• Current Applied Physics
• /
• 제18권11호
• /
• pp.1255-1260
• /
• 2018

In this work, a green and simple one-pot route was developed for the synthesis of highly fluorescent aminofunctionalized graphene quantum dots (a-GQDs) via hydrothermal process without any further modification or surface passivation. We synthesized the a-GQDs using glucose as the carbon source and ammonium as a functionalizing agent without the use of a strong acid, oxidant, or other toxic chemical reagent. The as-obtained aGQDs have a uniform size of 3-4 nm, high contents of amino groups, and show a bright green emission with high quantum yield of 32.8%. Furthermore, the a-GQDs show effective fluorescence quenching for $Cu^{2+}$ ions which can serve as effective fluorescent probe for the detection of $Cu^{2+}$. The fluorescent probe using the obtained aGQDs exhibits high sensitivity and selectivity toward $Cu^{2+}$ with the limit of detection as low as 5.6 nM. The mechanism of the $Cu^{2+}$ induced fluorescence quenching of a-GQDs can be attributed to the electron transfer by the formation of metal complex between $Cu^{2+}$ and the amino groups on the surface of a-GQDs. These results suggest great potential for the simple and green synthesis of functionalized GQDs and a practical sensing platform for $Cu^{2+}$ detection in environmental and biological applications.

• 한국수소및신에너지학회논문집
• /
• 제32권6호
• /
• pp.656-662
• /
• 2021

For the high efficiencies of quantum dot-sensitized solar cells (QDSCs), it is important to control the severe electron recombination at the interface of photoanode/electrolyte. In this work, we optimize the surface passivation process of ZnS/SiO₂ double overlayers for the enhanced photovoltaic performances of QDSCs. The overlayers of zinc sulfide (ZnS) and SiO₂ are coated on the surface of QD-sensitized photoanode by successive ionic layer adsorption and reaction (SILAR) method, and sol-gel reaction, respectively. In particular, for the sol-gel reaction of SiO₂, the influences of temperature of precursor solution are investigated. By application of SiO₂ overlayers on the ZnS-coated photoanode, the conversion efficiency of QDSCs is increased from 5.04% to 7.35%. The impedance analysis reveals that the electron recombination at the interface of photoanode/electrolyte is obviously reduced by the SiO₂ overlayers.

• Corrosion Science and Technology
• /
• 제21권6호
• /
• pp.454-465
• /
• 2022

The objective of this study was to determine effects of temperatures and pH of sodium chloride solution with MgCl₂ ions on corrosion resistance of duplex stainless-steel X2CrNiMoN22-5-3 (DSS) and Ti 6Al 2Nb1Ta1Mo (Ti). Effects of sodium chloride concentration on corrosion resistance were also studied. Corrosion behavior and pitting morphology of duplex stainless steel (DSS) and Ti alloys were evaluated through potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), and scanning electron microscopy (SEM). It was found that a decrease in pH significantly reduced the corrosion resistance of both alloys. Changes in chloride concentration and temperature had more substantial impact on corrosion behavior of DSS than on Ti alloys. Pitting corrosion was formed on DSS samples under all conditions, whereas crevice corrosion was developed on Ti samples with the presence of magnesium chloride at 90 ℃. In conclusion, magnesium chloride ions in an exceedingly strong acidity solution appear to interact with re-passivation process at the surface of these alloys and influence the resulting surface topography.

• 센서학회지
• /
• 제32권6호
• /
• pp.425-431
• /
• 2023

An asymmetric metal-semiconductor-metal Al_0.24Ga_0.76N ultraviolet (UV) sensor was fabricated, and the effects of local Joule heating were investigated. After dielectric breakdown, the current density under a reverse bias of 2.0 V was 1.1×10^-9 A/cm², significantly lower than 1.2×10^-8 A/cm² before dielectric breakdown; moreover, the Schottky behavior of the Ti/Al/Ni/Au electrode changed to ohmic behavior under forward bias. The UV-to-visible rejection ratio (UVRR) under a reverse bias of 7.0 V before dielectric breakdown was 87; however, this UVRR significantly increased to 578, in addition to providing highly reliable responsivity. Transmission electron microscopy revealed interdiffusion between adjacent layers, with nitrogen vacancies possibly formed owing to local Joule heating at the AlGaN/Ti/Al/Ni/Au interfaces. X-ray photoelectron microscopy results revealed decreases in the peak intensities of the O 1s binding energies associated with the Ga-O bond and OH-, which act as electron-trapping states on the AlGaN surface. The reduction in dark current owing to the proposed local heating method is expected to increase the sensing performance of UV optoelectronic integrated devices, such as active-pixel UV image sensors.

