• The KIPS Transactions:PartD
• /
• v.11D no.2
• /
• pp.461-470
• /
• 2004

As the semiconductor industrials change 200㎜-sized semiconductor wafer production process to 300㎜-sized one, it requires to develop the software for monitoring and simulating the robot which transfers a 300㎜-sized semiconductor wafer. Because such a software don't run at standalone but communicate MCS(Material Control System) and Its subsystem a robot, its architecture is very complex. Therefore, in order to develop such a software systematically, we must utilize an object-oriented development methodology. UML. This paper presents an UML process application developing the software for monitoring and simulating the robot which transfers a semiconductor wafer on the production process.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.1
• /
• pp.40-44
• /
• 2018

In this paper, the efficiency of the solar system is lowered due to the partial shading such as the environmental factors of the solar panel. In order to solve this problem, a DC OPTIMIZER is proposed for a maximum power generation system of a photovoltaic panel. The proposed DC OPTIMIZER is composed of a buck structure that performs the maximum power point tracking (MPPT) control of each module of the solar panel, thus maximizing the efficiency. In order to verify the proposed DC Optimizer, the efficiency was measured by varying the irradiance using a solar simulator instead of the solar panel. As a result, it showed high efficiency characteristics as the maximum energy conversion efficiency was 99.3% at $800w/m^2$, $900w/m^2$, and the average efficiency was 99.06% excluding $100w/m^2$. The maximum efficiency of MPPT was 99.97% at $200w/m^2$, efficiency showed excellent performance.

• Journal of the Semiconductor & Display Technology
• /
• v.18 no.1
• /
• pp.65-69
• /
• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• Journal of the Semiconductor & Display Technology
• /
• v.20 no.3
• /
• pp.71-76
• /
• 2021

Digital decimation filters are used in various digital signal processing systems using ADCs, including digital communication systems and sensor network systems. When the sampling rate of digital data is reduced, aliasing occurs. So, an anti-aliasing filter is necessary to suppress aliasing before down-sampling the data. Since the anti-aliasing filter has to have a sharp transition band between the passband and the stopband, the order of the filter is very high. However, as the order of the filter increases, the complexity and area of the filter increase, and more power is consumed. Therefore, in this paper, we propose two types of decimation filters, focusing on reducing the area of the hardware. In both cases, the complexity of the circuit is reduced by applying the required down-sampling rate in two times instead of at once. In addition, CIC decimation filters without a multiplier are used as the decimation filter of the first stage. The second stage is implemented using a CIC filter and a down sampler with an anti-aliasing filter, respectively. It is designed with Verilog-HDL and its function and implementation are validated using ModelSim and Quartus, respectively.

• Korean Journal of Optics and Photonics
• /
• v.34 no.2
• /
• pp.61-65
• /
• 2023

This paper studies a method of applying pre-distortion to the image mask of the gobo illumination optical system to correct an irradiated image and irradiate a clear image. In the case of the gobo illumination optical system, since it is generally irradiated with a tilt, distortion in the upper and lower directions occurs severely in the image. To solve this problem, the correction coordinates of the image were derived using a proportional equation, and the distortion was corrected by applying them to the image mask. As a result, it was confirmed that the distortion was reduced by 64.5% compared to the case of using the existing image mask.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.4
• /
• pp.66-69
• /
• 2018

This study was researched the electrical properties of semiconductor devices such as ITO, $SiO_2$, $V_2O_5$ thin films. The films of ITO, $SiO_2$, $V_2O_5$ were deposited by the rf magnetron sputtering system with mixed gases of oxygen and argon to generate the plasma. All samples were cleaned before deposition and prepared the metal electrodes to research the current-voltage properties. The electrical characteristics of semiconductors depends on the interface's properties at the junction. There are two kinds of junctions such as ohmic and schottky contacts in the semiconductors. In this study, the ITO thin film was shown the ohmic contact properties as the linear current-voltage curves, and the electrical characteristics of $SiO_2$ and $V_2O_5$ films were shown the non-linear current-voltage curves as the schottky contacts. It was confirmed that the electronic system with schottky contacts enhanced the electronic flow owing to the increment of efficiency and increased the conductivity. The schottky contact was only defined special characteristics at the semiconductor and the interface depletion layer at the junction made the schottky contact which has the effect of leakage current cutoff. Consequently the semiconductor device with shottky contact increased the electronic current flow, in spite of depletion of carriers.

