• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.8 no.11
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• pp.215-222
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• 2018

In this paper, the research on the energy storage system adapting super-capacitor has been performed. The most advanced features compared to the conventional lead-acid battery systems is that it can obtain high power capability due to the super capacitor power characteristics. The suggested system can attain high power in short times and achieve high power quality improvements. The application areas are power quality improvement system, motor start power which requires high power during transient times. The energy conversion system consists of bi-directional converter and inverter and advantages of high speed, high power charging and discharging performances. The design steps for the two loop controller of the bi-directional inverter are suggested and verified by the experiment and manufacturing. The two loop controller design starts from linearized transfer function which is calculated from the state averaging model including state decoupling method. The current controller requirements are 20% overshoot and settling time and voltage controller are no overshoot and settling time which is 10 times longer than current controller. The design is verified from the step input response. The designed controllers have unity power factor characteristics and thus can improve the power quality of the grid. It also has fast response time and zero steady state error.

• Korean Journal of Agricultural and Forest Meteorology
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• v.6 no.2
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• pp.107-117
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• 2004

If doubtlessly contributes much to agriculture and rural development. The roles can be summarized as; 1. to activate rural areas and to provide more comfortable and safe rural life with equivalent services to those in urban areas, facilitating distance education, tole-medicine, remote public services, remote entertainment etc. 2. To initiate new agricultural and rural business such as e-commerce, real estate business for satellite officies, rural tourism and virtual corporation of small-scale farms. 3. To support policy-making and evaluation on optimal farm production, disaster management, effective agro-environmental resource management etc., providing tools such as GIS. 4. To improve farm management and farming technologies by efficient farm management, risk management, effective information or knowledge transfer etc., realizing competitive and sustainable farming with safe products. 5. To provide systems and tools to secure food traceability and reliability that has been an emerging issue concerning farm products since serious contamination such as BSE and chicken flu was detected. 6. To take an important and key role for industrialization of farming or lam business enterprise, combining the above roles.