• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.139-144
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• 2005

A rigorous research is underway in our team, for the design and development of high figure of merits (ZT= 1.5${\sim}$2.0) micro-thermoelectric coolers. This paper discusses the fabrication process that we are using for developing the $Sb_2Te_3-Bi_2Te_3$ micro-thermoelectric cooling modules. It describes how to obtain the mechanical properties of the thin film TEC elements and reports the results of an equation-based multiphysics modeling of the micro-TEC modules. In this study the thermoelectric thin films were deposited on Si substrates using co-sputtering method. The physical mechanical properties of the prepared films were measured by nanoindentation testing method while the thermal and electrical properties required for modeling were obtained from existing literature. A finite element model was developed using an equation-based multiphysics modeling by the commercial finite element code FEMLAB. The model was solved for different operating conditions. The temperature and the stress distributions in the P and N elements of the TEC as well as in the metal connector were obtained. The temperature distributions of the system obtained from simulation results showed good agreement with the analytical results existing in literature. In addition, it was found that the maximum stress in the system occurs at the bonding part of the TEC i.e. between the metal connectors and TE elements of the module.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.11
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• pp.7-13
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• 2002

BSCT 320${\times}$240 IRFPA detector module is implemented, which is a key component in uncooled thermal imaging systems. The detector module consists of two parts, infrared sensitive pixel array and read-out integrated circuit(ROIC). The BSCT 320${\times}$240 pixels are made by laser scribe process and 10-${\mu}m$ micro-bump to satisfy 50-${\mu}m$ pitch and 95-% fill-factor. The ROIC has been designed to electrically address the pixels sequentailly and to improve signal-to-noise ratio with single transistor amplifier, HPF, tunable LPF and clamp circuit. The fabricated hybrid chip of detector and ROIC has been mounted on the TEC built-in ceramic package for more stable operation and tested for lots of electrical and optical properties. The IRFA sample has shown successful properties and met with good results of fill-factor, detectivity and responsivity.

• ETRI Journal
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• v.31 no.6
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• pp.770-777
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• 2009

We have developed a fully functional reconfigurable optical add-drop multiplexer (ROADM) switch module using a polymer integrated photonic lightwave circuit technology. The polymer variable optical attenuator (VOA) array and digital optical switch array are integrated into one polymer PLC chip and packaged to form a 10-channel VOA integrated optical switch module. Four of these optical switch modules are used in the ROADM switch module to execute 40-channel switching and power equalization. As a wavelength division multiplexer (WDM) filter device, two C-band 40-channel athermal arrayed waveguide grating WDMs are used in the ROADM module. Optical power monitoring of each channel is carried out using a 5% tap PD. A controller and firmware having the functions of a 40-channel switch and VOA control, optical power monitoring, as well as TEC temperature control, and data communication interfaces are also developed in this study.

• Journal of the Korea Institute of Military Science and Technology
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• v.10 no.4
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• pp.138-144
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• 2007

This paper introduces the design techniques of an IR module using the 2-D array un-cooled type infrared detector which is applied to the individual combat weapon. Considering the size and weight of the hand carried weapon system, we used a very small-sized detector and applied an adaptive temperature control algorithm so that the operation consumed with low power can be possible. We applied the AR(Auto Regressive) filter to improve the signal-to-noise ratio in a thermal image processing step. We also applied the plateau equalization and boundary enhancement techniques to improve the visibility for human visual system.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.2
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• pp.1-8
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• 2014

In this paper, SOA Current and Temperature Driver which consisted of LabVIEW programming part capable of current and temperature transient response pattern design, DAQ module for analog voltage in&out, and voltage to current converting chips has realized. The output current(possible to 3A) from the Driver to SOA was clearly constant without ripple and also showed no variance until 1mA unit for a long time operation. The temperature of TEC took several seconds to reach a set temperature, and were maintained stably within ${\pm}^0.1{\circ}C$ for several hours. The proposed Driver can replace the previous high cost SOA Drivers for wavelength swept lasers fully and provides the convenience of transient response design capability for current and temperature.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.2009-2010
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• 2011

AMI환경에서 댁내 전력정보표시장치가 코디네이터로서 지그비 네트워크를 운용할 수 있도록 모듈 형태의 지그비 모뎀을 개발함에 있어서, 스마트 에너지 프로파일 기반의 지그비 통신 어플리케이션 펌웨어와 무선으로 송수신한 정보를 IHD에 전달하기 위한 UART 프로토콜을 설계하였다. 실제 제주실증단지의 가옥에서 시험한 결과, 정상 동작하는 것을 확인할 수 있었다.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.343-345
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• 2007

Temperature difference between two plates occurs when a current is passed though two semi-conductors that are connected each other at two junctions. The current drives a transfer of heat from one junction to the other. In this study, the thermoelectric module based on th "Peltier effect" was made by combing fullerene and polyaniline. Continuous temperature measurements on both surfaces were performed at room temperature($25.4^{\circ}C$) by an infrared non-contact thermometer. The results showed that cool ing effect of $2.2^{\circ}C$ was attained by 30 seconds, after which the effect was continuously vanished mainly due to electro decomposition.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.140-151
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• 1996

In this paper, we analyze the variations of thermal characteristics of LD (laser diode) arrays packaged by a flip-chip bonding method. When we simulate the temperature distribution in LD arrays with a BEM (boundary element method) program coded in this paper, we find that thermal crosstalks in LD arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in LD arrays packaged by previous methods. In the LD array module packaged by the flip-chip bonding technique without TEC (thermo-electric cooler), the important parameter is the absolute temperature of the active layer increased due cooler), the important parameter is the absolute temperature of th eactiv elayers of LD arrays to thermal crosstalk. And we find that the temperature of the active layers of LD arrays increases up to 125$^{\circ}C$ whenall four LDs, without a carefully designed heatsink, are turned on, assuming the power consumption of 100mW from each LD. In order to reduce thermal crosstalk we propose a heatsink sturcture which can decrease the temeprature at the active layer by 40%.

• Korean Journal of Optics and Photonics
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• v.26 no.6
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• pp.306-311
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• 2015

We report the characteristics of a single-wavelength-tunable fiber laser using a polymer waveguide Bragg grating (PWBG) wavelength filter. The output of the laser depends on environmental conditions, such as temperature and polarization states in the laser cavity. Wavelength tuning can be achieved, about 16.29 nm from 1548.24 nm to 1531.95 nm, according to the electric power applied to the PWBG wavelength filter. The achieved efficiency slope is about -0.16 nm/mW. A side-mode suppression ratio (SMSR) of more than 35 dB can be obtained by adjusting the polarization state in the laser cavity. A stable wavelength-tunable fiber laser can be achieved using the PWBG wavelength filter with a TEC module and a polarization-maintaining fiber.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.5
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• pp.2567-2572
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• 2014

In the present study, we aimed to obtain multi jig that PCB sheet with several PCB component can cut in a short time as to the Separation of PCB component. PCB supporter designed safely at the base frame and each model can be separable. it completed the neodium magnet for the fixing of the upper part laser transmission hole of the both. One of the development, the cutting working with one base frame which PCB component of various standard, fixing of module and bridge connected to PCB component could be possible. and it reduced the inconvenience which has to replace the base frame and PCB sheet fixed member. It compared to other press up about 70% of accuracy and a reduction in investment cost was about 400%.