• 제목/요약/키워드: TFT (thin-film transistor)

검색결과 502건 처리시간 0.032초

Investigation of the ZnO based TFT interface properties with synchrotron radiation analysis

  • Choi, Jong-Kwon;Baik, Min-Kyung;Joo, Min-Ho;Park, Kyu-Ho;Lee, Jay-Man;Kim, Myung-Seop;Yang, Joong-Hwan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1298-1300
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    • 2007
  • The interface between SiNx and ZnO was investigated with Near Edge X-ray Absorption Fine Structure (NEXAFS) for ZnO based thin film transistor (TFT) applications. Impurity species were interstitial $N_2$ molecules at the SiNx / ZnO interface. The evolution of $N_2$ is decreased with increasing of anneal temperature.

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Dry Etch Process Development for TFT-LCD Fabrication Using an Atmospheric Dielectric Barrier Discharge

  • Choi, Shin-Il;Kim, Sang-Gab;Choi, Seung-Ha;Kim, Shi-Yul;Kim, Sang-Soo;Lee, Seung-Hun;Kwon, Ho-Cheol;Kim, Gon-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.1272-1275
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    • 2008
  • We present the development of dry etch process for the liquid crystal display (LCD) fabrication using a dielectric barrier discharge (DBD) system at atmospheric pressure. In this experimental work, the dry etch characteristics and the electrical properties of thin film transistor are evaluated by using the scanning electron microscopy and electric probe, and TFT-LCD panel ($300\;mm\;{\times}\;400\;mm$) is manufactured with the application of the amorphous silicon etch step in the 4 mask and 5 mask processes.

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강유전성 스위칭 소자의 등가회로 모델과 특성 시뮬레이션 (Equivalent Circuit Modeling and Characteristics Simulation of Ferroelectric Switching Devices)

  • 김진홍;홍성진;최종선
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 하계학술대회 논문집 C
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    • pp.1506-1508
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    • 2001
  • We have investigated for the modeling and the simulation of the ferroelectric capacitor and MFS TFT (Metal-Ferroelectric-Semiconductor Thin Film transistor). For ferroelectric capacitor modeling, we adopted the equivalent circuit model which consists of a nonlear capacitor, a nonliner resistor, and a linear capacitor. MFS TFT have been modeled by combining the ferroelectric capacitor and Bsim3 MOSFET model. Our simulations show the characteristics of ferroelectric capacitor and MFS TFT.

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방전 플라즈마 CVD에 의한 전력용 고합 TFT의 개발 (Development of High Voltage TFT by Discharge Plasma Chemical Vapor Depoisition)

  • 이우선;강용철;김병인;양태환;정해인;정용호
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1993년도 춘계학술대회 논문집
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    • pp.137-141
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    • 1993
  • We studied the fabrication and electrical characteristics of high voltage hydrogenerated amorphous silicon thin film transistor using glow discharge plasma enchanced chemical vapor deposition (GDPECVD) with $2500{\AA}\;SiO_2$, $400-1500{\AA}$ a-Si thickness, 350V output voltage, 100V input voltaege, and $9.55{\times}10^4$ average on/off ratio. We found that leakage current of high voltage TFT occured 0-70V drain voltage.

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Ni로 유도된 Large-grain TFT의 전기적 특성 (Electrical characteristics of Large-grain TFT induced with Ni)

  • 이진혁;이원백;이준신
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.367-367
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    • 2010
  • Electrical characteristics of Large-grain silicon with Ni-induced crystallization which gate insulator is made of 80 nm $SiO_2$ and 20 nm SiNx was fabricated and measured with different channel widths, channel length fixed $10{\mu}m$. Focusing on the changes of channel widths from $4{\mu}m$ to $40{\mu}m$. Field-effect mobility decreased from 111.30 to $94.10\;cm^2/V_s$ when the channel widths increased. Still threshold voltage was almost similar with -1.06V.

