• Title/Summary/Keyword: T-joint%2C FEM

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A Study on the Fatigue Life Prediction of Solder Joints under Thermal Cyclic Loading (온도사이클을 받는 Solder Joint의 피로수명에 관한 연구)

  • 김진기;이순복
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.31A no.12
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    • pp.44-55
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    • 1994
  • This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""${\Delta}{\varepsilon}_p$" and temperature "T". Solder joint under thermal cyclic loading was analyzed by FEM. this FEM analysis together with the crack growth rate will provide the capability of the fatigue life prediction of solder joints and enhance the reliability od solder joint.

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A Study of the High Reliability in Plastic BGA Solder Joints (플라스틱 BGA 솔더접합부의 고신뢰성에 관한 연구)

  • Kim, Kyung-Seob;Shin, Young-Eui;Lee, Hyuk
    • Journal of Welding and Joining
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    • v.17 no.3
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    • pp.90-95
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    • 1999
  • The increase in high speed, multi-function and high I/O pin semiconductor devices highly demands high pin count, very thin, and high density packages. BGA is one of the solutions, but the package has demerits in package reliability, surface mounting problems due to the PCB warpage and solder joint crack related with TCE mismatch between the materials. On this study to verify the thermal fatigue lifetime of the solder joint FEM and experiments were performed after surface mounting BGA with different solder composition and reliability conditions. FEM showed optimum composition of Ag3.2-Sn96.5 and under the composition minimum creep deformation of the solder joint was calculated, and the thermal fatigue lifetime was improved. In view of temperature cycle condition, the conditions of $-65^{\circ}C$to $150^{\circ}C$ showed minimum lifetime and t was 1/3 of $0^{\circ}C$ to $125^{\circ}C$ condition. Test board was prepared and solder joint crack was verified. Until 1000cycle on soder joint crack was observed.

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Stress Analysis of C.V. Joint Rubber Boots by Finite Element Method and Application to Design Modification (유한요소법을 이용한 등속 조인트 고무 부트의 변형해석 및 설계변경에의 응용)

  • Kim, S. H.;Lee, H. W.;Huh, H.;Lee, J. H.;Oh, S. T.
    • Transactions of the Korean Society of Automotive Engineers
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    • v.6 no.3
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    • pp.123-137
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    • 1998
  • The finite deformation with self contact problem of C. V. joint boots is analysed by using the implicit finite element code ABAQUS/Standard. It is shown that analysis results have a good agreement with experimental ones to the degree of maximum rotation angle. As an application of design modification, the effects of thickness change of the rounded part of boot model on the bending and the contact situation of deformed geometry are investigated. In this paper, the effect of the design modification in the end on the leakage is examined using 2-D finite element simulation. To solve the leakage problem of grease, the length of the small end is enlarged. From this study, it is confirmed that we can save the cost and time by applying FEM techniques to analyze and design the boot model.

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