Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2001.09a
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- Pages.51-69
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- 2001
Jisso Technology Roadmap 2001 in Japan
- Haruta, Ryo (Japan Jisso Technology Roadmap Council, Japan Electronics & Information Technology Industries Association(JEITA))
- Published : 2001.09.01
Abstract
Japan Jisso Technology Roadmap 2001 (JJTR2001) was published by JEITA in April 2001. Future electronic products request further higher assembly technology (ex. Finer pitch packages & components, 3D assembly, etc.) to reduce size and improve performance of the electric products. For LSI Packages, finer ball pitch technology and finer chip connection technology will be developed. For electric components, further size reduction will be developed. For Jisso (assembly) machine, finer pitch assembly and short tact time technology will be developed. Mr. Utsunomiya will present PCB roadmap next.
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