• Transactions on Electrical and Electronic Materials
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• v.1 no.3
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• pp.23-28
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• 2000

A block-oxide layer was formed on the surface of Cu-based leadframe by chamical oxidation method in order to enhance the adhesion strength between Cu-based leadframe and epoxy molding compound (EMC) Using sandwiched double cantilever beam (SDCB) specimens, the adesion strength was measured in terms of interfacial fracture toughness, G$\sub$IC//Results showed that the black-oxide layer was composed of two kinds of layers: pebble-like Cu$_2$O layer and acicular CuO layer, At the initial stage of oxidation the Cu$_2$O layer was preferentially formed and thickened up to around 200 nm whithin 1 minute of the oxidation time. Then the CuO layer started to from atop of the Cu$_2$O layer and thickened up to around 1300 nm until 20 minutes. As soon as the CuO layer formed, the thickness of Cu$_2$O layer began to reduce and finally reached to around 150 nm. The pre-cleaned and the Cu$_2$O coated leadframes showed almost no adhesion of EMC, however, as the CuO precipitates appeared and became continuous, G$\sub$IC/ increased up to around 80 J/㎡. Further oxidation raised G$\sub$IC/ up. to around 100 J/㎡.

• Journal of the Korean institute of surface engineering
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• v.53 no.4
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• pp.144-152
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• 2020

In the manufacturing process of joining of aluminum alloy and polymer, the strength of the metal-polymer joining is greatly influenced by the nanostructure of the oxide film. In this study, we investigated the dependence of joining strength on the thickness, structure, pore formation and surface roughness of the formed film. After the two-step anodization process, the surface oxide layer became thinner and rougher resulting in higher joining strength with the polymer. More specifically, after the two-step anodization, the surface roughness, Ra increased from 2.3 to 3.2 ㎛ with pore of three-dimensional (3D) nanostructure, and the thickness of the oxide film was thinned from 350 to 250 nm. Accordingly, the joining strength of the aluminum alloy with polymer increased from 23 to 30 MPa.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2005.11a
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• pp.126-126
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• 2005

• Transactions on Electrical and Electronic Materials
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• v.16 no.1
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• pp.20-24
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• 2015

We studied the relationship between the surface smoothness of the internal Cu ribbon and the morphology of the Sn-Pb plating layer for solar cell modules. A bumpy surface was observed on the surface of the solar ribbon, which caused irregular reflection of light. Large, Pb-rich, primary ${\alpha}$-phases were found below the convex surface of the solar ribbon, passing from the surface of the internal Cu ribbon to the surface of the plating layer. The primary ${\alpha}$-phases heterogeneously nucleated on the convex surface of the Cu ribbon, and then largely grew to the convex surface of the plating layer. The restriction of the primary ${\alpha}$-phase's formation was enabled by enhancing the smoothness of the Cu ribbon's surface; it was also possible to increase the adhesive strength and decrease contact resistance. We confirmed that the solar ribbon's surface smoothness depends on the internal Cu ribbon's surface smoothness.

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.709-716
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• 1999

Ceramic is select for an alternative substrate material for high-speed circuits due to its low-thermal expansion. As, in this study, ceramic was prepared by ISG (interlayer sol-gel) process using metal salts and a metal alkoxide as the starting materials. Generally ceramic substrate is used electroless copper plating for the metallization. But it has been indicate weakely the adhesion strength between the substrate and copper layer. Therefore, this research, using the ISG process on the preparation of homogeneous and possible preparation at law temperature fabricated sol solution. Using of the dip coating method was coated for the purpose of giving the anchoring effect on the coating layer and enhancing the adhesion strength between the $Al_2$O$_3$ substrate and copper layer. This study examined primary the characteristic of the sol making condition and differential thermal analysis (DTA) X-ray diffraction (XRD) were mearsured to identify the crystal phase of heat treatment specimens. The morphology of the coated films were studied by scanning electron microscopy(SEM). As a resurt, XRD analysis was obtained patterns of $\alpha$-cordierite after heat-treatment about 2 hours at $1000^{\circ}C$. SEM analysis could have seen a large number of voids on coated film. The more contants of$ Al_2$$O_3$ Wt% was increased the more voids was advanced. Peel adhesion strength has a maximum in the contants of the TEOS:ANE of 1:0.7 mole%. In this case, adhesion strength has been measured 1150gf, peel adhesion strength were about 10 times more than uncoated of the ceramics film.

