Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)
- 2005.11a
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- Pages.126-126
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- 2005
Adhesion Strength of Sputter Type 2 Layer Flexible Copper Clad Laminate with Electroplating Conditions and Preferred Orientation of Plated Cu Layer
Sputtering 방식 2층 FCCL(Flexible Copper Clad Laminate)의 동도금 조건 및 동도금층 우선 방위에 따른 접착 강도
- Published : 2005.11.04
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