• Transactions of Materials Processing
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• v.18 no.3
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• pp.210-216
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• 2009

Springback, an elastic material recovery after the unloading of stamping tools, causes variations and inconsistencies of final part dimensions. Recently, narrow and long surround molding parts around door frame are applied to high grade automobiles, but there are great difficulties in their die development, construction and tryout because of several springback modes including vertical movement and twist during flange forming process of them. So it is very important to predict springback's quantities of a surround molding part and, moreover, to compensate the die for them adequately, when they can't be corrected by the restrike operation. This paper presents a case study based on the die design for a surround molding part made of stainless steel. The forming and springback predictions, carried out using PAMSTAMP 2G, are reported and compared with the measurement data of the prototype. The predicted springback results were acceptable, so the processes of compensating die using Automatic Die Compensation Module of PAMSTAMP 2G were performed iteratively until the tolerances between the designed shape and the simulation data were satisfied.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.162-168
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• 2008

Recently surround molding parts using stainless steel are applied to international and domestic high grade vehicles, but there are great difficulties in die manufacture because of springback and twist after forming process. To solve this problem, finding the method of reduction springback is very important. In this study the springback which might happen during making a die that produce stainless steel surround molding parts is predicted and the geometry of die which satisfy the tolerance between product and panel after forming and springback will be suggested using automatic die compensation module.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.2 s.179
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• pp.138-145
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• 2006

An injection molding is necessary to mass-product for micro-nano system, so micro-nano mold must be developed for injection molding. The micro-nano mold has precision and strength to overcome a surround of injection. So in this paper, two methods were used. First, after etching the Al, Ni was electroplated in etched AI. The other, LIGA method was used. A temperature and thickness of Ni are important factors in these methods. So after fabrication, the simulation was processed to find optimal thickenss of Ni and temperature.