• 제목/요약/키워드: Surface and Internal Defects

검색결과 120건 처리시간 0.027초

함정용 배전반 용접부의 용접후처리 방법에 의한 피로강도 증대 효과에 관한 연구 (A Study on Improvement of Fatigue Strength of Electrical Panel Weldments in Naval Vessels by Post Weld Treatment)

  • 김명현;강민수;강성원
    • Journal of Welding and Joining
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    • 제26권4호
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    • pp.55-60
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    • 2008
  • Structural reliability of electrical panels installed in naval vessels is of critical importance from structural performance viewpoint. The panels may be exposed to vibration and fatigue loadings from internal and external sources and wave loading which cause fatigue cracking. In this study, common methods such as burr grinding and post weld heat treatment (PWHT), for the fatigue strength improvement of weldments are investigated. Burr grinding is carried out using a electric grinder in order to remove surface defects and improve the weld bead profile. And also PWHT is carried out for the purpose of removing residual. The effectiveness of the two post treatment methods is evaluated in terms of fatigue strength improvement of welded structures.

구조물의 안전진단을 위한 충격파의 주파수 영역 탐사에 관한 연구 (A Study of Frequency Domain Analysis of Impact-wave for Detecting of Structural Defects in the Concrete Structure)

  • 김형준;이상철;서백수
    • 산업기술연구
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    • 제25권B호
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    • pp.115-120
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    • 2005
  • Impact seismic wave method is a method for non-destructive testing of concrete structure using of stress wave which is propagate and reflected from internal flaws within concrete structure and external surface. In this study, we performed frequency domain method using impact seismic wave test for safety diagnosis of civil engineering structure. And reflection method which is used for one-dimensional target such as tunnel lining and transmission method are compared with each other.

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냉각주형식 연속주조장치에 의한 일방향응고 Cu 선재의 제조 (Unidirectionally Solidified Cu Rod Fabrication Using Continuous Casting Apparatus with Cooled Mold)

  • 조훈;조인성
    • 한국주조공학회지
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    • 제29권5호
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    • pp.198-203
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    • 2009
  • In order to manufacture copper ultra fine wire used for bonding wire in integrated circuit package, continuous casting process, which can produce high purity copper rod with small cross section, and wiredrawing process have to be optimized to prevent wire brakeage during entire manufacturing process of fine wire. The optimum condition for producing copper rod with mirror surface has to established by investigation of the effects of several parameters such as withdrawal speed, superheat and rod diameter on grain morphology of the cast rod and on its drawing characteristics to fine wire. The purpose of this study is to propose the optimized process parameters in continuous casting process in order to produce cast rod without internal defects, and to predict microstructure orientation suitable for wire drawing process.

DC magnetron Sputtering 법으로 제작한 Ti$_{x}$N 박막의 밀착력에 미치는 코팅조건의 영향 (Effects of coating Condition on Adhesive strength Ti$_{x}$N Films Prepared by the DC Magetron Sputtering Method)

  • 김학동;조성석
    • 한국표면공학회지
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    • 제31권1호
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    • pp.34-44
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    • 1998
  • Stainless steel is being used widely lor various purposes due to its good corrosion resistance. There has becn much research to produce colored stainless sterl by several methods. In this experiment, we coated TixN film on the SUS304 substrate with thc DC magnetron sputtering system and studied the internal structurc and adhesive strength of the films as a function of the coating conditions. Before lhe specimen was coated, a sputter etching was very effective in removing the$\delta$ Fe(BCC) phase as well as the contaminant and oxide layer as well as increasing rotghness. Five-stage failure mode appeared with increased scratch load with the TIN films coated on the SUS304 in this manner ; tensile failure-,conformal failure-,buckling failure->chipping failurc and spalling Failure. When the failure was terminated at the initial stage, the film will have good adhesion. But, if syalling failure has occurred at the initial scratch, then the adhesion will be poor. The interlayer between thc coated film and thc substratc was homogeneously adhcsive when the $\gamma'-Fe_4N$ phase wasn't detected in the XRD analysis and the adhesive strength only was reduced by surPace defects. But, when the ,$\gamma'-Fe_4N$N phasc was detected in the XRD analysis, the adhesive strength was very poor.

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Deformation Analysis of Impact Damaged Composite Tube Using Thermal Shearography

  • Kim, Koung-Suk;Chang, Ho-Seob;Jang, Su-Ok;Lee, Seung-Seok;Jang, Wan-Sik;Jung, Hyun-Chul
    • 비파괴검사학회지
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    • 제28권3호
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    • pp.302-308
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    • 2008
  • Composite materials are widely used as structural materials for aerospace engineering because of its excellent mechanical properties such as light weight, high stiffness, and low thermal expansion. In driving, impact damage is one of the common but dangerous damages, caused by internal failure of the laminas interface which is not detected by in the surface. Many techniques to detect defects or delaminate between laminates have been reported. Shearography is a kind of laser speckle pattern interferometry with the advantages of non-destructive, non-contact, high resolution and displacement slope measurement. In this paper, the shearography is used to evaluate non-destructively impact damaged surface of the composite material and a measuring method using shearography for the thermal deformation of a impact damaged composite material is discussed. The basic principles of the technique are also described briefly.

가공조건에 따른 강판의 구멍확장성 평가 (Evaluation of Role Flangeability of Steel Sheet with respect to the Role Processing Condition)

  • 이종섭;고윤기;허훈;김홍기;박성호
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2006년도 춘계학술대회 논문집
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    • pp.359-362
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    • 2006
  • In this paper, hole expanding tests are carried out in order to identify the effect of the hole process condition on the hole expanding ratio. Specimens with two different hole conditions are prepared: one is produced with punching process; and the other is reamed after punching to get smoother hole surface. The experimental results show that the facture mechanism and the hole expanding ratio are quite different with respect to the hole condition. The hole expanding ratio of a punched specimen is much smaller than that of a reamed one due to the difference of surface roughness and internal defects. For the thorough investigation of those effects, tensile tests of a specimen with a hole are performed. The fracture strain is obtained with different hole conditions and a finite element analysis of the hole flanging process carried out. The experimental results are confirmed and reevaluated by finite element analysis of the hole flanging process with ductile fracture criterion proposed.

