• 제목/요약/키워드: System semiconductor

검색결과 2,546건 처리시간 0.031초

모터펌프의 지능형 진단시스템 구현에 관한 연구 (A Study on the Implementation of Intelligent Diagnosis System for Motor Pump)

  • 안재현;양오
    • 반도체디스플레이기술학회지
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    • 제18권4호
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    • pp.87-91
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    • 2019
  • The diagnosis of the failure for the existing electrical facilities was based on regular preventive maintenance, but this preventive maintenance was limited in preventing a lot of cost loss and sudden system failure. To overcome these shortcomings, fault prediction and diagnostic techniques are critical to increasing system reliability by monitoring electrical installations in real time and detecting abnormal conditions in the facility early. As the performance and quality deterioration problem occurs frequently due to the increase in the number of users of the motor pump, the purpose is to build an intelligent control system that can control the motor pump to maximize the performance and to improve the quality and reliability. To this end, a vibration sensor, temperature sensor, pressure sensor, and low water level sensor are used to detect vibrations, temperatures, pressures, and low water levels that can occur in the motor pump, and to build a system that can identify and diagnose information to users in real time.

Calibration Methodology for TCAD System

  • 이준하;이홍주
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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    • pp.160-162
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    • 2003
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차세대 웨이퍼 생산시스템에서의 실시간 스케줄링 시스템 아키텍처 (A Real-Time Scheduling System Architecture in Next Generation Wafer Production System)

  • 이현;허선;박유진;이건우;조용주
    • 산업경영시스템학회지
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    • 제33권3호
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    • pp.184-191
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    • 2010
  • In the environment of 450mm wafers production known as the next-generation semiconductor production process, one of the most significant features is the full automation over the whole manufacturing processes involved. The full automation system for 450mm wafer production will minimize the human workers' involvement in the manufacturing process as much as possible. In addition, since the importance of an individual wafer processing increases noticeably, it is necessary to develop more robust scheduling systems in the whole manufacturing process than so ever. The scheduling systems for the next-generation semiconductor production processes also should be capable of monitoring individual wafers and collecting useful data on them in real time. Based on the information gathered from these processes, the system should finally have a real-time scheduling functions controlling whole the semiconductor manufacturing processes. In this study, preliminary investigations on the requirements and needed functions for constructing the real time scheduling system and transforming manufacturing environments for 300mm wafers to those of 400mm are conducted and through which the next generation semiconductor processes for efficient scheduling in a clustered production system architecture of the scheduler is proposed. Our scheduling architecture is composed of the modules for real-time scheduling, the clustered production type supporting, the optimal scheduling and so on. The specifications of modules to define the major required functions, capabilities, and the relationship between them are presented.

웨이브렛 변환을 이용한 선형시스템 분석: 초음파 신호 해석의 응용 (Linear System Analysis Using Wavelets Transform: Application to Ultrasonic Signal Analysis)

  • 주영복
    • 반도체디스플레이기술학회지
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    • 제19권4호
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    • pp.77-83
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    • 2020
  • The Linear system analysis for physical system is very powerful tool for system diagnostic utilizing relationship between the input signal and output signal. This method utilized generally to investigate physical properties of system and the nondestructive test by ultrasonic signals. This method can be explained by linear system theory. In this paper the Continuous Wavelets Transform is utilized to search the relation between the linear system and continuous wavelets transform.

Ball Grid Array Solder Void Inspection Using Mask R-CNN

  • Kim, Seung Cheol;Jeon, Ho Jeong;Hong, Sang Jeen
    • 반도체디스플레이기술학회지
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    • 제20권2호
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    • pp.126-130
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    • 2021
  • The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

PI 관측기 기반 반도체 장비 모터의 궤적 추종 제어기 설계 (Trajectory Tracking Controller for Semiconductor Equipment Motors based on PI Observer)

  • 조윤성;최현준;전상민;신지훈;이재영;이범주;손영익
    • 반도체디스플레이기술학회지
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    • 제22권2호
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    • pp.96-103
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    • 2023
  • This paper presents a robust position tracking controller for a motor used in semiconductor equipment, utilizing the motor angle measurement. Precise position control is challenging due to the presence of uncertainties in various motor applications. The proposed controller consists of a PD (Proportional-Derivative) controller and a PIO (Proportional-Integral Observer) to estimate the system's state and equivalent disturbance compensating for the uncertainties. Since the stability alternates as the observer gain increases, we have investigated it through the closedloop root locus under the system parameters change. The analysis has showed that the inertia of the motor is the main parameter that affects it, and by adjusting the control gain appropriately, the system can be rendered to be stable even when the inertia of the motor changes. The effectiveness of the proposed control algorithm is validated through computer simulations, followed by a comparison of its performance with the results of a previous study.

