• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.1649-1652
• /
• 2006

2.22-inch qVGA $(240{\times}320)$ amorphous silicon thin film transistor liquid active matrix crystal display (${\alpha}$- Si TFT-AMLCD) panel has been successfully demonstrated employing a 2.5 um fine-patterning technology by a wet etch process. Higher resolution 2.22-inch qVGA LCD panel with an aperture ratio of 58% can be fabricated because the 2.5 um fine pattern formation technique is combined with high thermal photo-resist (PR) development. In addition, a novel concept of unique ${\alpha}$-Si TFT process architecture, which is advantageous in terms of reliability, was proposed in the fabrication of 2.22-inch qVGA LCD panel. Overall results show that the 2.5 um finepatterning is a considerably significant technology to obtain higher aperture ratio for higher resolution ${\alpha}$-Si TFT-LCD panel realization.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.1701-1703
• /
• 2006

Here we describe a novel driving scheme in the form of negative AC bias stress (NAC) to compensate shift in the threshold voltage for hydrogenated amorphous silicon (${\alpha}$-Si:H) thin film transistor (TFT) for AMOLED applications. This scheme preserves the threshold voltage shift of ${\alpha}$-Si:H TFT for infinitely long duration of time(>30,000 hours) and thereby overall performance, without using any additional TFTs for compensation. We briefly describe about the possible driving schemes in order to implement for real time AMOLED applications. We attribute most of the results based on concept of plugging holes and electrons across the interface of the gate insulator in a controlled manner.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.26 no.6
• /
• pp.23-29
• /
• 1989

A physical model that characterizes the field effect of the polycrystalline thin film transistor(TFT) is developed. The model discribes grains as discrete single crystal transistors and grain boundaries as insulated layers having the potential barrier, Thus TFT is considered as serial connection of single crystal transistors and insulators. In the model, the currents in the grain and the grain boundary is calculated using gradual channel approximation and tunneling theory, respetively. By comparing computed I-V characteristics with measured I-V characteristics of CdSe TFT's, potential and electric field distributions in the channel are observed and the validity of the conduction model proposed in this paper is confirmed.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.204-204
• /
• 2010

본 연구에서는 Glass 기판 위에 우수한 광 투과도를 갖는 ZnO 기반의 Thin Film Transistor (TFT)를 제작하였으며, 이에 대한 전기적 및 광학적 특성을 분석하였다. 소자 구조의 제작은 Maskless Aligner를 이용한 Optical lithograph법을 이용하였다. 채널층은 ZnO로 하였고 Source/Drain 영역은 GaZnO로 하여 전체구조가 ZnO 기반의 homogeneity를 유지하게 하였다. 이때 Gate 절연막은 Bi1.5Zn1Nb1.5O7와 SiO2 두가지 종류로 하여 각각의 특성을 비교하였다. 본연구에서 TFT구조의 각 층은 모두 r. f. 마그네트론 스퍼터법으로 증착하였다. 제작된 TFT들은 채널층 및 절연막 형성 등에 관여된 세부적 실험변수의 변화에 관계없이 약 75% 이상의 우수한 광투과도 특성을 보였다. 전기적 특성 평가에서, 제작된 TFT들은 전반적으로 비교적 낮은 문턱전압과 높은 이동도를 보였다. 하지만, 트랜지스터의 전기적 전송 특성의 주요 인자들인 채널-이동도, 스위칭, 누설 및 이력 등은 ZnO 채널층 혹은 Bi1.5Zn1Nb1.5O7 절연막 형성 시 주입되는 O2 가스의 분압에 의존하는 것이 관측되었다. 이를 통하여 트랜지스터의 각 세부 영역의 구조 및 형성 조건이 트랜지스터의 전기적 특성에 미치는 영향과 상관관계에 대하여 논의한다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.252-252
• /
• 2011

최근 주목받고 있는 amorphous gallium-indium-zinc-oxide (a-GIZO) thin film transistors (TFTs)는 수소가 첨가된 비정질 실리콘 TFT에 비해 높은 이동도와 뛰어난 전기적, 광학적 특성에 의해 큰 주목을 받고 있다. 또한 넓은 밴드갭을 가지므로 가시광 영역에서 투명한 특성을 보이고, 플라스틱 기판 위에서 구부러지는 성질에 의해 플랫 패널 디스플레이나 능동 유기 발광소자 (AM-OLED), 투명 디스플레이에 응용되고 있다. 뿐만 아니라, 일반적인 Poly-Si TFT는 자체적으로 가지는 결정성에 의해 대면적화 시 균일성이 좋지 못하지만 GIZO는 비정질상 이기 때문에 백플레인의 대면적화에 유리하다는 장점이 있다. 이러한 TFT를 제작하기 전, 전기적 특성에 대한 정보를 얻거나 예측하는 것이 중요한데, 이에 따라 고안된 구조가 바로 metal point contact FET (pseudo FET)이다. pseudo FET은 소스/드레인 전극을 따로 증착할 필요 없이 채널을 증착한 후, 프로브 탐침을 채널의 표면에 적당한 압력으로 접촉시켜 전하를 공급하는 소스와 드레인처럼 동작시킬 수 있다. 따라서 소스/드레인을 증착하거나 lithography와 같은 추가적인 공정을 요구하지 않아 소자의 특성을 보다 간단하고 수월하게 분석할 수 있다는 장점이 있다. 본 연구에서는 p-type 기판위에 100nm의 oxidation SiO2를 게이트 절연막으로 사용하는 a-GIZO pseudo FET를 제작하였다. 소자 제작 후, 열처리 온도에 따른 전기적 특성을 분석하였고, 열처리 조건은 30분간 N2 분위기에서 실시하였다. 열처리 후 전기적 특성 분성 결과, 450oC에서 가장 낮은 subthreshold swing 값과 게이트 전압의 더블 스윕 후 문턱 전압의 변화가 거의 없음을 확인하였다.

