• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.751-754
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• 1998

This research aims at developing a single chip multiprocessor for high-performance computer system. Our design approach is to design a relatively small and simple processor unit and to integrate multiple copies of the unit in an efficient way. The proposed multiprocessor is composed of four CPUs and one graphic coprocessor. The four CPUs share the graphic coprocessor and each CPU implements the 64-bit SPARC-V9 instruction set architecture. This paper gives an overview of the proposed microarchitecture and discusses the considerations made in the course of the design.

• IEIE Transactions on Smart Processing and Computing
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• 제5권1호
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• pp.55-62
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• 2016

In this paper, we propose a hybrid multi.system-on-chip (H-MSoC) architecture that provides a high-flexibility system in a rapid development time. The H-MSoC approach provides a flexible system-on-chip (SoC) architecture that is easy to configure for physical- and application-layer development. The physical- and application-layer aspects are dynamically designed and modified; hence, it is important to consider a design methodology that supports rapid SoC development. Physical layer development refers to intellectual property cores or other modular hardware (HW) development, while application layer development refers to user interface or application software (SW) development. H-MSoC is built from multi-SoC architectures in which each SoC is localized and specified based on its development focus, either physical or application (hybrid). Physical HW development SoC is referred to as physical-SoC (Phy-SoC) and application SW development SoC is referred to as application-SoC (App-SoC). Phy-SoC and App-SoC are connected to each other via Ethernet. Ethernet was chosen because of its flexibility, high speed, and easy configuration. For prototyping, we used a LEON3 SoC as the Phy-SoC and a ZYNQ-7000 SoC as the App-SoC. The proposed design was proven in real-time tests and achieved good performance.

• 한국정보과학회논문지:시스템및이론
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• 제35권9_10호
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• pp.485-496
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• 2008

SoC(System-on-Chip)를 설계함에 있어서 칩의 복잡도 증가로 인하여, RTL(Register Transfer Level)에 기반한 기존의 시스템 성능 분석 및 검증 기법만으로는 점차 짧아지는 '시장 적기 출하(time-to-market)' 요구에 효율적으로 대응할 수 없게 되었다. 이를 극복하기 위하여 설계 포기 단계부터 지속적으로 시스템을 검증하기 위한 새로운 설계 방법이 요구되었으며, TLM(Transaction Level Modeling) 추상화 수준을 가진 하드웨어-소프트웨어(HW-SW) 통합 시뮬레이션이 이러한 문제를 해결하기 위한 방법으로 널리 연구되고 있다. 그러나 대부분의 HW-SW 통합 시뮬레이터들은 다양한 추상화 수준 중 일부만을 지원하고 있으며, 서로 다른 추상화 수준을 지원하는 툴들 간의 연계도 쉽지 않다. 이를 극복하기 위하여 본 논문에서는 HW-SW 통합 시뮬레이션을 위한 다목적 선계 프레임워크를 제안한다. 제안하는 프레임워크는 소프트웨어 응용의 설계를 포함하는 체계적인 SoC 설계 플로우를 제공하며, 각 설계 단계에서 다양한 기법들을 유연하게 적용할 수 있는 동시에, 다양한 HW-SW 통합 시뮬레이터들을 지원한다. 또한 플랫폼을 추상화 수준과 모델링 언어에 독립적으로 설계할 수 있어, 다양한 수준의 시뮬레이션 모델 생성이 가능하다. 본 논문에서는 실험을 통하여, 제안하는 프레임워크가 ARM9 기반의 강용 SoC 플랫폼을 정확하게 모델링 할 수 있는 동시에, MJPEG 예제의 성능을 44%까지 향상시키는 성능 최적화를 수행할 수 있음을 검증하였다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.212-215
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• 2005

The needs of larger screen in mobile device would be increased as the time of ubiquitous and convergence is coming. And, the type of mobile device has been evolved from bar, slide to row. Recently, the study on the multi-display screen which has seamless gap between two display panel has been published, and moreover the System On Chip(SOC) design strategy of core chip has been the most promising Field-Programmable Gate Array(FPGA) technology in the display system. Therefore, in this paper, we proposed the design technique of SOC and evaluated the effectiveness with Very high speed Hardware Description Language(VHDL) Intellectual Property (IP) for the operation of multi display device driver. Also, This IP design would be to allow any kind of user interface in control system.

• Journal of Welding and Joining
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• 제30권6호
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• International Journal of Precision Engineering and Manufacturing
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• 제2권2호
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• pp.38-47
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• 2001

This paper decribes the development of computer-aided design of a very precise progressice die for lead frame of semiconductor chip. The approach to the system is based on knowledgr-based rules. Knowledge of fie이 experts. This system has been written in AutoLISP using AutoCAD ona personal computer and the I-DEAS drafting programming Language on the I-DEAS mater series drafting with on HP9000/715(64) workstation. Data exchange between AutoCAD and I-DEAS master series drafting is accomplished using DXF(drawing exchange format) and IGES(initial graphics exchange specification) files. This system is composed of six main modules, which are input and shape treatment, production feasibility check, strip layout, data conversion, die layout, and post processing modules. Based on Knowledge-based rules, the system considers several factors, such as V-notches, dimple, pad chamfer, spank, cavity punch, camber, coined area, cross bow, material and thickness of product, complexities of blank geometry and punch profiles, specifications of available presses, and the availability of standard parts. As forming processes and the die design system using 2D geometry recognition are integrated with the technology of process planning, die design, and CAE analysis, the standardization of die part for lead frames requiting a high precision process is possible. The die layout drawing generated by the die layout module s displayed in graphic form. The developed system makes it possible to design and manufacture lead frame of a semiconductor more efficiently.

