• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.135-135
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• 2012

세계 환경유해물질 규제에 대응하여 반도체 substrate의 Pb-free solution의 일환으로 등장한 PPF (Pre-Plated Frame)는 패키지공정 조립성은 물론, 자동차 반도체와 같은 고 신뢰성 및 low cost 요구를 만족하기 위해 초박막 고품질의 도금층과 Sub-micro scale의 rough treatment 와 같은 미세 표면제어 기술, 그리고 Au wire로부터 Cu wire 로의 전환에 대응하는 최적화된 도금층 구조로 발전하고 있다. 이러한 기술적인 진화를 거듭해온 이 기술은 다양한 반도체 substrate에 광범위하게 사용될 수 있기 때문에 향후 PPF기술의 활용저변은 더욱 확대될 전망이다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.91-94
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• 2002

The conditions of zone-melting method such as a sample travel speed in a furnace, content of Nd422, control of melting temperature, and heat-treatment with/without Ar gas for $NdBa_{2}Cu_{3}O_{7-\delta}$ superconductor was optimized, As a results, a $NdBa_{2}Cu_{3}O_{7-\delta}$ sample with a surface area of $25mm^{2}$ showed a good superconducting properties when its travel speed was 6 mm/h, The improvement of superconductivity added with 10~20 wt% of Nd422 phase increasing pinning effect was also shown. The critical current density, $J_{c}$ was remarkable affected by the condition of heat-treatment temperature of $NdBa_{2}Cu_{3}O_{7-\delta}$superconductor with/without Ar ambient gas.

• Korean Journal of Metals and Materials
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• v.49 no.8
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• pp.657-663
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• 2011

This study represents the results of the peel strength and surface morphology according to the preprocessing times of polyimide (PI) in a Cu/Ni/PI structure flexible copper clad laminate production process based on the polyimide. Field emission scanning electron microscopy, X-ray diffraction, and X-ray photoelectron spectroscopy were used to analyze the surface morphology, crystal structure, and interface binding structure of sputtered Ni, Cu, and electrodeposited copper foil layers. The surface roughness of Ni, Cu deposition layers and the crystal structure of electrodeposited Cu layers were varied according to the preprocessing times. In the RF plasma times that were varied by 100-600 seconds in a preprocessing process, the preprocessing applied by about 300-400 seconds showed a homogeneous surface morphology in the metal layers and that also represented high peel strength for the polyimide. Considering the effect of peel strength on plastic deformation, preprocessing times can reasonably be at about 400 seconds.

• New & Renewable Energy
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• v.17 no.4
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• pp.36-45
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• 2021

To remove the Cu secondary phase remaining on the surface of a CIGSSe absorber layer manufactured by the two-step process, KCN etching was applied before depositing the CdS buffer layer. In addition, it was possible to increase the conversion efficiency by air annealing after forming the CdS buffer layer. In this study, various pre-treatment/post-treatment conditions wereapplied to the S-containing CIGSSe absorber layerbefore and after formation of the CdS buffer layer to experimentally confirm whether similareffects as those of Se-terminated CIGSe were exhibited. Contrary to expectations, it was noted that CdS air annealing had negative effects.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1401-1403
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• 1998

The composition, weight decrease, DTA, and surface structure of vinyl insulated wire with thermal treatment conditions have been investigated. The composition of Cu by EDX analysis indicates Cu, Cl, and O lines, and oxidation reaction results from thermal treatment. Thermal treated IV and HIV appeared chemical reaction at $269^{\circ}C$ and $265^{\circ}C$, respectively. SEM of thermal treated Cu at $250^{\circ}C$ disappears an elongation structure, and appears an original structure.

• Biomedical Science Letters
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• v.14 no.2
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• pp.105-113
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• 2008

The objective of this study was to evaluate the influence of surface modifications on the bonding characteristics and cytotoxicity of specific titanium porcelain bonded to milling titanium and cast titanium. Milling titanium and cast titanium samples were divided into 8 test groups. These groups are as follow: i) sandblasted with particles of different size of $220{\mu}m\;and\;50{\mu}m$, ii) different sequences of sandblasting treatment and etching treatment, iii) etched with different etching solutions, and iv) preheated or not. The surface characteristics of specimens were characterized by the test of mean roughness of surface and SEM. The bond strength of titanium-ceramic systems was measured by using three-point bending test and SEM. The results show that the mean roughness of surface of sample sandblasted with $220{\mu}m$ aluminum oxide increased and bond strength were higher than sample sandblasted with $50{\mu}m$ aluminum oxide. The mean roughness of surface decreased, but the bond strength increased when the samples sandblasted with $220{\mu}m$ aluminum oxide were preheated. The sample sandblasted with $220{\mu}m$ aluminum oxide after oxidized with occupational corrosive agent I (50% NaOH, 10% $CuSO_4{\cdot}5H_2O$) and II (35% $HNO_3$, 5% HF) showed higher bond strength than sample oxidized with 30% $HNO_3$ after sandblasted with $220{\mu}m$ aluminum oxide. Group NaCuNF220SP (milling Ti: 35.3985 MPa, casting Ti: 37.2306 MPa) which was treated with occupational corrosive agent I (50% NaOH, 10% $CuSO_4{\cdot}5H_2O$) and II (35% $HNO_3$, 5% HF), followed by sandblasting with $220{\mu}m$ aluminum oxide and preheating at $750^{\circ}C$ for 1 hour showed the highest bond strength and significant differences (P<0.05). The method for modifying surface of titanium showed excellent stability of cells.

