• Title/Summary/Keyword: Technical package

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A Study on Influence of Corporate Factor and ITO Range Factor on Outsourcing Performance -Moderating Effect of Supplier Suitability

  • YI, Seon-Gyu
    • Journal of the Korea Society of Computer and Information
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    • v.22 no.2
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    • pp.111-117
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    • 2017
  • This study analyzes the relative importance of the introducing factors for the critical success factors in the implementation stage of the lifecycle of ERP system using Delphi technique and Analytic Hierarchy Process(AHP). In the 1st layer of the hierarchy, technical factor is evaluated as the most important factor among organizational, technical, and supplier factors. In the 2nd layer, choosing a proper ERP package is evaluated as the most important factor within 15 factors followed by process-oriented approach, technical suitability, minimized customization, integration and association of system with trading parter, association with legacy systems, and support and involvement of top management. As a result of this analysis enterprise should choose an ERP package that is suitable to its business environment, and make the best use of(take full advantage of) best practice that ERP package provides to optimize the existing business procedure or process(to approach the existing business procedure or process). This study also shows the range of customization of the features provided by the ERP package should be minimized.

An Analysis of the Importance of the Success Factors in Implementation Stage of ERP System

  • YI, Seon-Gyu;Kim, Jong-Ju
    • Journal of the Korea Society of Computer and Information
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    • v.21 no.12
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    • pp.165-171
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    • 2016
  • This study analyzes the relative importance of the introducing factors for the critical success factors in the implementation stage of the lifecycle of ERP system using Delphi technique and Analytic Hierarchy Process(AHP). In the 1st layer of the hierarchy, technical factor is evaluated as the most important factor among organizational, technical, and supplier factors. In the 2nd layer, choosing a proper ERP package is evaluated as the most important factor within 15 factors followed by process-oriented approach, technical suitability, minimized customization, integration and association of system with trading parter, association with legacy systems, and support and involvement of top management. As a result of this analysis enterprise should choose an ERP package that is suitable to its business environment, and make the best use of(take full advantage of) best practice that ERP package provides to optimize the existing business procedure or process(to approach the existing business procedure or process). This study also shows the range of customization of the features provided by the ERP package should be minimized.

Development of a Multimedia Package on Operation and Maintenance of Air Brake System for Indian Railways - A Case Study

  • Lalla, G.T.;Mehra, Chanchal
    • Journal of Korea Multimedia Society
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    • v.6 no.4
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    • pp.668-675
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    • 2003
  • Now a days many industries and bigger organisation (Indian Railways, Bharat Heavy Electricals Ltd.) are facing difficulties in implementing the new technology because of non-availability of fully trained staff. Also for the employed technical and other staff lot of resistance management has to face to get them trained for adoption of new technology. There are also very less organisations who can design effective training programmes and at the same time develop course material specially multimedia packages and computer base training (CBT) which can satisfy the need of different target groups of industries. Indian Railways was also facing similar situation while implementing the Air Brake System technology In Indian Railways. TTTI Bhopal took that challenge and designed, developed and trained Indian Railways trainer for implementation of the package on different target group. The present paper offers a case study on the same.

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A Comparison Study Between International Standard and Statistical Analysis on LED Package Life (국제표준과 통계적 분석을 통한 LED Package 수명 비교 연구)

  • Park, Se Il;Kim, Gun So;Kim, Chung Hyeok
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.2
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    • pp.122-127
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    • 2018
  • In an attempt to estimate the life projection of LED packages, IESNA published a paper regarding an LED package measurement test method in 2008, and a life projection technical document in 2011, to be used for LED life estimation. IESNA's publications regarding LED package measurement methods were functional, but they were not internationally standardized before 2017. In order to develop a standardized method, the International Standard chose to use the LM-80 as a measurement method for LED life projection in their publication in 2017. Many projection methods have been discussed by the IEC Technical Committee 34 working group, including the method using an exponential function, which reflects lumen degradation characteristics well. This study is designed to explore alternative LED package life estimation methods using an exponential function with statistical analysis, other than the one suggested by the International Standard.

Survey on the Application of three dimensional product modeling in the army (군에서의 3차원 제품 모델 적용 방안 연구)

  • Choi, Ki-In
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.12
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    • pp.5716-5720
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    • 2012
  • To expand the use of three dimensional(3D) product modelling in the army, we have analyzed military technical data management system, as well as the military guidelines for the unique format and content of technical data package. Because traditional munition sector is based on the machinery and equipment industry, they have usually applied two dimensional(2D) drawings to prepare a design and to make a product. For that reason, there is no provision for 3D product modelling as a technical data package in the military guideline. In this study, we proposed an improvement scheme for the vitalization of 3D product modelling in the army not only in terms of related guideline but also military technical data management system.