• Transactions on Electrical and Electronic Materials
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• v.7 no.1
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• pp.16-20
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• 2006

In this paper, we investigated the effects of short-term oxygen plasma treatment of semiconducting silicone layer to improve interfacial performances in joints prepared with a insulating silicone materials. Surface characterizations were assessed using contact angle measurement and x-ray photoelectron spectroscopy (XPS), and then adhesion level and electrical performance were evaluated through T-peel tests and electrical breakdown voltage tests of treated semi-conductive and insulating joints. Plasma exposure mainly increased the polar component of surface energy from $0.21\;dyne/cm^2$ to $47\;dyne/cm^2$ with increasing plasma treatment time and then leveled off. Based on XPS analysis, the surface modification can be mainly ascribed to the creation of chemically active functional groups such as C-O, C=O and COH on semi-conductive silicone surface. This oxidized rubber layer is inorganic silica-like structure of Si bound with three to four oxygen atoms ($SiO_x,\;x=3{\sim}4$). The oxygen plasma treatment produces an increase in joint strength that is maximum for 10 min treatment. However, due to brittle property of this oxidized layer, the highly oxidized layer from too much extended treatment could be act as a weak point, decreasing the adhesion strength. In addition, electrical breakdown level of joints with adequate plasma treatment was increased by about $10\;\%$ with model samples of joints prepared with a semi-conducting/ insulating silicone polymer after applied to interface.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.2
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• pp.196-205
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• 2004

The cutting characteristics and the deformed layer of nitrogen(N)-added type 316LN stainless steel were comparatively investigated to type 316L stainless steel. The cutting force, the surface roughness(Ra) and the tool wear in face milling works were measured with cutting conditions, and the deformed layers were obtained from micro-hardness testing method. The cutting resistance of type 316LN was similar to type 316L in spite of its high strength. The surface roughness of type 316LN was superior to type 316L for all the cutting conditions. In particular, in the high cutting speed above 345m/min, the surface roughness of the two stainless steels was closely same. The deformed layer thickness of the two stainless steels was generated in the 150$\mu\textrm{m}$-300$\mu\textrm{m}$ ranges, and its value of type 316LN was lower than that of type 316L. This is due to the high strength properties by nitrogen effect. It was found that type 316LN was higher in the tool wear than that type 316L, and flank wear was dominant to crater wear. In face milling works of type 316LN steel, tool wear is regarded as a important problem.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.5
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• pp.262-269
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• 2022

In order to process materials such as engineering plastics, which are difficult to mold due to their high strength compared to conventional polymer materials, it is necessary to improve the hardness and strength of parts such as screws and barrels of injection equipment in extrusion system. High-velocity oxygen fuel (HVOF) process is well known for its contribution on enhancement of surface properties. Thus in this study, using the HVOF process, WC coating layers of different thicknesses were bonded to the surface of S30C substrate by controlling the movement speed of the spray nozzle and each property was evaluated to decide the optimization condition. Through the results, the thickness of WC coating layer increased from 0 to 200 ㎛ maximum, along with the decrement of nozzle movement speed and the surface hardness get increased. Especially, the coated layer with the thickness over 180 ㎛ under the nozzle speed 500 mm/s had high hardness than thinner layer. In addition, the amount of wear consumed per unit time was also significantly reduced due to the formation of the coating layer.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.940-941
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• 2009

The adsorption strength of liquid crystal molecules on the polymer surface was compared measuring temperature dependence of retardation above Nematic-Isotoropic transition temperature ($T_{NI}$). The relationship between surface order parameter and adsorption strength on the polymer surface was discussed.

• Journal of Welding and Joining
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• v.12 no.3
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• pp.48-55
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• 1994

In this experiment, to find optimum brazing conditions for Cu/Stainless Steel brazing using filler metals of Ag-Cu-Zn-Cd system, first of all spreading ratio was tested on 304 stainless Steel and low carbon steel. And then shear test of brazed joint was executed. As the result of that, the shear strengths of brazed joints were the range of 60-90 MPa. Through microstructure analysis for brazed interface layer, We found as follows. Firstly interface layer increased as time increased. Secondly continuous layer of Ag-Cd compound was observed along the side of stainless steel. Also by means of EDS analysis for fracture surface, ductile fracture was occurred and precipitates on the fracture surface were found to include Cr, Mn, Si in Ag-rich phase.