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비선형 파괴역학 해석을 위한 새로운 기법: 개선된 참조 응력법 (New Engineering Method for Non-Linear Fracture Mechanics Analysis Enhanced Reference Stress Method)

  • 김윤재;김영진
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집A
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    • pp.17-25
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    • 2001
  • This paper briefly describes the new engineering method, called the enhanced reference stress method, to estimate J (or $C^*$) for non-linear fracture mechanics analysis of defective components, recently proposed by authors. The proposed method offers significant advantages over existing methods in terms of its accuracy, simplicity and robustness. Examples of application of the proposed method to typical piping integrity problems such as through-wall cracked pipes under combined loading, and surface cracked pipes under internal pressure and bending are given. Excellent agreements between the FE J and $C^*$ results and those of the proposed method provide sufficient confidence in the use of the proposed method. One notable point is that the proposed method can be used to estimate J (or $C^*$) along the crack front of surface cracks. Moreover simplicity of the proposed method makes it easy to extend to more complex problems. Thus the proposed method is attractive to assess the significance of defects under practical situations.

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형광지를 이용한 물품검사 X-선 DR 영상처리 시스템 개발 (The development of product inspection X-ray DR image processing system using intensifying screen)

  • 박문규;문하정;이동훈
    • 한국정보통신학회논문지
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    • 제19권7호
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    • pp.1737-1742
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    • 2015
  • 물품 검사를 위한 산업현장에서는 물품의 표면뿐만 아니라 내부 부품결함 검사 또한 필요하다. 일반적으로 생산 공정에서의 물품 검사로 광학 검사를 많이 이용한다. 하지만 이는 표면상의 결함만을 검사할 뿐 물품 내부의 검사를 수행하기는 어렵다. 이러한 제한점을 극복하기 위해 광학 장치 대신 휴대용 X-선 DR 영상 획득 장치를 이용하여 영상을 실시간으로 얻는 동시에 제품 불량을 판별할 수 있는 시스템을 개발하였다. X-선 영상을 얻은 후 머신영상 처리를 통해 설정한 기준 값에 오차범위를 허용하면 통과, 그렇지 않으면 불량으로 인식되도록 시스템을 개발하였다. 또한, 물품의 불량 유무 결과와 그 수치는 사용자가 저장할 수 있도록 하였다.

HFCVD 증착 온도 변화에 따른 단결정 다이아몬드 표면 형상 및 성장률 변화 (A Study on the Growth Rate and Surface Shape of Single Crystalline Diamond According to HFCVD Deposition Temperature)

  • 권진욱;김민수;장태환;배문기;김성우;김태규
    • 열처리공학회지
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    • 제34권5호
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    • pp.239-244
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    • 2021
  • Following Silicon Carbide, single crystal diamond continues to attract attention as a next-generation semiconductor substrate material. In addition to excellent physical properties, large area and productivity are very important for semiconductor substrate materials. Research on the increase in area and productivity of single crystal diamonds has been carried out using various devices such as HPHT (High Pressure High Temperature) and MPECVD (Microwave Plasma Enhanced Chemical Vapor Deposition). We hit the limits of growth rate and internal defects. However, HFCVD (Hot Filament Chemical Vapor Deposition) can be replaced due to the previous problem. In this study, HFCVD confirmed the distance between the substrate and the filament, the accompanying growth rate, the surface shape, and the Raman shift of the substrate after vapor deposition according to the vapor deposition temperature change. As a result, it was confirmed that the difference in the growth rate of the single crystal substrate due to the change in the vapor deposition temperature was gained up to 5 times, and that as the vapor deposition temperature increased, a large amount of polycrystalline diamond tended to be generated on the surface.

사파이어 기판 방향성에 따른 GaN 박막의 미세구조 (Microstructure of GaN films on sapphire surfaces with various orientations)

  • 김유택
    • 한국결정성장학회지
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    • 제9권2호
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    • pp.162-167
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    • 1999
  • 3가지 방향성을 가진 사파이어 기판 위에 GaN 박막을 OMVPE방식으로 증착시켜 증착된 GaN epilayer를 투과전자현미경으로 분석하여 각 미세구조의 차이를 비교분석하였다. 3 가지 방향 모두에서 GaN 증착층이 관찰되어졌으며 그중 가장 좋은 경계면의 상태와 단일결정성을 보여준 것은 사파이어{0001} 방향의 기판을 사용한 경우였다. 결함들도 {0001} 방향의 기판을 사용한 경우에서 가장 적게 나타났다. 모든 경우에서 buffer layer는 발견되어지지 않았고 그럼에도 불구하고 경계면에서의 격자 뒤틀림이 일어나는 지역이 수 나노미터(nanometer) 정도밖에 안되는 우수한 경계면들이 관찰되었다. 따라서 일반적으로 GaN 박막 증착시에 가장 많이 사용되는 사파이어 basal plane 외에도 결함이 많기는 하지만, {1120}와 {1102} plane 위에도 GaN 증착층이 buffer layer 없이 증착 될 수 있다는 사실을 TEM 관찰을 통하여 알 수 있었으며 사파이어 {0001}면를 기판으로 사용한 경우에 미세구조 측면에서 볼 때 hetero-epitaxial한 GaN 박막층을 얻을 수 있는 것을 확인하였다.

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