• Title/Summary/Keyword: Technology integration

Search Result 3,611, Processing Time 0.035 seconds

Circuit Integration Technology of Low-Temperature Poly-Si TFT LCDs

  • Motai, Tomonobu
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2004.08a
    • /
    • pp.75-80
    • /
    • 2004
  • By the SOG (System-on-Glass) technology with excimer laser anneal process, the number of IC chips and the area of the mounted IC chips on the printed circuit board are reduced. In new circuit integrations on the glass substrate, we have developed D/A converter including the new capacitor array, amplifier comprising the original comparators and new display device with capturing images by integrated sensor into a pixel. This paper discusses the application of circuit integration of low-temperature poly-Si.

  • PDF

The Characteristics of the Successful Venture Firms: Case Study (성공적인 벤처기업의 특성 분석: 사례연구)

  • 송위진;신태영
    • Journal of Korea Technology Innovation Society
    • /
    • v.1 no.3
    • /
    • pp.351-363
    • /
    • 1998
  • This case study aims at investigating the factors which make venture firms successful. It analysedthree high-performance venture firms originated from the government-financed rese arch institute, the company and the university on the viewpoint of 'dynamic capability' theory. In this case study, technology integration capability and administrative innovation capability were identified as success factors of the three venture firms. The study also presented the role of the incubating organizations. Although incubating organizations supported technological and managerial resource-building of the entrepreneurs, there was not active interactive-learning between venture firms and incubating organizations after spin-off.

  • PDF

Views on the present and future promise of LTPS technologies

  • Ibaraki, Nobuki;Nishibe, Tohru
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2006.08a
    • /
    • pp.1635-1639
    • /
    • 2006
  • LTPS has potential capability to realize various kinds of circuit integrations on panel glass because of its relatively higher field effect mobility of around 100cm2/Vs. Recent progress of LTPS technologies and advanced technologies, which are generally called "System on Glass (SOG)," will be discussed. The technology includes circuit integration, photo-sensor integration for input functions, and display quality and performance improvement.

  • PDF

An Effective Project risk Management Based on Systems Engineering (시스템엔지니어링에 기반한 효과적인 리스크 관리)

  • Kang, Top;Kim, Sung-Cheol;Oh, Jung-Taek
    • Journal of the Korean Society of Systems Engineering
    • /
    • v.7 no.1
    • /
    • pp.43-51
    • /
    • 2011
  • SE generally defines approaching ways of conducting identification, verification and integration of an optimized product and process solution to meet customer's needs by leveraging organizational competency in engineering and management. To successfully develop a new product under mass production contract, it is important to efficiently carry out the program by ensuring that three major competencies are secured; core technology, system integration, and program management. For successful implementation of tasks in the three areas, systematic execution is called for, which requires identifying risk factors in advance. In particular, comprehensive risk management role and responsibility is required for program management. Success of a development program is determined by complex elements of human resources, organization culture, and overall competency of an organization in technology and program management, including capability of the program manager. In this paper, a risk management solution is suggested to lead a program to success with a more efficient way through actual risk management by the concept of SE around the above three areas.

Design of Moving Objects Query Language for LBS Platform (LBS 플랫폼을 위한 이동객체 질의어의 설계)

  • Nam, Kwang-Woo;Lee, Jae-Ho;Kim, Min-Soo
    • Annual Conference of KIPS
    • /
    • 2002.11c
    • /
    • pp.1899-1902
    • /
    • 2002
  • 이 논문에서는 위치기반서비스 플랫폼을 위한 이동객체 질의어를 제안한다. 최근 이동 객체를 다루는 다양한 위치기반서비스 및 데이터베이스 응용들이 등장함에 따라 이동 객체의 공간 정보를 저장 관리하고 정보를 요구하는 다양한 사용자 질의를 처리할 필요성이 대두되었다. 그러나 기존의 이동객체 질의어는 위치기반서비스에서의 특성을 충분히 반영하고 있지 못하다. 따라서 이 논문에서는 이동객체 데이터베이스에 대하여 시계열 질의와 슬라이스 표현을 지원하도록 함으로서 기존 이동객체 질의어에 비해 강력한 표현력을 갖는 질의어를 제안하고 있다.

  • PDF

Input-Series Multiple-Output Auxiliary Power Supply Scheme Based on Transformer-Integration for High-Input-Voltage Applications

  • Meng, Tao;Ben, Hongqi;Wei, Guo
    • Journal of Power Electronics
    • /
    • v.12 no.3
    • /
    • pp.439-447
    • /
    • 2012
  • In this paper, an input-series auxiliary power supply scheme is proposed, which is suitable for high input voltage and multiple-output applications. The power supply scheme is based on a two-transistor forward topology, all of the series modules have a common duty ratio, all the switches are turned on and off simultaneously, and the whole circuit has a single power transformer. It does not require an additional controller but still achieves efficient input voltage sharing (IVS) for each series module through its inherent transformer-integration strategy. The IVS process of this power supply scheme is analyzed in detail and the design considerations for the related parameters are given. Finally, a 100W multiple-output auxiliary power supply prototype is built, and the experimental results verify the feasibility of the proposed scheme and the validity of the theoretical analysis.

Development Method of Civil BIM Deliverable Submission System (도로공사 기반의 BIM 성과품 납품체계 개발방안)

  • Seo, MyoungBae;Ju, KiBeom;Nah, Hei Sook
    • Proceedings of the Korea Contents Association Conference
    • /
    • 2013.05a
    • /
    • pp.437-438
    • /
    • 2013
  • 최근 BIM(Building Information Modeling)은 건설사업의 뜨거운 이슈로 부각되고 있으며 기존의 건설공사에서 2D로 관리되고있는 각종 성과물을 3D로 관리하면서 간섭검토, 에너지분석, 시공성검토 등 기존의 2D로 하기 어려웠던 다양한 의사결정 등을 지원할 수 있는 새로운 기술이다. 하지만 이렇게 다양하게 BIM이 활용되기 위해서는 활용목적에 맞는 성과품 및 산출물이 적절하게 만들어져야 하나 건축분야만 일부 제시되고 있을 뿐 토목분야는 사례를 찾아보기가 힘들다. 이에 국외 토목 BIM 발주사례와 국내 건축 BIM 관련 가이드, 현행 2D 기반의 성과품 납품체계 등을 조사하여 도로분야의 BIM성과품 납품체계 개발방안을 제시하였다.

  • PDF