• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2001.07a
• /
• pp.119-126
• /
• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.31 no.7 s.262
• /
• pp.732-738
• /
• 2007

Effects of melt-mixing conditions on fracture properties of hydroxyapatite filled bioabsorbable poly(L-lactic acid)(HA/PLLA) composites was investigated by measuring the firacture toughness value of HA/PLLA composites prepared under different mixing time and rotor speed. The fracture surface morphology was also examined by profile measurement and scanning electron microscopies. It was found that the fracture toughness of HA/PLLA composites decreases due to decrease of ductile deformation of PLLA matrix and debonding of interfaces with increase of the rotor speed and mixing time. Effect of mixing process on neat PLLA was also assessed, and it was found that the fracture toughness of PLLA decreases due to disappearance of multiple craze formation and increase of defects. Such thermal and shear-stress degradation were found to be the primary mechanisms of the degradation of HA/PLLA composites during melt-mixing process.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.26 no.5
• /
• pp.716-723
• /
• 2002

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

• Journal of Mechanical Science and Technology
• /
• v.16 no.5
• /
• pp.633-638
• /
• 2002

An approach to enhance dimensional accuracy of the grinding process has been presented, and grinding of a glass material with a metal-bonded diamond wheel has been studied. In this study, a grinding tool is suspended flexibly and controlled by an electromagnetic actuator. During grinding, profile error of a ground surface is indirectly measured and fed back to a control system. A model of grinding error has been suggested on which the indirect measurement has been based. An optimal PID control is adopted and effectiveness of the in-process feedback control has been verified experimentally.

• Proceedings of the KSME Conference
• /
• 2001.11b
• /
• pp.96-101
• /
• 2001

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

• Journal of the Korean Society for Precision Engineering
• /
• v.17 no.5
• /
• pp.124-130
• /
• 2000

For measuring out the submicron order straightness, a precision measuring device is developed in this paper. The device is constructed with a hydrostatic feed table and a capacitive type sensor which is mounted to the feed table. Straightness is acquired as substracting the motion error of feed table from the measured profile with probe. Motion error of feed table is simultaneously compensated upto 0.120${\mu}{\textrm}{m}$ of linear motion error and 0.20arcsec of angular motion error using the active controlled capillary. Reversal method and strai호t-edge is used fur estimating the measuring accuracy and from the experimental result, it is verified that the device has the measuring accuracy 0.030m. Also, through the practical application on the measurement of ground surface, it is confirmed that the device is very effective to measure the submicron order straightness.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1995.04b
• /
• pp.408-413
• /
• 1995

Nowadays, manufacturing system is trending toward integrated circumstance by helping of CAD/CAM/CAT. To use this system effectively, it is necessary to get exact 3 dimensional surface data of an object. We have been using contact method to measure 3 dimensional object profile. But his method has demerit of leaving scrach or small distortion on the object. To improve this, a non-contact measuring method using optical system is adopted. In this paper, We propose optical ring method. Withthis system, We could measure displacement of the object in the range of 45mm having 150mm having 150 .mu. m resolution with no scratch or distortion.

• The KSFM Journal of Fluid Machinery
• /
• v.7 no.6 s.27
• /
• pp.7-14
• /
• 2004

A new electrostatic rotary atomizing painting equipment using air turbine was developed for high transfer efficiency. Based on the overall design requirements of painting equipment, basic design specifications of the equipment parts such as air turbine and atomizing disk ate defined from the present conceptual design model. Air turbine is designed with the section profile of NACA airfoil, and its internal flow field is analyzed by commercial CFD code. Atomizing disk is designed to achieve the ligament type spray of paint with the use of visualization technique. Various experiments and tests are conducted to investigate the spray and the transfer characteristics of newly-designed painting equipment, and the measurement results are compared with the those of conventional painting equipments. The comparison results show the present painting equipment is superior to the conventional ones in the aspects of transfer efficiency and coating surface characteristics.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
• /
• 2005.11a
• /
• pp.111-114
• /
• 2005

This paper presents a comparison of experimental value by hemispherical grounding simulation system and calculated value by CDEGS program for ground potential rise of structure. When a test current flowed through structure grounding electrodes, ground potential rise was measured and analyzed for types of structure using the hemispherical grounding simulation system in real time, and was computed by means of CDEGS program. The model structures were designed and fabricated with two types on a scale of one-one hundred sixty. When the experimental data were compared with the theoretical values, the similar profile was shown. Therefore, the confidence of measurement was obtained. The distributions of ground surface potential are dependent on the resistivity and absorption percentage in concrete attached to structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1992.05a
• /
• pp.86-90
• /
• 1992

We have studied the characteristics of n-and p-channel FETs with submicron channel length fabricated by twin-well process. Threshold voltage variation and potential distribution with channel ion implantation conditions and impurity profile of n-and p-channel region wee simulated using SUPREM-II and MINIMOS 4.0 simulater, P-channel FET had buried-channel in the depth of 0.15 $\mu\textrm{m}$ from surface by counter-doped boron ion implantation for threshold voltage adjustment. As a result of device measurement, we have obtained good drain saturation characteristics for 3.3 [V] opreation, minimized short channel effect with threshold voltage shift below 0.2[V], high punchthrough and breakdown voltage above 10[V] and low subthreshold value.