• Journal of the Semiconductor & Display Technology
• /
• v.16 no.1
• /
• pp.97-101
• /
• 2017

In this paper, IGZO thin film transistor (TFT) was fabricated with cross-linked Poly (4-vinylphenol) (PVP) gate dielectric for flexible, transparent display applications. The PVP is one of the candidates for low-temperature gate insulators. MIM structure was fabricated to measure the leakage current and evaluate the insulator properties according to the annealing temperature. Low leakage current ( <0.1nA/cm2 @ 1MV/cm ) was observed at $200^{\circ}C$ annealing condition and decreases much more as the annealing temperature increases. The electrical characteristics of IGZO TFT such as subthreshold swing, mobility and ON/OFF current ratio were also improved, which shows that the performance of IGZO TFTs with PVP can be enhanced by reducing the amount of incomplete crosslinking in PVP.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.717-720
• /
• 2007

We fabricated the 3.5 inch QCIF AMOLED panel with ultra low temperature polycrystalline silicon TFT on the plastic substrate. To reduce the leakage current, we used the triple layered gate metal structure. To reduce the stress from inorganic dielectric layer, we applied the organic interlayer dielectric and the photoactive insulating layer. By using the interlayer dielectric as a capacitor, the mask steps are reduced up to five.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.11a
• /
• pp.40-40
• /
• 2008

$InGaZnO_4$ based thin film transistors (TFTs) are of interest for large area and low cost electronics. The TFTs have strong potential for application in flat panel displays and portable electronics due to their high field effect mobility, high on/off current ratios, and high optical transparency. The application of such room temperature processed transistors, however, is often limited by the operation voltage and long-tenn stability. Therefore, attaining an optimum thickness is necessary. We investigated the thickness dependence of a room temperature grown $MgO_{0.3}BST_{0.7}$ composite gate dielectric and an $InGaZnO_4$ (IGZO) active semiconductor on the electrical characteristics of thin film transistors fabricated on a polyethylene terephthalate (PET) substrate. The TFT characteristics were changed markedly with variation of the gate dielectric and semiconductor thickness. The optimum gate dielectric and active semiconductor thickness were 300 nm and 30 nm, respectively. The TFT showed low operating voltage of less than 4 V, field effect mobility of 21.34 cm2/$V{\cdot}s$, an on/off ratio of $8.27\times10^6$, threshold voltage of 2.2 V, and a subthreshold swing of 0.42 V/dec.

• Journal of Information Display
• /
• v.1 no.1
• /
• pp.3-8
• /
• 2000

We have developed a high performance vertical alignment TFT-LCD (Thin Film Transistor Liquid Crystal Display), that shows a high light transmittance, and wide viewing angle characteristics with an unusually high contrast ratio. In order to optimize the electro-optical properties we have studied the effect of cell parameters, multi-domain structure and retardation film compensation. With the optimized cell parameters and process conditions, we have achieved a 24" wide UXGA TFTLCD monitor (16:10 aspect ratio 1920X1200) showing a contrast ratio of over 500:1, panel transmittance near 4.5%, response time near 25 ms, and viewing angle higher than 80 degree in all directions.

• Electrical & Electronic Materials
• /
• v.8 no.3
• /
• pp.340-351
• /
• 1995

Electrical, physical and optical properties of Aluminum(Al), Copper(Cu) thin films were investigated in order to establish the optimum sputtering parameters in Liquid Crystal Display (LCD) panel applications. DC-magnetron sputtered film on coming 7059 samples were fabricated with variations of deposition power densities, deposition pressures and substrate temperatures. Low resistivity films(AI;2.80 .mu..ohm.-cm, Cu:1.84 .mu..ohm-cm),which lower than the reported values, were obtained under sputtering parameters of power density(250W), substrate temperature(450-530.deg. C) and 5*10$\^$-3/ Torr deposition pressure. Expected columnar growth and stable grain growth of both films was observed through the Scanning Electron Microscope(SEM) micrographs. Dependency of the applicable defect-free film density upon depositon power and temperature was also characterized. Not too noticable variations in X-ray diffraction patterns were remarked under the alterations of sputtering parameters. High optical reflectivities of Al, Cu films, approximately 70-90 %, showed high degree of surface flatness.