• Title/Summary/Keyword: THICKNESS

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Vibration analysis of a shear deformed anti-symmetric angle-ply conical shells with varying sinusoidal thickness

  • Javed, Saira;Viswanathan, K.K.;Aziz, Z.A.;Lee, J.H.
    • Structural Engineering and Mechanics
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    • v.58 no.6
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    • pp.1001-1020
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    • 2016
  • The study is to investigate the free vibration of antisymmetric angle-ply conical shells having non-uniform sinusoidal thickness variation. The arbitrarily varying thickness is considered in the axial direction of the shell. The vibrational behavior of shear deformable conical shells is analyzed for three different support conditions. The coupled differential equations in terms displacement and rotational functions are obtained. These displacement and rotational functions are invariantly approximated using cubic spline. A generalized eigenvalue problem is obtained and solved numerically for an eigenfrequency parameter and an associated eigenvector of spline coefficients. The vibration characteristic of the shells is examined for cone angle, aspect ratio, sinusoidal thickness variation, layer number, stacking sequence, and boundary conditions.

Design of a robust gauge controller for a single-stand cold rolling mill (단일 스탠드 냉간 압연 공정을 위한 견실한 두께 제어기의 설계)

  • An, Hyeon-Sik;Yun, Tae-Ung;Kim, Gwang-Bae
    • Journal of Institute of Control, Robotics and Systems
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    • v.2 no.3
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    • pp.134-141
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    • 1996
  • In this paper, we formulate the mathematical model for a single-stand rolling mill and design control systems for the thickness control at the exit of roll stand and for the tension control of the strip in the process. We propose a thickness controller based on the Internal Model Control structure which can be an effective application when the frequency components of the thickness deviation of the entry strip are known and, show how it can be appropriately combined with BISRA AGC method for a precise thickness control while maintaining the robustness against the modeling error of the mill modulus. It is illustrated by simulations that the proposed thickness control method gives better performance than existing methods and has the robustness against the modeling error of the mill modulus as well.

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Selection of the Large Diameter Pipe Wall Thickness by Value Engineering for a Plant (플랜트에서 가치공학 개념을 적용한 대관경 배관두께 선정에 관한 연구)

  • Choi, Gayoung;Yoo, Hoseon;Moon, Seung-Jae
    • Plant Journal
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    • v.7 no.3
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    • pp.65-73
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    • 2011
  • This research has suggested a method to select pipe wall thickness by application of the value engineering to reduce the cost and quantity that are major part of construction materials. This research shows that the application of value engineering reduces the cost of piping materials by optimizing pipe wall thickness while maintaining process flow date of design pressure and design temperature. Based on this knowledge, the application of the value engineering will lead to the cost reduction and quantity reduction by effective selection of pipe wall thickness. The application of the value engineering will help the EPC companies to win a contract in the overseas plant market.

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Coupled Thermal-Structure Analysis of UV Laser Pulsing according to the Thickness of Copper Film on the Surface of Polyimide (UV 펄스 레이저 가공의 구리 박막 두께에 따른 열-구조 연성 해석)

  • Shin, Minjae;Shin, Bosung
    • Laser Solutions
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    • v.16 no.2
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    • pp.7-11
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    • 2013
  • Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

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Prediction of Curl Distortion using Classical Lamination Theory in Stereolithography (SL 광조형 공정에서 고전적층이론을 적용한 곡률 변형 예측)

  • Kim, Gi-Dae;Lee, Jae-Kon
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.11 s.176
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    • pp.210-217
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    • 2005
  • A curl distortion induced by shrinkage during stereolithography polymerization process is analyzed with the classical lamination theory. Test parts of different layer thickness and part thickness are manufactured and their deformations are measured with CMM. Curl distortion is generated by the differential shrinkage of the layers, where the total shrinkage includes the shrinkages due to solidification and the change of temperature. It is shown that the curl distortion increases exponentially with decreasing the total thickness of the part, whose smaller layer thickness induces larger curl distortion. It is verified that only a part of the total shrinkage plays a role in generating the curl distortion.

Application of New AGC to the Cold Rolling Mills of Pohand Works ((포항)냉연 New AGC 적용기술)

  • 김철종;이동섭;박남수
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1999.08a
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    • pp.150-157
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    • 1999
  • As the customer demands thickness quality stricter, new techniques of automatic thickness control(AGC), is adopted to continuous cold rolling mills. The cold rolling mills of Pohang Works have revamped the existing conventional AGC system that control the thickness at all-stands automatically by the mass flow AGC based on the measurement of strip-speed and thickness between mill stands. The No. 2 Cold Rolling Mill be has adopted the New AGC system since Oct. 1995, and The No.1 Cold Rolling Mill since June. 1999. Thanks to the New AGC system, precise control of thickness is possible not only at constant rolling speed region, but also during line speed up and down. This report describes application techniques of the New AGC system and performance of the system.

