• 한국진공학회지
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• 제15권2호
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• pp.180-185
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• 2006

[ $Bi_{0.5}Sb_{1.5}Te_{3}/Bi_{2}Te_{2.4}Se_{0.6}$ ]계 박막형 열전발전 소자에 의해 volt 단위의 비교적 고전압에서 microwatt 수준의 출력을 발생시킬 수 있었다. 최대 출력은 온도차와 2차 함수적인 관계가 있었고, 주어진 온도차에서 판형 모듈의 적층수에 비례하여 증가하였다. 판형 모듈의 적층수와 직렬/병렬 연결 조합의 변화에 의해 출력 전압과 전류를 조절할 수 있었다. 온도차에 대한 개회로 전압과 폐회로 전류의 변화는 직선성을 보였다. 개회로 전압은 직렬 연결의 경우 판형 모듈의 수에 의존하였지만, 병렬 연결의 경우에는 의존하지 않았다. 반면, 폐회로 전류는 직렬연결의 경우 판형 모듈의 적층수와 무관하게 일정한 값을 나타내었고, 병렬 연결의 경우 판형 모듈의 적층수에 비례하여 증가하였다.

• Transactions on Electrical and Electronic Materials
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• 제15권5호
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• pp.257-261
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• 2014

Multilayered CdTe/PSS films were prepared by the electrostatic self-assembly method in an aqueous medium. Positively-charged cadmium telluride (CdTe) nanoparticles and anionic polyelectrolyte, poly (sodium 4-styrene sulfonate) (PSS) were assembled alternately in order to build up a multilayered film structure. A linear proportion of absorbance to the number of bilayers suggests that an equal amount of CdTe was adsorbed after each dipping cycle, which resulted in the buildup of a homogenous film. The binding energies of elements (Cd and Te) in multilayered CdTe/PSS film shifted from those of the CdTe nanoparticles in the pure state. This result indicates that the interfacial electron densities were redistributed by the strong electrostatic interaction between the oppositely-charged CdTe and PSS. Electrochemical properties of the multilayered CdTe/PSS films were studied in detail by cyclic voltammetry (CV).

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.233-233
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• 2012

위상절연체(Bi2Te3)와의 격자상수 불일치 비율이 서로 다른 Si (111)와 Ge (111) 기판을 선택하여 Bi3Te3 박막의 성장 조건을 찾고 이에 따른 특성 분석을 수행하였다. 시료 제작은 초고진공 분위기에서 MBE를 이용하였고, AFM, XRD와 XPS로 각각 구조적 변화, 결정 상태 및 화학적 상태를 분석하였다. 우선 Si 위에 형성된 Bi2Te3의 경우, 초기 박막이 형성된 후, 증착 시간이 증가함에 따라 섬(island)모양의 구조물들이 step edge 부분에 분포되는 모습을 AFM 이미지에서 확인하였다. 형성된 박막의 스텝 단차는 약 1 nm 또는 이 값의 정수 배였고, 이것은 Bi2Te3 unit cell의 quintuple layer (QL) 값과 일치하였다. 또한 측정된 XRD pattern으로 Bi2Te3가 hexagonal 구조의 c-축에 따라 결정성이 이루어졌음을 확인할 수 있었다. XPS 스펙트럼에서는 Bi 4f가 높은 에너지 방향으로 2.3 eV, Te 3d는 낮은 에너지 방향으로 약 0.7 eV 만큼 구속 에너지의 화학적 이동이 나타남을 알 수 있었다. 이러한 결과는 Si 위에 Bi2Te3 박막이 높은 결정성을 가지고 형성되었다는 것을 의미한다. 또한 Si (111) 기판보다 Bi2Te3 결정과 격자상수 불일치의 비율이 상대적으로 작은 Ge (111)을 기판으로 하여 Bi2Te3 박막을 성장시켜 두 표면에서의 박막 성장의 특성을 비교, 논의할 것이다.