A Study on the Performance Measuring Methods and Standard for the Technical Package in Zero Energy Building (제로에너지빌딩의 기술 패키지 구성을 위한 성능 기준 및 성능 측정 방법에 관한 연구)

  • Sung, Uk-Joo;Rim, Min-Yeop;Kim, Seok-Hyun;Cho, Soo
    • Journal of Korean Institute of Architectural Sustainable Environment and Building Systems
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    • v.12 no.6
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    • pp.543-556
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    • 2018
  • Zero energy building was attended for energy consumption minimization by the energy saving technology about building heating and cooling energy consumption and the renewable energy production facility. So the government has supported the zero energy building supply for decreasing green gas emissions. The study about inventory of zero energy building has many proceeding. That inventory need the information of material and equipment. So information of material and equipment about zero energy building must be included for the zero energy building realization. Actually the database of zero energy building inventory construction through the inventory established studies has difficult because the database need many information. In this study, author proposed the test methods and performance reference for upload at inventory. It was constructed to material - module - package. Also the author analyzed the construction of the technical package for zero energy building. The author separated performance category to the energy performance for energy analysis and other performance for confirmed the durability, stability and etc. This performance category proposed the table. The test methods of material and equipment in the passive package and active package proposed to the international standard and korea standard basically korea standard. Also the performance reference was proposed to korea legal standard and various standard by this study results. And the authors proposed the table of performance value, test methods, performance reference. By result of this study, the test methods and performance reference will be used the basic data for inventory of zero energy building.

A Study on the Design of Traditional Food Package Under the Use of Hanji(I) - Design of Korean dried confectionary package - (한지를 이용한 전통식품 포장재 디자인에 관한 연구(제1보) - 한과류 포장재 디자인 -)

  • Lee, Yu-Ra;Kim, Hye-Won;Lim, Hyun-A
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.39 no.2 s.120
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    • pp.68-77
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    • 2007
  • It is necessary to recognize philosophical and scientific depth, contained in traditional culture in a correct fashion, in order to succeed and develop our excellent traditional culture. Some studies on storage, circulation, and package design of traditional food will multiple the added value of traditional culture. So this research was carried out for making packing cases of kinds of Korean dried confectionery using Hanji by traditional manufacturing method, Hanji textile, charcoal Hanji and jade Hanji, and for developing environmental-friendly Korean dried confectionery package as more luxurious packaging papers by putting an exterior design on the surface. The results measured physical properties, air permeability and anti-mold activity of Hanji, and designing Korean dried confectionery are as follows. The physical properties and air permeability used to manufacture Korean dried confectionery package, turned out to be no affection to the food packaging Hanji. In order to avoid the monotonousness of Korean dried confectionery package, it was designed with Hanji textile together with elegant traditional pattern. It is estimated to increase the value of Korean dried food and to make the anti-mold activity of Hanji added charcoal and jade effective. In conclusion, by developing individual properties of traditional food and proper packaging paper as well as packaging design according to circulating situation, it is considered that the taste and the fancy can be maximized. After all, by applying excellent traits contained in our race's culture, it is possible to develop the package cases into competitive ones. And it would be able to increase utilization of Hanji. Namely, production of high quality traditional food package with Hanji is expected for new valuable industry of Hanji.

Local Buckling Analysis of the Punch in stamping Die and Its Design Modification (타발금형펀치의 국부 좌굴해석 및 설계변경)

  • Kim, Yong-Yun;Lee, Dong-Hun
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.3 s.96
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    • pp.25-29
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    • 1999
  • The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

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Perspective of New Packaging Technologies in the Future Society (최신 패키징 기술개발 동향)

  • Kim, Jai-Neung
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 2007.11a
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    • pp.13-19
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    • 2007
  • In this research, what megatrends will be derived for the future society and what new packaging technology will be required in the future were researched. Megatrends were researched in the five major categories, demographical, social, consumer, packaging related science and technology, governmental regulations and law trend. The six new packaging technologies were predicted, Active/Passive packaging technology, Intelligent Communication packaging technology, Nanotechnology packaging technology, Universal Convenience packaging technology, Environmental Friendly packaging technology, and Package Design technology.

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