• The Bulletin of The Korean Astronomical Society
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• v.25 no.2
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• pp.54-54
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• 2000

• Proceedings of the Korean Vacuum Society Conference
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• 1998.06a
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• pp.53-53
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• 1998

• Proceedings of the Korean Vacuum Society Conference
• /
• 1998.06a
• /
• pp.54-54
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• 1998

• Proceedings of the Korean Vacuum Society Conference
• /
• 2009.02a
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• pp.108.1-108.1
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• 2009

• Proceedings of the Korean Society of Plant Pathology Conference
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• 2005.04a
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• pp.74.2-75
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• 2005

• Proceedings of the Korean Society of Potoscience Conference
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• spring
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• pp.84-84
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.51-69
• /
• 2001

Japan Jisso Technology Roadmap 2001 (JJTR2001) was published by JEITA in April 2001. Future electronic products request further higher assembly technology (ex. Finer pitch packages & components, 3D assembly, etc.) to reduce size and improve performance of the electric products. For LSI Packages, finer ball pitch technology and finer chip connection technology will be developed. For electric components, further size reduction will be developed. For Jisso (assembly) machine, finer pitch assembly and short tact time technology will be developed. Mr. Utsunomiya will present PCB roadmap next.

• Bulletin of the Korean Space Science Society
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• 2000.10a
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• pp.54-54
• /
• 2000

No Abstract, See Full Text

• Proceedings of the Korea Technology Innovation Society Conference
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• 2006.11a
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• pp.45-58
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• 2006

• Journal of Korea Ship Safrty Technology Authority
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• v.20
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• pp.48-50
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• 2005