applied to the other land surface variables such as temperature, humidity, precipitation, and evapotranspiration, it can be a viable option to complement the accuracy and the spatial resolution of satellite images and numerical models.

Autonomous Compensation of Thermal Deformation during Long-Time Machining Process (공작기계 장시간 가공중 열변형의 CNC 자율보정 기술)

  • Kim, Dong-Hoon;Song, Jun-Yeob
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.4
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    • pp.297-301
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    • 2014
  • The biggest factors, which lower the machining accuracy of machine, are thermal deformation and chatter vibration. In this article, we introduce the development case of a device and technology that can automatically compensate thermal deformation errors of machine during long-time processing on the machine tool's CNC (Computerized Numerical Controller) in real time. In machine processing, the data acquisition of temperature signal in real time and auto-compensation of the machine origin of machine tools depending on thermal deformation have significant influence on improving the machining accuracy and the rate of operation. Thus, we attempts to introduce the related contents of the development we have made in this article : The development of a device that embedded the acquisition part of temperature data, linear regression to get compensation value, compensation model of neural network and a system that compensates the machine origin of machine tool automatically during manufacturing process on the CNC.

The MPPT Control of Photovoltaic System using the Fuzzy PI Controller (퍼지 PI 제어기를 이용한 태양광 발전시스템의 MPPT 제어)

  • Ko, Jae-Sub;Chung, Dong-Hwa
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.28 no.2
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    • pp.9-18
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    • 2014
  • This paper proposes the fuzzy PI controller for maximum power point tracking(MPPT) control of photovoltaic system. The output characteristics of the solar cell are a nonlinear and affected by a temperature, the solar radiation. The MPPT control is a very important technique in order to increase an output and efficiency of the photovoltaic system. The conventional perturbation and observation(PO) and incremental conductance(IC) are the method which finding maximum power point(MPP) by the continued self-excitation vibration, and uses the fixed step size. If the fixed step size is a large, the tracking speed of maximum power point is faster, but the tracking accuracy in the steady state is decreased. On the contrary, when the fixed step size is a small, the tracking accuracy is increased and the tracking speed is slower. Therefore, this paper proposes the MPPT control using the fuzzy PI controller that can be improve a MPPT control performance. The fuzzy PI controller is adjusted a input of PI controller by fuzzy control and compensated a cumulative error of fuzzy control by PI controller. The fuzzy PI MPPT control is compared to conventional PO and IC MPPT method for various temperature and radiation condition. This paper proves the validity of the fuzzy PI controller using these results.

A Study on the Improvement of Prediction Accuracy for Rolling Force in Continuous Cold Rolling Mill (연속냉각압연에서의 압연하중 예측정도 향상에 대한 연구)

  • Song, Gil-Ho;Park, Hae-Doo;Kim, Shin-Il
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.7
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    • pp.2257-2265
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    • 1996
  • In the cold rolling mill, it is very important that a constrained static flow stress of rolled strip and rolling force calculation model be exactly considered to improve an prediction accuracy for rolling forces. Therefore, in this study, the values of the constrained static flow stress are used by deriving the regression equation which is a function of rolling conditions(FDT, CT) and chemical compositions(C, Si, Mn), previously applied by making the tables of yield strength for hot coils with size. And with the consideration that an elastic deformation part of an rolled strip appears at the entry and delivery side of the contacting area between the work roll and rolled strip is calculated. By applying these methods, the more accurate prediction for rolling force is obtained. As a results, the deviation of thickness is significantly reduced in the rolling direction.

Development and its Performance Evaluation of a Micro-Impression Creep Machine (마이크로 압입 크리프 시험기 개발 및 성능평가)

  • Yang, Kyoung-Tak;Kim, Hyun-Jun;Kim, Ho-Kyung
    • Tribology and Lubricants
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    • v.24 no.1
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    • pp.27-33
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    • 2008
  • A micro-impression creep machine was designed and developed, adopting a small punch in diameter of 150 um, displacement gage with an accuracy of sub-${\mu}m$ scale, and load-cell with an accuracy of mN scale in order to investigate creep behavior of small solder ball in diameter of less than 1 mm. Creep behavior of lead-free solder ball(Sn-3.0Ag-0.5Cu) in diameter of $760\;{\mu}m$ was investigated in the stress range of $8{\sim}60\;MPa$ and at $303\;K{\sim}393\;K$. The applied load became decreased slightly and continuously in the creep rate of $10^{-4}/s$ range during the current experiments. Also, the machine frame was so sensitive to the environmental temperature that nm scaled displacement recording was unstable according to the change in environmental temperature.