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The Effect of Nitric Acid Catalyst on the Properties of Lead Titanate Thin Films by Sol Gel Spin Coating (졸겔 스핀 코팅에서 질산촉매가 티탄산연 박막의 물성에 미치는 영향)

  • 이전국;정형진;김종희
    • Journal of the Korean Ceramic Society
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    • v.28 no.11
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    • pp.859-864
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    • 1991
  • High quality lead titanate thin films were fabricated by spin coating on a silicon substrate. The resulting dried gel layers were uniform in thickness through 2$\times$2 $\textrm{cm}^2$ area, and polycrystalline perovskite structures developed almost crack free with a heat treatment above 50$0^{\circ}C$ in films with thickness above 360 nm. Metastable pyrochlore structures were observed in films with thickness of 160 nm when heat treated at 500 and $600^{\circ}C$, but these structure did not appear in films with thickness of 360 nm. The thickness dependence in crystal structure of films was studied. by varying the substrate condition and analyzing the interface between the film and substrate. In native oxide films on silicon stbstrates, amorphous dried gel layers were heterogeneously nucleated. Metastable cubic pyrochlore structure could be crystallized in amorphous native oxide.

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Optimization approach of insulation thickness of non-vacuum cryogenic storage tank

  • MZAD, Hocine;HAOUAM, Abdallah
    • Progress in Superconductivity and Cryogenics
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    • v.22 no.1
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    • pp.17-23
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    • 2020
  • Cryogenic insulation systems, with proper materials selection and execution, can offer the highest levels of thermal performance. Insulations are listed in order of increasing performance and, generally, in order of increasing cost. The specific insulation to be used for a particular application is determined through a compromise between cost, ease of application and the effectiveness of the insulation. Consequently, materials, representative test conditions, and engineering approach for the particular application are crucial to achieve the optimum result. The present work is based on energy cost balance for optimizing the thickness of insulated chambers, using foamed or multi layered cryogenic shell. The considered insulation is a uniformly applied outer layer whose thickness varies with the initial and boundary conditions of the studied vessel under steady-state radial heat transfer. An expression of the optimal insulation thickness derived from the total cost function and depending on the geometrical parameters of the container is presented.

Built-in Voltage in Organic Light-emitting Diodes depending on the Alg3 Layer Thickness (Alg3 두께 변화에 따른 유기 발광 소자의 내장 전압)

  • Lee, Eun-Hye;Yoon, Hee-Myoung;Kim, Tae-Wan
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.3
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    • pp.255-259
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    • 2008
  • Built-in voltage in ITO/$Alq_3$/ Al organic light-emitting diodes was studied by varying a thickness of $Alq_3$ layer using modulated photocurrent technique at ambient condition. A thickness of the $Alq_3$ layer was varied from 100 to 250 nm. From the bias voltage-dependent photocurrent, built-in voltage of the device was able to be determined. The obtained built-in voltage is about 0.8 V irrespective of the $Alq_3$ layer thickness in the device. This value of built-in voltage confirms that the built-in voltage is generated due to a difference of work function of the anode and cathode. The $Alq_3$ layer thickness independent built-in voltage indicates that the built-in electric field in the device is uniform across the organic layer.

Influence of Channel Thickness Variation on Temperature and Bias Induced Stress Instability of Amorphous SiInZnO Thin Film Transistors

  • Lee, Byeong Hyeon;Lee, Sang Yeol
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.1
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    • pp.51-54
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    • 2017
  • TFTs (thin film transistors) were fabricated using a-SIZO (amorphous silicon-indium-zinc-oxide) channel by RF (radio frequency) magnetron sputtering at room temperature. We report the influence of various channel thickness on the electrical performances of a-SIZO TFTs and their stability, using TS (temperature stress) and NBTS (negative bias temperature stress). Channel thickness was controlled by changing the deposition time. As the channel thickness increased, the threshold voltage ($V_{TH}$) of a-SIZO changed to the negative direction, from 1.3 to -2.4 V. This is mainly due to the increase of carrier concentration. During TS and NBTS, the threshold voltage shift (${\Delta}V_{TH}$) increased steadily, with increasing channel thickness. These results can be explained by the total trap density ($N_T$) increase due to the increase of bulk trap density ($N_{Bulk}$) in a-SIZO channel layer.