• 대한전자공학회논문지SD
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• 제42권2호
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• pp.65-72
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• 2005

공정기술과 EDA 툴의 발전에 따라서 하나의 실리콘 다이(Die)에 많은 IP가 집적되고 멀티프로세서가 포함되는 SoC 구조가 가능해지고 있다 그러나 대부분의 기존 SoC 버스는 공유버스 구조라는 문제점으로 인해 통신의 병목현상이 발생하고 이는 전체 시스템 성능을 저하시키는 요인이 된다. 많은 경우에 멀티프로세서 시스템의 성능은 CPU 자체의 속도보다는 효율적인 통신과 균형있는 연산의 분배가 좌우하게 된다 따라서 충분한 SoC 버스 대역폭(Bandwidth)을 확보하기 위한 하나의 해결책으로 크로스바 라우터(Crossbar Router)를 이용하여 효율적인 온 칩 버스구조인 SoC Network Architecture(SNA)를 제안한다. 제안된 SNA구조는 다중 마스터(multi-master)에 대해 다중 채널(multi-channel)을 제공하여 통신의 병목현상을 크게 줄일 수 있으며 뛰어난 확장성을 지원한다. 제안된 구조에 따라 모델 시스템을 설계하고 시뮬레이션을 진행한 결과 AMBA AHB 버스에 비해 평균 $40\%$ 이상 효율이 증가했다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 하계학술대회 논문집 B
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• pp.1099-1101
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• 2000

ASIC chip design for motor control has been a subject of increasing interest since an effective methodology of system-on-a-chip design was developed. This paper investigates the design and implementation of ASIC chip for vector control of induction motor using VHDL which is a standard hardware description language. The vector control algorithm is finally implemented using a simple electronic circuit based on FPGA. The performance of the designed ASIC is verified through simulation and experiment.

• 한국통신학회논문지
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• 제36권1B호
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• pp.86-92
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• 2011

본 논문에선 분산 메모리 아키텍처를 사용하는 멀티프로세서 시스템에서 메시지 전달을 지원하는 하드웨어 MPI(Message Passing Interface) 유닛을 설계하였다 데이터 전송 동기화 및 데이터 전송, 완료까지의 과정을 하드웨어 MPI 유닛이 담당하여 동기화에 따른 오버헤드를 경감시켰다. 또한 동기화 메시지를 저장 관리하는 요청 큐(Request Queue), 준비 큐(Ready Queue), 예약 큐(Reserve Queue)를 내장하여 병렬적으로 입력받은 동기화 메시지를 관리하고 비순차적 종료(out of order completion)을 지원한다. BMF(Bus Functional Medel)을 제작해 제안한 구조에서의 전송 대역폭 성능을 확인한 결과 다대다 통신에서 25% 이상의 성능 향상이었음을 확인할 수 있었다. 그 후 HDL로 기술된 하드웨어를 Magnachip 0.18 공정 라이브러리에서 합성하였으며 프로토 타입 chip으로 제작하였다. 제안한 MPI 유닛은 전체 칩 사이즈의 1% 이하의 크기로 높은 성능 향상을 기대할 수 있어, 저비용 설계와 확장성 측면에서 임베디드 MPSoC(Multi-Processor System-on-Chip)의 전체적인 성능을 높이는데 유용하다.

• ETRI Journal
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• 제19권3호
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• pp.228-241
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• 1997

In this paper, we present a design of modem and vocoder digital signal processor (DSP) chips for CDMA mobile station. The modem chip integrates CDMA reverse link modulator, CDMA forward link demodulator and Viterbi decoder. This chip contains 89,000 gates and 29 kbit RAMs, and the chip size is $10 mm{\times}10.1 mm$ which is fabricated using a $0.8{\mu}m$ 2 metal CMOs technology. To carry out the system-level simulation, models of the base station modulator, the fading channel, the automatic gain control loop, and the microcontroller were developed and interfaced with a gate-level description of the modem application specific integrated circuit (ASIC). The Modem chip is now successfully working in the real CDMA mobile station on its first fab-out. A new DSP architecture was designed to implement the Qualcomm code exited linear prediction (QCELP) vocoder algorithm in an efficient way. The 16 bit vocoder DSP chip has an architecture which supports direct and immediate addressing modes in one instruction cycle, combined with a RISC-type instruction set. This turns out to be effective for the implementation of vocoder algorithm in terms of performance and power consumption. The implementation of QCELP algorithm in our DSP requires only 28 million instruction per second (MIPS) of computation and 290 mW of power consumption. The DSP chip contains 32,000 gates, 32K ($2k{\times}16\;bit$) RAM, and 240k ($10k{\times}24\;bit$) ROM. The die size is $8.7\;mm{\times}8.3\;mm$ and chip is fabricated using $0.8\;{\mu}m$ CMOS technology.