• Journal of Periodontal and Implant Science
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• v.52 no.1
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• pp.54-64
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• 2022

Purpose: This in vitro study was conducted to evaluate the effects of different debridement techniques and conditioning procedures on root surface morphology and blood clot stabilization. Methods: Two debridement techniques (curette [CU] vs. high-speed ultrasound [US]) and 2 conditioning procedures (ethylenediaminetetraacetic acid [EDTA] and phosphoric acid [PA]) were used for the study. Seven experimental groups were tested on root surfaces: 1) no treatment (C); 2) CU; 3) US; 4) CU+EDTA; 5) US+EDTA; 6) CU+PA; and 7) US+PA. Three specimens per group were observed under scanning electron microscopy (SEM) for surface characterization. Additional root slices received a blood drop, and clot formation was graded according to the blood element adhesion index by a single operator. Data were statistically analyzed, using a threshold of P<0.05 for statistical significance. Results: The C group displayed the most irregular surface among the tested groups with the complete absence of blood traces. The highest frequency of blood component adhesion was shown in the CU+EDTA group (P<0.05), while no differences were detected between the CU, US+EDTA, and CU+PA groups (P<0.05), which performed better than the US and US+PA groups (P<0.05). Conclusions: In this SEM analysis, EDTA and conventional manual scaling were the most efficient procedures for enhancing smear layer removal, collagen fiber exposure, and clot stabilization on the root surface. This technique is imperative in periodontal healing and regenerative procedures.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.51-57
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• 2019

To protect the Cu surface from oxidation in air, a two-step plasma process using Ar and $N_2$ gases was studied to form a copper nitride passivation as an anti-oxidant layer. The Ar plasma removes contaminants on the Cu surface and it activates the surface to facilitate the reaction of copper and nitrogen atoms in the next $N_2$ plasma process. This study investigated the effect of Ar plasma on the formation of copper nitride passivation on Cu surface during the two-step plasma process through the full factorial design of experiment (DOE) method. According to XPS analysis, when using low RF power and pressure in the Ar plasma process, the peak area of copper oxides decreased while the peak area of copper nitrides increased. The main effect of copper nitride formation in Ar plasma process was RF power, and there was little interaction between plasma process parameters.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.249-249
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• 2010

The effect of forming a passivation layer was investigated in superconformal Cu gap-filling of the nano-scale trench with atomic-layer deposited (ALD)-Ru glue layer. It was discovered that the nucleation and growth of Cu during metal-organic chemical vapor deposition (MOCVD) were affected by hydrogen plasma treatments. Specifically, as the plasma pretreatment time increased, Cu nucleation was suppressed proportionally. XPS and Thermal Desorption Spectroscopy indicated that hydrogen atoms passivate the Ru surface, which leads to suppression of Cu nucleation owing to prevention of adsorption of Cu precursor molecules. For gap-fill property, sub 60-nm ALD Ru trenches without the plasma pretreatment was blocked by overgrown Cu after the Cu deposition. With the plasma pretreatment, superconformal gap filling of the nano-scale trenches was achieved due to the suppression of Cu nucleation near the entrances of the trenches. Even the plasma pretreatment with bottom bias leads to the superconformal gap-filling.

• Journal of Environmental Science International
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• v.8 no.3
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• pp.411-417
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• 1999

The interfacial chemical behavior, lattice exchange and dissolution, of $FeS_{(S)}$ as one of the important sulfide minerals was studied. Emphases were made on the surface characterization of hydrous $FeS_{(S)}$, the lattice exchange of Cu(II) and $FeS_{(S)}$, and its effect on the dissolution of $FeS_{(S)}$, and also affect some organic ligands on that of both Cu(II) and $FeS_{(S)}$. Cu(II) which has lower sulfide solubility in water than $FeS_{(S)}$ undergoes the lattice exchange reaction when Cu(II) ion contacts $FeS_{(S)}$ in the aqueous phase. For heavy metals which have higher sulfide solubilities in water than $FeS_{(S)}$, these metal ions were adsorbed on the surface of $FeS_{(S)}$. Such a reaction was interpreted by the solid solution formation theory. Phthalic acid(a weak chelate agent) and EDTA(a strong chelate agent) were used to demonstrate the effect of organic lignads on the lattice exchange reaction between Cu(II) and $FeS_{(S)}$. The $pH_{zpc}$ of $FeS_{(S)}$ is 7 and the effect of ionic strength is not showed. It can be expected that phthalic acid has little effect on the lattice exchange reaction between Cu(II) and $FeS_{(S)}$. whereas EDTA has very decreased the removal of Cu(II) and $FeS_{(S)}$. This study shows that stability of sulfide sediments was predicted by its solubility. The pH control of the alkaline-neutralization process to treat heavy metal in wastewater treatment process did not needed. Thereby, it was regarded as an optimal process which could apply to examine a long term stability of marshland closely in the treatment of heavy metal in wastewater released from a disussed mine.