• 한국진공학회지
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• 제14권4호
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• pp.245-251
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• 2005

A high performance dual rocking magnet sputtering gun has been developed. The rocking magnet sputtering gun introduces full-face erosion by rapidly rocking the magnet in the region where the high plasma density is maintained. The newly developed dual rocking magnet sputtering gun whose target utilization was 77 percent achieved high performance in quality in the view of target utilization and target life-time comparing to the existing magnetron sputtering gun. The PIC-MCC target erosion simulation has been performed simultaneously. Comparing experimental target erosion profiles with simulated target erosion profiles, the simulation could estimate the tendency of the target erosion profiles but could not estimate an exact target erosion profile. If the simulation were improved more precisely, the cost reduction for the development of the multiple rocking magnet sputtering gun would be expected.

• 한국표면공학회지
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• 제38권5호
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• pp.179-182
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• 2005

Indium Tin Oxide (ITO) thin films were deposited from various target densities ($98.7\%\~99.6\%$) using RF magnetron sputtering. Effect of the sputtering target densities on the structural, electrical and optical properties of deposited ITO thin films was investigated. The preferable (400) crystalline orientation peak was observed on the films deposited from > $99.0\%$ target density. Higher target density produced films with higher roughness but lower resistivity. All of the deposited films showed optical transmittance more than $85\%$ in the visible wavelength region. It is necessary to use the highest target density for sputtering deposition of ITO thin films.

• Nuclear Engineering and Technology
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• 제53권9호
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• pp.3026-3034
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• 2021

Multi-target X-ray tube is a new type X-ray source, and can be applied in many fields such as sensitive X-ray fluorescence analysis and medical imaging. In this work, we report an electric field modulation multi-target X-ray tube, which contains four targets (Cr, Ni, Au, Mo) coated on a Beryllium (Be) window. A four-valve electric field deflector was developed to deflect the electron beam to bombard the corresponding targets. Particle dynamics analysis software was employed to simulate the particle tracking of electron beam. The results show that the 30 keV electron beam could get a 6.7 mm displacement on the target plane by 10⁵ V/m electric field. The focus areas are about 2 mm × 5 mm and 4 mm × 2.5 mm after deflection in two directions. Thermal behavior calculated by ANSYS shows that the designed target assembly could withstand a 10 W continuous power. The optimum target thicknesses and emission spectra were obtained by Geant4 when the thickness of Be window was 300 mm and the electron beam incident angle was 0.141 rad. The results indicate that this multi-target X-ray tube could provide different X-ray sources effectively.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 추계학술발표강연 및 논문개요집
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• pp.122-122
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• 1999

• 한국진공학회지
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• 제19권1호
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• pp.45-51
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• 2010

마그네트론 타겟에서 일어나는 다양한 물리적 현상에 의한 결과로 인해 발생하는 타겟 표면의 온도를 측정함으로써 그 분포가 플라즈마, 혹은 증착되는 박막에 영향을 줄 수 있는 가능성을 분석하였다. 마그네트론 스퍼터링의 타겟은 크게 원형 타겟과 사각 타겟으로 구분되는데, 사각 타겟에서는 자기장에 의한 corner effect 등에 의해 전자 집중 방전 영역이 발생하고 그것에 의해 타겟 표면에서 불균일한 온도분포가 생성됨을 확인했다. 국부적으로 온도가 높게 올라가는 지역은 비스퍼터링 지역에 비해 $10{\sim}20^{\circ}C$ 정도 높았으며, 스퍼터링 공정 시 문제점 중에 하나인 particle이 발생하면 그 부분에서 온도가 $20^{\circ}C$ 정도 더 상승함을 알 수 있었다. 이런 영향은 증착되는 박막의 균일도에도 적지 않은 영향을 주었으며 세라믹 타겟의 경우, 균열의 원인이 될 수 있고, 불균일한 타겟 침식으로 타겟의 수명을 단축시키는 문제를 유발하기도 한다.

• 한국분말재료학회지
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• 제23권1호
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• pp.1-7
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• 2016

Cu-Mn compacts are fabricated by the pulsed current activated sintering method (PCAS) for sputtering target application. For fabricating the compacts, optimized sintering conditions such as the temperature, pulse ratio, pressure, and heating rate are controlled during the sintering process. The final sintering temperature and heating rate required to fabricate the target materials having high density are $700^{\circ}C$ and $80^{\circ}C/min$, respectively. The heating directly progresses up to $700^{\circ}C$ with a 3 min holding time. The sputtering target materials having high relative density of 100% are fabricated by employing a uniaxial pressure of 60 MPa and a sintering temperature of $700^{\circ}C$ without any significant change in the grain size. Also, the shrinkage displacement of the Cu-Mn target materials considerably increases with an increase in the pressure at sintering temperatures up to $700^{\circ}C$.

• 반도체디스플레이기술학회지
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• 제18권1호
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• pp.1-4
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• 2019

Reactive sputtering is widely used because of its high deposition rate and high step coverage. The deposition layer is often affected by target poisoning because the target conditions are changed, as well, by reactive gases during the initial stage of sputtering process. The reactive gas affects the deposition rate and process stability (target poisoning), and it also leads unintended oxide interlayer formation. Although the target poisoning mechanism has been well known, little attention has been paid on understanding the interlayer formation during the reactive sputtering. In this research, we studied the interlayer formation during the reactive sputtering. A DC magnetron sputtering process is carried out to deposit an aluminum oxide film on a silicon wafer. From the real-time process monitoring and material analysis, the target poisoning phenomena changes the reactive gas balance at the initial stage, and affects the interlayer formation during the reactive sputtering process.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
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• pp.83-84
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• 1994

• 한국재료학회:학술대회논문집
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• 한국재료학회 2001년도 춘계학술발표강연 및 논문개요집
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• pp.79-79
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• 2001

• 한국재료학회:학술대회논문집
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• 한국재료학회 1995년도 추계 학술발표 강연 및 논문개요집
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• pp.76-76
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• 1995