• Korean Journal of Materials Research
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• v.17 no.10
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• pp.521-525
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• 2007

The microstructure and mechanical properties of an oxygen free copper processed by accumulative roll bonding(ARB) at low strain rate were studied. The copper sheets were highly strained up to an equivalent strain of ${\sim}6.4$ by ARB process at ambient temperature. The strain rate of the copper during the ARB was $2.6sec^{-1}$. The microstructure and mechanical properties of the ARB-processed copper were compared to those of the specimens processed by ARB at relatively high strain rate ($37sec^{-1}$). The microstructure and mechanical properties of the copper with ARB process was very similar to each other despite of some differences in recovery.

• Korean Journal of Materials Research
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• v.17 no.4
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• pp.207-214
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• 2007

We fabricated thermally-evaporated 10 -Ni/(poly)Si and 10 -Ni/1 -Ir/(poly)Si structures to investigate the microstructure of nickel monosilicide at the elevated temperatures required for annealing. Silicides underwent rapid at the temperatures of 300-1200 for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope(TEM) and an Auger depth profile scope were employed for the determination of vertical section structure and thickness. Nickel silicides with iridium on single crystal silicon actives and polycrystalline silicon gates shoed low resistance up to 1000 and 800, respectively, while the conventional nickle monosilicide showed low resistance below 700. Through TEM analysis, we confirmed that a uniform, 20 -thick silicide layer formed on the single-crystal silicon substrate for the Ir-inserted case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of 1000. Auger depth profile analysis also supports the presence of thismixed microstructure. Our result implies that our newly proposed iridium-added NiSi process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

• Korean Journal of Materials Research
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• v.11 no.8
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• pp.671-678
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• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.

• Corrosion Science and Technology
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• v.5 no.1
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• pp.15-22
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• 2006

The introduction of two-grid inside a conventional process system produces a reactive coating deposition and increases metal ion ratio in the plasma, resulting in denser and smoother films. The corrosion behaviors of TiN coatings were investigated by electrochemical methods, such as potentiodynamic polarization test and electrochemical impedance spectroscopy (EIS) in deaerated 3.5% NaCl solution. Electrochemical tests were used to evaluate the effect of microstructure on the corrosion behavior of TiN coatings exposed to a corrosive environment. The crystal structure of the coatings was examined by X-ray diffractometry (XRD) and the microstructure of the coatings was investigated by scanning electron microscopy (SEM) and transmission electron spectroscopy (TEM). In the potentiodynamic polarization test and EIS measurement, the corrosion current density of TiN deposited by two grid-attached magnetron sputtering was lower than TiN deposited by conventional magnetron type and also presented higher Rct values during 240 h immersion time. It is attributed to the formation of a dense microstructure, which promotes the compactness of coatings and yields lower porosity.

• Applied Microscopy
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• v.29 no.4
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• pp.405-415
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• 1999

In general, transmission electron microscopy (TEM) is usually used in the investigation of polymer microstructure. Microtoming, solution casting, staining and carbon replica method are frequently introduced to the study of the polymer morphology with TEM, however the sample preparation procedure of those techniques is very difficult, and it takes a long time. The purpose of this study is to develop a new sample preparation technique which is suitable for the investigation of the various shapes and species of polyolefin microstructure by scanning electron microscopy (SEM). By modifying the conventional chemical etching method, we developed a new chemical etching technique and sample preparation procedure that are suitable for SEM study of polymer microstructure. In this study the permanganate etching method is introduced and the optimum etching condition are determined by simply adjusting the etchant formulation, concentration and etching time. This technique has shown good reproducibility and it's morphological results agree well with other works on various types of microstructures such as spherulite characterization of isotatic polypropylene $(\alpha/\beta)$, polyethylene and poly-propylene copolymer characterization, and the study of lamellar growth pattern of unsheared or oriented materials. This technique has also been applied to the industrial fields for characterization of the polyolefin film, automobile products and the others.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.40 no.2
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• pp.177-182
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• 2020

In this study, the effect of nanofibers in cement pastes on the compressive and tensile strength of hardened cement pastes was studied. Two types of nanofibers, nylon 66 nanofibers and carbon nanotube-nylon 66 hybrid nanofibers, were manufactured by electrospinning methodology and mixed in cement powder respectively. The specimens for experiments were prepared by water to cement ratio of 0.5 and cured in water for 28 days. The effect of nanofibers on the increase of the compressive and tensile strength were confirmed by the experimental results. The well-linking effect of nanofibers in the microstructure of the hardened cement pastes has been found by scanning electron microscope (SEM) analysis and well-explained for the increase in mechanical strength. Besides, field emission transmission electron microscope (FE-TEM) analysis and thermal gravimetric analysis (TGA) have also been conducted to analyze the properties of nanofibers as well as the microstructure of the hardened modified cement pastes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.308-317
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• 2007

We fabricated thermally-evaporated 10 nm-Ni/(poly)Si and 10 nm-$Ni_{0.5}Co_{0.5}$/(Poly)Si structures to investigate the microstructure of nickel silicides at the elevated temperatures required lot annealing. Silicides underwent rapid annealing at the temperatures of $600{\sim}1100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope and an Auger depth profilescope were employed for the determination of vortical microstructure and thickness. Nickel silicides with cobalt on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1100^{\circ}C$ and $900^{\circ}C$, respectively, while the conventional nickle monosilicide showed low resistance below $700^{\circ}C$. Through TEM analysis, we confirmed that a uniform, $10{\sim}15 nm$-thick silicide layer formed on the single-crystal silicon substrate for the Co-alloyed case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of $1000^{\circ}C$. Auger depth profile analysis also supports the presence of this mixed microstructure. Our result implies that our newly proposed NiCo-alloy composite silicide process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.15-18
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• 2001

The Mo/si multilayer for EUV lithography was deposited using magnetron sputtering system. The multilayers were characterized using the cross-sectional transmission electron microscope (TEM) and low/high angle X-ray diffraction (XRD). The microstructure of Mo and Si was highly textured structure and amorphous, respectively. The well-defined low angle XRD peaks implies a well-defined multilayer structure. The interfacial layer of Mo-on-Si was thicker than Si-on-Mo interfacial layer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.238-239
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• 2005

With the aim of developing XLPE insulation for extra high voltage cable, we investigated the morphology of cross-linked polyethylene. We used a kind of base materials and additives, and controlled curing condition and amount of additives. The effect of addition of additives on morphology of XLPE such as lamellar density, orientation and additive layer were analyzed using TEM analysis. We applied this result to diffused additive amount was analyzed using FT-IR analysis, and the change of microstructure as the degree of additive diffusion was analyzed using TEM analysis.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.4
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• pp.632-639
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• 1997

Relative density and microstructure of the pressureless sintered TiC-$TiB_2$ composite has been studied. The maximum sintered density was 95% and the critical amounts of sintering aids were 1 wt% Fe and 3 wt% Ni. It was found that TiC matrix phase inhibited effectively grain growth of the dispersed $TiB_2$ phase. The TEM investigation reveals that the Ni-rich precipitates were solidified from the liquid phase, confirmed by the presence of the waved and/or step phase boundaries. The precipitates also acts as the origin of the dislocation formation in the matrix phases.