• 한국표면공학회지
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• 제29권5호
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• pp.325-329
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• 1996

We report on p-type arsenic doping of metalorganic vapor phase epitaxially (MOVPE) grown HgCdTe on (100) GaAs. HgCdTe was grown at $370^{\circ}C$ in a horizontal reactor with using dimethy-cadmium, diisoprophyltelluride, and elemental Hg. We used tris-dimethylaminoarsenic (DMAAs) as the metalorganic for p-doping. 4micron thick CdTe and subsequently 10micron thick HgCdTe were grown on (100) GaAs substrate. Interdiffused multilayer process in which thin CdTe and HgTe layers are grown alternately and interdiffused to obtain homogeneous HgCdTe alloys was used. Arsenic was doped during CdTe growth cycle. After growth HgCdTe was annealed at $415^{\circ}C$ for 15 min and then annealed again at $220^{\circ}C$ for 3 hr, both with Hg-saturate condition. We could obtain p-doping from 2.5$\times$$10^{16}$ to 6.6$\times$$10^{17}$$cm^{-3}$, depending on the DMAAs partial pressure. With the dual Hg-annealing, activation of arsenic was aboutt 90%, which was confirmed by SIMS measurement. With only low temperature annealing at $220^{\circ}C$ for 3hr, activation efficiency was about 50%.

• 한국전기전자재료학회논문지
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• 제21권5호
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• pp.411-414
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• 2008

The germanium films were deposited by metal organic chemical vapor deposition using $Ge(allyl)_4$ precursors on TiAlN substrates. Deposition of germanium films was only possible with a presence of $Sb(iPr)_3$, which means that $Sb(iPr)_3$ takes a catalytic role by a thermal decomposition of $Sb(iPr)_3$ for Ge film deposition. Also, as Sb bubbler temperature increases, deposition rate of the Ge films increases at a substrate temperature of $370^{\circ}C$. The GeTe thin films were fabricated by MOCVD with $Te(tBu)_2$ on Ge thin film. The GeTe films were grown by the tellurium deposition at $230-250^{\circ}C$ on Ge films deposited on TiAlN electrode in the presence of Sb at $370^{\circ}C$. The GeTe film growth on Ge films depends on the both the tellurium deposition temperature and deposition time. Also, using $Sb(iPr)_3$ precursor, GeSbTe films with hexagonal structures were fabricated on GeTe thin films. GeSbTe films were deposited in trench structure with 200 nm*120 nm small size.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1994년도 제6회 학술발표회 논문개요집
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• pp.43-43
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• 1994

We studied chemical reactio of Eu metal on the in situ cleaved CdTe(110) surface by pphotoemission sppectroscoppy using synchrotron radiation. The chamber was maintained with base ppressure $\leq$2${\times}$10-10 mb during the expperiment. The expperiment was carried out in pphoton Factory in Jappan. Core level pphotoemission sppectroscoppy was carried out with Al K${\alpha}$ Line. The CdTe simiconductor was determined to be pp-typpe with low dopping concentration from Hall measurement. We found that there are two reacted pphases of Te with Eu (related to divalent Eu and trivalent Eu, resppectively) from least square fitting of Te 4d sppectra, but three is no indication of Cd reaction. Trivalent Eu exists after roughly one monolayer depposition (600 sec. depposition time is considered as one monolayer), which is also observed at Eu 3d core level sppectra. Overlayer Eu is metallized after roughly 2 monolayers depposition, as can be deduced from the fact that metallic edge near Fermi level begins to appear. The intensity of core-level of Te decreases expponentially at the initial stage (near one monolayer) and after one monolayer depposition it decreases more slowly due to Te out-diffusion. We categorized the growth mode of Eu on CdTe as S-K growth mode (cluster formation after one monolayer deppisition) from the relative intensity pplot of Te 4d normalized to the cleaved surface. At cleaved surface band bending is already established due to surface defects. At first 100 sec. depposition time the shift toward lower binding side by 0.6 eV is found at all core level sppectra of all elements in semiconductor. This shift is considered as the re-adjustment of surface Fermi level to the pposition induced by Eu metal (0.2 eV above the valence band maximum).