Infrared Light Absorbance: a New Method for Temperature Compensation in Nondispersive Infrared CO2 Gas Sensor

  • Yi, Seung Hwan
    • Journal of Sensor Science and Technology
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    • v.29 no.5
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    • pp.303-311
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    • 2020
  • Nondispersive infrared CO2 gas sensor was developed after the simulation of optical cavity structure and assembling the optical components: IR source, concave reflectors, Fresnel lens, a hollow disk, and IR detectors. By placing a hollow disk in front of reference IR detector, the output voltages are almost constant value, near to 70.2 mV. The absorbance of IR light, Fa, shows the second order of polynomial according to ambient temperatures at 1,500 ppm. The differential output voltages and the absorbance of IR light give a higher accuracy in estimations of CO2 concentrations with less than ± 1.5 % errors. After implementing the parameters that are dependent upon the ambient temperatures in microcontroller unit (MCU), the measured CO2 concentrations show high accuracies (less than ± 1.0 %) from 281 K to 308 K and the time constant of developed sensor is about 58 sec at 301 K. Even though the estimation errors are relatively high at low concentration, the developed sensor is competitive to the commercial product with a high accuracy and the stability.

Design and Performance Evaluation of a Spindle System for Centerless Grinding Machine (무심연삭기 주축계의 설계 및 성능평가)

  • Park Chun Hong;Hwang Joo Ho;Cho Soon Joo;Cho Chang Rae
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.11 s.176
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    • pp.142-150
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    • 2005
  • Design and performance evaluation of a spindle system which was composed of a grinding spindle and a regulating spindle for the centerless grinding of ferrule were performed in this paper. Layout and details of spindle system were designed and hydrostatic bearings for spindles were also designed. Prototype of spindle system was developed and its availabilities to machine the ferrule were discussed using the experimental results on the spindle stiffness of each spindle, loop stiffness, rotational accuracy and thermal characteristics. Loop stiffness of the spindle system was $130\;N/{\mu}m$, which was enough to machine the ferrule. Rotational accuracies of each spindle were about $0.2{\mu}m$ at the primary speed of 2,300 rpm(grinding spindle) and 300 rpm(regulating spindle). Temperature rises at the same speed were about $4.4\~4.7^{\circ}C$ in the case of grinding spindle and $1.8^{\circ}C$ in the case of regulating spindle, which agreed well with the designed value. From these results, it was estimated that the prototype of spindle system had enough performances for the centerless grinding machine to machine the ferrule.

Dependence of Annealing Condition on Aspheric Glass Lens Molding (비구면 Glass렌즈 성형에 미치는 서냉조건 의존성)

  • Cha, Du-Hwan;Ahn, Jun-Hyung;Kim, Hye-Jeong;Kim, Jeong-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.469-470
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    • 2006
  • The purpose of this research was to investigate and to find out the optimal annealing condition to mold an aspheric glass to be used for mobile phone module having 2 megapixel and $2.5{\times}$ zoom. Taking annealing rate and re-press temperature after molding as molding variables under the identical molding temperature and pressure, a glass lens was molded. And, Form Accuracy, Lens Thickness, Refractive Index, and Modulation Transfer Function(MTF) were measured in order to observe characteristics of molded lens, and then optimal annealing conditions were determined based on the resulting data. Properties of lens molded under the optimal conditions revealed Form Accuracy[PV] $0.2047\;{\mu}m$ in aspheric surface, and $0.2229\;{\mu}m$ in plane, and MTF value was 30.3 % under 80 lp/mm.

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Anti-Collision System of Crane Using Neural Network and Ultrasonic (신경망과 초음파를 이용한 크레인의 충돌방지 시스템)

  • Lee, Byeong-Ro;Kim, Hyun-Deok
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.12 no.9
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    • pp.1564-1568
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    • 2008
  • The anti-collision system is one of units for effectual operation and safety in crane operation. Most of the system have used ultrasonic to measure position and to prevent collision of crane. But, the anti-collision system using ultrasonic is fallen the reliability of performance by the change of temperature and humidity. Hence, this study proposes neural network applied to anti-collision system to improve accuracy and stability of the measured distance data, and we evaluate performance of the system. In results of experiments, the proposed method was seen that stability and accuracy of data are improved than that of the temperature compensation method.

OES based PECVD Process Monitoring Accuracy Improvement by IR Background Signal Subtraction from Emission Signal (적외선 배경신호 처리를 통한 OES 기반 PECVD공정 모니터링 정확도 개선)

  • Lee, Jin Young;Seo, Seok Jun;Kim, Dae-Woong;Hur, Min;Lee, Jae-Ok;Kang, Woo Seok
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.5-9
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    • 2019
  • Optical emission spectroscopy is used to identify chemical species and monitor the changes of process results during the plasma process. However, plasma process monitoring or fault detection by using emission signal variation monitoring is vulnerable to background signal fluctuations. IR heaters are used in semiconductor manufacturing chambers where high temperature uniformity and fast response are required. During the process, the IR lamp output fluctuates to maintain a stable process temperature. This IR signal fluctuation reacts as a background signal fluctuation to the spectrometer. In this research, we evaluate the effect of infrared background signal fluctuation on plasma process monitoring and improve the plasma process monitoring accuracy by using simple infrared background signal subtraction method. The effect of infrared background signal fluctuation on plasma process monitoring was evaluated on $SiO_2$ PECVD process. Comparing the $SiO_2$ film thickness and the measured emission line intensity from the by-product molecules, the effect of infrared background signal on plasma process monitoring and the necessity of background signal subtraction method were confirmed.