• Journal of the Korea Convergence Society
• /
• v.8 no.11
• /
• pp.43-48
• /
• 2017

Semiconductors are leading the development of industrial technology, leading to miniaturization and weight reduction of electronic products as a leading technology, we are dragging the electronic industry market Especially, the semiconductor manufacturing process is composed of highly accurate and complicated processes, and effective production is required Recently, a vision system combining a computer and a camera is utilized for defect detection In addition, the demand for a system for measuring the shape of a fine pattern processed by a special process is rapidly increasing. In this paper, we propose a vision algorithm using mask image to detect scratch defect of semiconductor pockage. When applied to the manufacturing process of semiconductor packages via the proposed system, it is expected that production management can be facilitated, and efficiency of production will be enhanced by failure judgment of high-speed packages.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.3
• /
• pp.119-124
• /
• 2023

In this study, experimental approach of the measurement of condensation and evaporation heat transfer coefficients is discussed for mixed refrigerants using in the ultra low-temperature cooling system for semiconductor etching process. An experimental apparatus was described performing the condensation and evaporation heat transfer measurements for mixed refrigerants. The mixed refrigerant used in this study was composed of the optimal mixture determined in previous research, with a composition of Ar:R14:R23:R218 = 0.15:0.4:0.15:0.3. The experiments were conducted over a temperature range from -82℃ to 15℃ and at pressures ranging from 18.5 bar to 5 bar. The convection heat transfer coefficients of the mixed refrigerant were measured at flow rates corresponding to actual operating conditions. The condensation heat transfer coefficient ranged from approximately 0.7 to 0.9 kW/m2K, while the evaporation heat transfer coefficient ranged from 1.0 to 1.7 kW/m2K. The detailed discussion of the experimental methods, procedures, and results were described in this paper.

• Proceedings of the KIPE Conference
• /
• 2003.07a
• /
• pp.291-293
• /
• 2003

A semiconductor switch-based fast hi-polar high voltage pulse generator is proposed in this paper The proposed pulse system is made of a thyristor based-rectifier, DC link capacitor, a push-pull resonant inverter, a high voltage transformer. secondary capacitor, a high voltage IGBT & diode stacks, and a variable capacitor. The proposed system makes hi-polar high voltage sinusoidal waveform using resonance between leakage inductance of the transformer and secondary capacitor and transfers energy to output load at maximum of the secondary capacitor voltage. Compared to previous hi-polar high voltage pulse power supply using nonlinear transmission line, the proposed pulse power system using only semiconductor switches has simple structure and gives high efficiency

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2007.11a
• /
• pp.1241-1246
• /
• 2007

In recent years, the semiconductor industry and the optical industry are developed rapidly. The recent demands have expanded for optical components such as the optical lens, the optical semiconductor and the measuring instrument. Object transport systems are driven typically by the magnetic field and the conveyer belt. Recent industry requires more faster and efficient transport system. However, conventional transport systems are not adequate for transportation of optical elements and semiconductors. The conveyor belts can damage precision optical elements by the contact force and magnetic systems can destroy the inner structure of semiconductor by the magnetic field. In this paper, the levitation transport system using ultrasonic wave is developed for transporting precision elements without damages. The steady state flexural vibration of the beam is expressed using Euler-Bernoulli beam theory. The transport direction of an object is examined according to phase difference and frequency. The theoretical results are verified by experiments.