• Journal of Korean Society of Industrial and Systems Engineering
• /
• v.26 no.3
• /
• pp.67-73
• /
• 2003

Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study we design the integrated manufacturing system for compound semiconductor fabrication t hat has monitoring of process, reduction of lead-time, obedience of due-dates and so on. This study presents integrated manufacturing system having database system that based on web and data acquisition system. And we will implement them in the actual compound semiconductor fabrication.

• Journal of the Korea Society of Computer and Information
• /
• v.22 no.10
• /
• pp.1-7
• /
• 2017

In this paper, the separation force measuring system is developed. The separation force aries due to adhesive strength between semiconductor epoxy molding compound(EMC) and the metal plate in semiconductor formed plate. In general, when removing the metal plate in semiconductor formed plate from semiconductor epoxy molding compound, excessive strength can result in a increase in semiconductor defect rates, or conversely, if too little force is exerted on the metal plate in semiconductor formed plate, the semiconductor production rates can decrease. In this study, the design criteria for the selection of the AC servo motor, the role of the ball screw, the relationship between the load cell and the ball screw, and the rate of deceleration are given. In addition, minimizing the reject rate of semiconductors and maximizing the semiconductor production rate are achieved through the standardization of the collected separation force data measured by the proposed system.

• IE interfaces
• /
• v.20 no.3
• /
• pp.277-287
• /
• 2007

Semiconductor manufacturing is one of the most complex and capital-intensive processes composed of several hundreds of operations. In today’s competitive business environments, it is more important than ever before to manage manufacturing process effectively to achieve better performances in terms of customer satisfaction and productivity than those of competitors. So, many semiconductor manufacturing companies implement advanced planning and scheduling (APS) system as a management tool for the complex semiconductor manufacturing process. In this study, we explain roles of production planning and scheduling in semiconductor manufacturing and principal factors that make the production planning and scheduling more difficult. We describe the APS system implementation project at Korean semiconductor manufacturing company in terms of key issues with realistic samples.

• Journal of Korea Society of Digital Industry and Information Management
• /
• v.11 no.4
• /
• pp.1-12
• /
• 2015

This research analyzes the current state of the semiconductor industry delivering the prediction for the future development of the semiconductor industry along with some semiconductor memory's responsive strategies. In the 2014, top 10 semiconductor companies were targeted and studied its growth based on its profitability and growth indications in perspective during three years. The system semiconductor industry with the increase in Hyper-scale customers, proactive actions in the technology consortium, is polarizing caused by increased R&D expense to ensure process scaling limits and high performance, and some results have shown: PC and Mobile slowdown and growth recession phenomenon due to IoT's unclear direction. The leading company is to secure new growth engines through 'Acquiring'. While as the subordinated companies following this consecutive survival through the 'Acquired', the future of system semiconductor industry is to strengthen the market dominance and its techniques by concentrating on the reorganization of the market by few large companies. Accordingly, the semiconductor memory industry is expected to reach the limit of its expansion to domain of system semiconductor, and it is highly suggesting the need of the 'Memory Life Extension' growth strategy.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.3
• /
• pp.67-72
• /
• 2023

In this paper, a dye-sensitized solar cell (DSSC), one of the representative third-generation solar cells with eco-friendly materials and processes compared to other solar cells, was modeled using MATLAB/Simulink. The simulation was conducted by designating values of series resistance, parallel resistance, light absorption coefficient, and thin film electrode thickness, which are directly related to the efficiency of dye-sensitized solar cells, as arbitrary experimental values. In order to analyze the performance of dye-sensitized solar cells, the optimal value among each parameter experimental value related to efficiency was found using formulas for fill factor (FF) and conversion efficiency.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.5 no.4
• /
• pp.221-228
• /
• 2005

In this work, our goal is to develop a fast and accurate power model of the ARM926EJ-S processor in the industrial design environment. Compared with existing work on processor power modeling which focuses on the power states of processor core, our model mostly focuses on the cache power model. It gives more than 93% accuracy and 1600 times speedup compared with post-layout gate-level power estimation. We also address two practical issues in applying the processor power model to the real design environment. One is to incorporate the power model into an existing commercial instruction set simulator. The other is the re-characterization of power model parameters to cope with different gate-level netlists of the processor obtained from different design teams and different fabrication technology.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2003.12a
• /
• pp.154-159
• /
• 2003

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.335-336
• /
• 2006

Compound semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study, we design data acquisition system of compound semiconductor fabrication that has monitoring and control of process. The developed DAS is consisted of key-in system inputted by operator and automatic acquisition system by GEM protocol. And we implemented them in the actual compound semiconductor. It is expected that using developed system would offer precise process information to buyer, reduce a lead-time, and obey a due-dates and so on.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2004.05a
• /
• pp.123-128
• /
• 2004

Semiconductor Wet Station has a very important place in semiconductor process. It is important that to discharge chemical with fit concentration and temperature using chemical supply system for clean process. The chemical supply system which is used currently is not only difficult to make a fit mixing rate of chemical which is need in clean process, but also difficult to make fit concentration and temperature. Moreover, it has high stability but it is inefficient spatially because its volume is great. We propose In-line System to improve system with implement analysis of fluid and thermal transfer on chemical supply system and understand problem of system.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.1
• /
• pp.43-48
• /
• 2002

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.