• 한국결정성장학회지
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• 제4권4호
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• pp.363-369
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• 1994

$Bi_2Te_3$계 열전반도체에서 단결정재료는 성능이 우수한 반면에 그 제조에 있어서 긴 공정시간과 그에 따른 구성성분의 손실이 있다. 본 연구에서는 짧은 공정시간으로 단결정 $Bi_2Te_3$계 열전반도체 제조 공저으이 단점을 극복하기 위해서 $Bi_2Te_3$계 열전반도체 제조 공저의 단점을 극복하기 위해서 $Bi_2Te_3$계 열전반도체를 교류 통전 가압법으로 제작하였다. 이 소결 방법에서는 소결시간이 다른 방법과 비교하여 짧기 때문에 Te의 증발로 인한 결함의 발생을 줄일 수 있었으며 제조공정시 재료의 손실도 최소화할 수있었다. 가압 소결한 95 mol% $Bi_2Te_3-5 mol% Bi_2Se_3$ 다결정 열전반도체의 최적의 소결조건은 분말입도, 소결온도, 시간, 압력별로 각각 $125~250 {\mu}m, 400^{\circ}C$, 2분, $1500Kgf/cm^2$이고, 이조건에서 열전성능지수 $Z=2.2{\times}10^{-3}/K$이다.

• 한국전기전자재료학회논문지
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• 제23권6호
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• pp.502-507
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• 2010

In order to design nano structured materials with enhanced thermoelectric properties, the alloys in the pseudo-binary $Bi_2Te_3$-PbTe system are investigated for their micro structure properties. For this synthesis, the liquid alloys are cooled by the water quenching method. Micro structure images are obtained by using an electron probe micro analyzer(EPMA). Dendritic and lamellar structures are clearly observed with the variation in the composition ratio between $Bi_2Te_3$ and PbTe. The increase in the $Bi_2Te_3$ composition ratio causes to change of the structure from dendritic to lamellar. The Seebeck coefficient of sample 5, in which the mixture rate of $Bi_2Te_3$ is 83%, is measured as the highest value. In contrast, the others decrease with the increase of the $Bi_2Te_3$ composition ratio. Meanwhile, p-type characteristics are observed in sample 6, at 91%-$Bi_2Te_3$ mixture rate. The power factors of the all samples are calculated with the Seebeck coefficient and resistivity.

• E2M - 전기 전자와 첨단 소재
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• 제10권1호
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• pp.39-44
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• 1997

Bulk type radiation detector of Au/Cd$_{1-x}$ Zn$_{x}$Te(x=20%)/Au structure using Cd$_{1-x}$ Zn$_{x}$Te(x=20%) wafer(3x4xl mm$^{3}$) grown by high pressure Bridgman method has been developed. We etched wafer surfaces with 2% Br-methanol solution and coated gold thin film on the surfaces by electroless deposition method for 5 min. in 49/o HAuCI$_{3}$ 4H20 solution. Initial etch rates of Cd, Zn and Te were 46%, 12% and 42% respectively. After etched, the surface of wafer was slightly revealed to Te rich condition. The leakage current was increased with etch time, but it didn't exceed 3nA at 50volt. The thickness of Au film was about 100nm by Rutherford Backscattering Spectroscopy(RBS). The resolution were 6.7% for 22.1 keV photon from 109 $^{109}$ Cd and 8.2% for 59.5 keV photon from $^{241}$ Am. The radiation detector such as Au/Cd$_{1-x}$ Zn$_{x}$Te(x=20%)/Au structure was more effective to monitor the low energy gamma radiation.iation.

• Korean Chemical Engineering Research
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• 제50권4호
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• pp.729-732
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• 2012

본 논문에서 이온성액체를 이용한 초음파화학을 통해서 칼코젠 나노입자를 in-situ로 합성하여서 다중벽 탄소나노튜브(MWCNT) 위에 도포하였다. 1-Butyl-3-methylimidazolium tetrafluoroborate ($BMimBF_4$) 이온성액체를 이용해서 MWCNT의 표면을 기능화하였다. 합성된 MWCNT/$BMimBF_4$/CdTe, MWCNT/$BMimBF_4$/ZnTe, MWCNT/$BMimBF_4$/ZnSe 나노복합체를 TEM과 EDS를 이용해서 분석하였다. 특히, MWCNT/$BMimBF_4$/CdTe, MWCNT/$BMimBF_4$/ZnTe, and MWCNT/$BMimBF_4$/ZnSe 나노복합체는 각각 요철과 같거나, 거칠거나 부드러운 코어-쉘 형태와 같은 특이한 구조를 보여주었다. 본 연구는 반응속도가 다른 전구체로부터 얻어진 이성분 반도체 나노입자를 합성과 동시에 탄소나노튜브에 도포할 수 있는 새로운 합성법을 제시한다.