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측면 기판 단자를 갖는 다결정 실리콘 박막 트랜지스터의 제작과 전기적 특성 분석 (Fabrication and electrical characteristic analysis of poly-Si TFT with lateral body)

  • 최형배;유준석;김천홍;한민구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 D
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    • pp.1462-1464
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    • 1998
  • Poly-Si TFT(Thin Film Transistor) is a electronic device that can be applied to the field of large area electronics such as AMLCD. We have fabricated the poly-Si TFT with lateral body terminal that is counter-doped body electrode and investigated the electrical characteristics of it. The lateral body terminal being short with s terminal, we have measured the transfer charac (Vg-ld) and the output characteristic (Vd-ld) fabricated devices. The measured result showe only that leakage current in OFF-state was re and Kink effect in ON-state was suppressed bu that in output characteristic curve the output Id was sustained constantly with the output v Vd in the saturation region.

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성형조건에 따른 부분 압축가열방식의 도광판 성형에 관한 실험적 연구 (An Experimental Study of the Effect of Process Conditions on Direct Surface Forming of a Light-Guide)

  • 조광환;윤경환
    • 대한기계학회논문집A
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    • 제28권1호
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    • pp.79-84
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    • 2004
  • A light-guide is one of several important components of backlight unit in TFT-LCD. The manufacturing technology and optical system design of the light guide is very sensitive to quality and cost of the TFT-LCD module. In the present study a new manufacturing method which is called as direct surface forming(DSF) has been tested under various conditions. DSF is very similar to the well-known hot embossing except for partial contact between mold and substrate. The final V-groove pattern shows different shapes depend on the temperature of mold surface, contact time of mold and depth of V-groove.

플라즈마 CVD에 의한 고전압 비정질 실리콘 박막 트랜지스터의 제작 (Fabrication of High Voltage a-Si:H TFT Plasma Chemical Vapor Deposition)

  • Lee, Woo-Sun;Kang, Young-Chul;Kim, Hyung-Gon
    • 대한전기학회논문지
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    • 제43권2호
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    • pp.312-317
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    • 1994
  • We studied the fabrication and electrical characteristics of high voltage hydrogenerated amorphous silicon thin film transistor using plasma enchanced chemical vapor deposition(PECVD). The device shows 2500${\AA}$ SiOS12T, 400-1500${\AA}$ a-Si tickness, 350V output voltage and 9.55${\times}$10S04T average on/off current ratio. We found that the leakage current of high voltage TFT occurred 0-70V drain voltage. As the leakage current depend on the a-Si thickness, the leakage current of high voltage TFT decreased by reduction of the a-Si thickness.

TFT-LCD 특성에 미치는 Capacitive Cross-talk의 영향에 대한 시뮬레이션 (Simulations of Capacitive Cross-talk Effects on TFT-LCD Operational Characteristics)

  • 윤영준;정순신;김태형;최종선
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 추계학술대회 논문집
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    • pp.557-560
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    • 1999
  • The design of large area thin film transistor liquid crystal displays (TFT-LCDs) requires consideration of cross-talks between the data lines and pixel electrodes. These limits are imposed by the parasitic capacitive elements present in a pixel. The capacitive coupling of the data line signal onto the pixel causes a pixel voltage error. In this study semi-empirical capacitance model which is adopted from VLSI interconnection capacitance calculations was used to calculate mutual coupling capacitances. With calculated mutual coupling capacitances and given image pattern, the root mean square(RMS) voltage of pixel is calculated to see vertical cross-talk from the first to the last column. The information obtained from this study could be utilized to design the larger area and finer image quality panel.

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다양한 공정 방법으로 제작된 다결정 실리콘 박막 트랜지스터 단위 CMOS 회로의 특성 (Characteristics of Polycrystalline Silicon TFT Unitary CMOS Circuits Fabricated with Various Technology)

  • 유준석;박철민;전재홍;한민구
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권5호
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    • pp.339-343
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    • 1999
  • This paper reports the characteristics of poly-Si TFT unitary CMOS circuits fabricated with various techniques, in order to investigate the optimum process conditions. The active films were deposited by PECVD and LPCVD using $SiH_4\; and\; Si_2H_6$ as source gas, and annealed by SPC and ELA methods. The impurity doping of the oource and drain electrodes was performed by ion implantation and ion shower. In order to investigate the AC characteristics of the poly-Si TFTs processed with various methods, we have examined the current driving characteristics of the polt-Si TFT and the frequency characteristics of 23-stage CMOS ring oscillators. Ithas been observed that the circuits fabricated using $Si_2H_6$ with low-temperature process of ELA exhibit high switching speed and current driving performances, thus suitable for real application of large area electronics.

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