• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.7 s.349
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• pp.38-49
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• 2006

In this paper, a novel concept based on embedded processor and reconfigurable logic is proposed for efficient manufacturing test and design verification. Unlike traditional gap between design verification and manufacturing test, proposed concept is to combine both design verification and manufacturing test. The semiconductor chip which is using the proposed concept is named "SwToC" and SwToC stands for System with Test On a Chip. SwToC has two main features. First, it has functional verification function on a chip and this function could be made by using embedded processor, reconfigurable logic and memory. Second, it has internal ATE on a chip and this feature also could be made by the same architecture. To evaluate the proposed SwToC, we have implemented SwToC using commercial FPGA device with embedded processor. Experimental results showed that the proposed chip is possible for real application and could have faster verification time than traditional simulation method. Moreover, test could be done using low cost ATE.

• ETRI Journal
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• v.19 no.3
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• pp.228-241
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• 1997

In this paper, we present a design of modem and vocoder digital signal processor (DSP) chips for CDMA mobile station. The modem chip integrates CDMA reverse link modulator, CDMA forward link demodulator and Viterbi decoder. This chip contains 89,000 gates and 29 kbit RAMs, and the chip size is $10 mm{\times}10.1 mm$ which is fabricated using a $0.8{\mu}m$ 2 metal CMOs technology. To carry out the system-level simulation, models of the base station modulator, the fading channel, the automatic gain control loop, and the microcontroller were developed and interfaced with a gate-level description of the modem application specific integrated circuit (ASIC). The Modem chip is now successfully working in the real CDMA mobile station on its first fab-out. A new DSP architecture was designed to implement the Qualcomm code exited linear prediction (QCELP) vocoder algorithm in an efficient way. The 16 bit vocoder DSP chip has an architecture which supports direct and immediate addressing modes in one instruction cycle, combined with a RISC-type instruction set. This turns out to be effective for the implementation of vocoder algorithm in terms of performance and power consumption. The implementation of QCELP algorithm in our DSP requires only 28 million instruction per second (MIPS) of computation and 290 mW of power consumption. The DSP chip contains 32,000 gates, 32K ($2k{\times}16\;bit$) RAM, and 240k ($10k{\times}24\;bit$) ROM. The die size is $8.7\;mm{\times}8.3\;mm$ and chip is fabricated using $0.8\;{\mu}m$ CMOS technology.

• Biomolecules & Therapeutics
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• v.26 no.4
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• pp.380-388
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• 2018

Neural stem cells (NSCs) have the ability to self-renew and differentiate into multiple nervous system cell types. During embryonic development, the concentrations of soluble biological molecules have a critical role in controlling cell proliferation, migration, differentiation and apoptosis. In an effort to find optimal culture conditions for the generation of desired cell types in vitro, we used a microfluidic chip-generated growth factor gradient system. In the current study, NSCs in the microfluidic device remained healthy during the entire period of cell culture, and proliferated and differentiated in response to the concentration gradient of growth factors (epithermal growth factor and basic fibroblast growth factor). We also showed that overexpression of ASCL1 in NSCs increased neuronal differentiation depending on the concentration gradient of growth factors generated in the microfluidic gradient chip. The microfluidic system allowed us to study concentration-dependent effects of growth factors within a single device, while a traditional system requires multiple independent cultures using fixed growth factor concentrations. Our study suggests that the microfluidic gradient-generating chip is a powerful tool for determining the optimal culture conditions.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.7
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• pp.1418-1423
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• 2009

This paper describes the design and implementation of a System-on-a-Chip (SoC) for image processing applications to use in wearable/mobile products. The target Soc consists of LEON 2 core, AMBA/APB bus-systems and custom-designed controllers. A new FPGA-based prototyping platform is implemented and used for design and verification of the target SoC. To ensure that the implemented SoC satisfies the required performances, an image processing application is performed.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.7
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• pp.354-360
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• 2008

Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot mitigation schemes and thermal time constants, workload variations and microprocessor power distributions. By leveraging spatial and temporal heat slacks, our schemes enable lowering of on-chip unit temperatures by changing the workload in a timely manner with Operating System (OS) and existing hardware support.

• Journal of IKEEE
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• v.23 no.1
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• pp.295-301
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• 2019

A heater in a portable real-time polymerase chain reaction(PCR) system is one of the important factors for controlling the PCR thermocycle precisely. Since heaters are integrated on a small-sized PCR chip for rapid heating and fabricated by semiconductor processes, the cost of producing PCR chips is high. Here, we propose to use chip resistors as an inexpensive and accurate temperature control method. The temperature distribution was simulated using one or two chip resistors on a real-time PCR chip and the PCR chip with uniform temperature distribution was fabricated. The temperature rise and fall rates were $18^{\circ}C/s$ and $3^{\circ}C/s$, respectively.

• ETRI Journal
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• v.22 no.4
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• pp.13-24
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• 2000

As more transistors are integrated onto bigger die, an on-chip multiprocessor will become a promising alternative to the superscalar microprocessor that dominates today's microprocessor marketplace. This paper describes key parts of a new on-chip multiprocessor, called Raptor, which is composed of four 2-way superscalar processor cores and one graphic co-processor. To obtain performance characteristics of Raptor, a program-driven simulator and its programming environment were developed. The simulation results showed that Raptor can exploit thread level parallelism effectively and offer a promising architecture for future on-chip multi-processor designs.

• ETRI Journal
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• v.32 no.4
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• pp.540-547
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• 2010

One of the critical issues in on-chip serial communications is increased power consumption. In general, serial communications tend to dissipate more energy than parallel communications due to bit multiplexing. This paper proposes a low-power bus serialization method. This encodes bus signals prior to serialization so that they are converted into signals that do not greatly increase in transition frequency when serialized. It significantly reduces the frequency by making the best use of word-to-word and bit-by-bit correlations presented in original parallel signals. The method is applied to the revision of an MPEG-4 processor, and the simulation results show that the proposed method surpasses the existing one. In addition, it is cost-effective when implemented as a hardware circuit since its algorithm is very simple.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.10
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• pp.1559-1562
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• 2022

As electronic devices technology scales down into the deep-submicron to achieve high-density, low power and high performance integrated circuits, multiple bit upsets by soft errors have become a major threat to on-chip memory systems. To address the soft error problem, single error correction, double error detection and double adjacent error correction (SEC-DED-DAEC) codes have been recently proposed. But these codes do not troubleshoot mis-correction problem. We propose the SEC-DED_DAEC code with without mis-correction. The decoder for proposed code is implemented as hardware and verified. The results show that there is no mis-correction in the proposed codes and the decoder can be employed on-chip memory system.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.11
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• pp.1747-1750
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• 2022

As shrinking the semiconductor process into the deep sub-micron to achieve high-density, low power and high performance integrated circuits, MBU (multiple bit upset) by soft errors is one of the major challenge of on-chip memory systems. To address the MBU, single error correction, double error detection and double adjacent error correction (SEC-DED-DAEC) codes have been recently proposed. But these codes do not resolve mis-correction. We propose the SEC-DED-DAEC-TAED(triple adjacent error detection) code without mis-corrections. The generated H-matrix by the proposed heuristic algorithm to accomplish the proposed code is implemented as hardware and verified. The results show that there is no mis-correction in the proposed codes and the 2-stage pipelined decoder can be employed on-chip memory system.