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영상모델링을 이용한 표면결함검출에 관한 연구 (A Study on the Detection of Surface Defect Using Image Modeling)

  • 목종수;사승윤;김광래;유봉환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 추계학술대회 논문집
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    • pp.444-449
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    • 1996
  • The semiconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip affect on the functions of the semiconductors. The defects of the chip surface are cracks or voids. As general inspection method requires many inspection procedure, the inspection system which searches immediately and precisely the defects of the semiconductor chip surface is required. We suggest the detection algorithm for inspecting the surface defects of the semiconductor surface. The proposed algorithm first regards the semiconductor surface as random texture and point spread function, and secondly presents the character of texture by linear estimation theorem. This paper assumes that the gray level of each pixel of an image is estimated from a weighted sum of gray levels of its neighbor pixels by linear estimation theorem. The weight coefficients are determined so that the mean square error is minimized. The obtained estimation window(two-dimensional estimation window) characterizes the surface texture of semiconductor and is used to discriminate the defects of semiconductor surface.

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전기이중층 캐패시터용 밸런싱 시스템 (Balancing System for Electric Double Layer Capacitor)

  • 남종하;조현목;박재구;박승욱;강덕하;김영석;황호석
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2013년도 전력전자학술대회 논문집
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    • pp.59-60
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    • 2013
  • 슈퍼캐패시터(Super Capacitor) 또는 울트라 캐패시터(Ultra Capacitor) 등으로 불리우는 전기 이중층 캐패시터(EDLC, Electric Double Layer Capacitor)는 기존 콘덴서보다 월등한 용량 특성을 가지며, 전극과 전해질의 화학반응을 이용하던 이차전지들과 달리 주로 계면반응을 사용한 축전원리를 이용하여 높은 출력밀도와 충방전 효율, 무제한에 가까운 사이클 특성을 가지고 있다. 또한 전류변화에 안정적이어서 기존의 이차전지와는 달리 보호회로를 생략할 수 있기 때문에 단순한 회로 구성이 가능하고 전극활물질로서 탄소재를 사용하여 환경 친화적인 특성을 가진 차세대 에너지저장장치라고 할 수 있다. 특히 50만 사이클이라는 우수한 수명특성으로 인해 기존의 이차전지가 사용되기 어려운 다양한 분야에 적용이 늘어가고 있는 추세에 있다.

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전문대학 반도체 응용과 교육과정 개발 (Development on the Curriculum of the Department of Semiconductor Technology in Ulsan College)

  • 박효열;김근주
    • 대한전자공학회논문지TE
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    • 제37권4호
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    • pp.35-46
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    • 2000
  • 반도체 전공분야의 교육과정은 반도체소자를 제작하는데 있어 디자인하고 소자특성을 시뮬레이션하기 위한 반도체 설계와 반도체장비를 이용하여 재료를 가공하는 반도체공정 및 제작된 소자의 특성을 평가하고 검사하는 신뢰성 공정, 그리고 패키징 공정까지 포함된다. 반도체응용과의 교육과정을 2년 6학기제로 편성하여, 1학년은 직업인의 기본교양 및 인성교육과 함께 반도체 재료 및 회로등 전공기초 소양 및 원리를 습득하는데 중점을 두고 2학년에서는 국제적인 추세인 반도체 설계분야 및 반도체공정을 이해하게 된다. 특히, 국내의 빈약한 반도체 설계분야를 활성화하기 위하여 설계기술을 집중적으로 훈련시키고 특성화하여, 반도체 설계분야의 기능화된 인력을 공급할 수 있도록 교육과정을 편성하였다.

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