• 한국산업융합학회 논문집
• /
• 제7권3호
• /
• pp.259-263
• /
• 2004

In the manufacture progress of LCD or semiconductor, there are used many kinds of gas like erosion gas, dilution gas, toxic gas as a progress which used these gas there are required high puritize to increase accumulation rate of semiconductor or LCD materials work progress of semiconductor or LCD it demand many things like the material which could minimize metallic dust that could be occured by reaction between gas and transfer pipe laying material, illumination of the surface, emition of the gas, metal liquation, welding etc also demand quality geting stricted. Material-Low-sulfur-contend (0.007-0010), vacuum-arc-remelt(VAR), seamless, high-purity tubing material is recommend for enhance welding lower surface defect density All wetted stainless steel surface must be 316LSS elecrto polishinged with ${\leq}0.254{\mu}m$($10.0{\mu}in$) Ra average surface finish, $Cr/Fe{\geq}1.1$ and $Cr_2O_3$ thickness ${\geq}25{\AA}$ From the AES analytical the oxide layer thickness (23.5~36 angstroms silicon dioxide equivalent) and chromum to iron ratios is similar to those generally found on electropolished stainless steel., molybdenum and silicon contaminants ; elements characteristic of stainless steel (iron, nickel and chromium); and oxygen were found on the surface Phosphorus and nitrogen are common contaminants from the electropolish and passivation steps.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
• /
• pp.105-105
• /
• 2012

We have developed a photoemission-assisted plasma-enhanced chemical vapor deposition (PAPE-CVD) [1,2], in which photoelectrons emitting from the substrate surface irradiated with UV light ($h{\nu}$=7.2 eV) from a Xe excimer lamp are utilized as a trigger for generating DC discharge plasma as depicted in Fig. 1. As a result, photoemission-assisted plasma can appear just above the substrate surface with a limited interval between the substrate and the electrode (~10 mm), enabling us to suppress effectively the unintended deposition of soot on the chamber walls, to increase the deposition rate, and to decrease drastically the electric power consumption. In case of the deposition of DLC gate insulator films for the top-gate graphene channel FET, plasma discharge power is reduced down to as low as 0.01W, giving rise to decrease significantly the plasma-induced damage on the graphene channel [3]. In addition, DLC thickness can be precisely controlled in an atomic scale and dielectric constant is also changed from low ${\kappa}$ for the passivation layer to high ${\kappa}$ for the gate insulator. On the other hand, negative electron affinity (NEA) of a hydrogen-terminated diamond surface is attractive and of practical importance for PAPECVD, because the diamond surface under PAPE-CVD with H2-diluted (about 1%) CH4 gas is exposed to a lot of hydrogen radicals and therefore can perform as a high-efficiency electron emitter due to NEA. In fact, we observed a large change of discharge current between with and without hydrogen termination. It is noted that photoelectrons are emitted from the SiO2 (350 nm)/Si interface with 7.2-eV UV light, making it possible to grow few-layer graphene on the thick SiO2 surface with no transition layer of amorphous carbon by means of PAPE-CVD without any metal catalyst.

• 전자공학회논문지
• /
• 제51권2호
• /
• pp.33-37
• /
• 2014

본 논문에서는 AlGaN/GaN HFET의 누설전류 특성을 개선하고자 산화갈륨 희생층 공정을 이용한 새로운 패시베이션 공정을 제안하였다. 오믹 전극 형성시 고온 열처리 과정으로 인해 갈륨의 표면 손상이 불가피하다. 표면 손상을 방지하기 위해 보편적으로 선표면처리 공정을 사용하기도 하지만 이러한 방법만으로는 표면 손상을 완전히 없애기 어렵다. 본 연구에서 새롭게 제안된 산화갈륨 희생층을 이용한 공정 방법은 고온 열처리 후 손상된 표면에 $O_2$ 플라즈마 처리를 통해 산화갈륨층을 형성한 뒤, 염화수소를 이용하여 산화갈륨층을 식각한다. 우수한 상태의 표면 상태를 얻을 수 있었으며, 누설전류의 확연한 감소로 subthreshold slope이 개선되었을 뿐만 아니라 최대 드레인 전류 특성도 594 mA/mm에서 634 mA/mm로 증가하였다. 질화갈륨 희생층 공정의 효과를 분석하기 위해 X-선 광전자 분광법을 이용하여 질화갈륨의 표면 변화에 대해 살펴보았다.

• 마이크로전자및패키징학회지
• /
• 제8권2호
• /
• pp.25-29
• /
• 2001

본 연구에서는 mesocarbon microbeads(MCMB)카본에 에폭시 수지(resin)를 코팅시킴으로 서 카본전극 표면개질에 따른 전지 성능의 개선효과에 관하여 고찰하였다. 에폭시 수지에 의한 카본의 표면코팅은 MCMB 분말을 에폭시 수지가 용해된 THF(tetrahydrofuran)용액에 넣어 혼합함으로서 표면에 에폭시 수지가 코팅 되도록 하였다. 이렇게 에폭시 수지가 코팅된 MCMB를 $1000^{\circ}C$이상의 온도로 열처리하여 고분해능 투과전자현미경으로 관찰한 결과, 코팅층은 비정질 카본 구조를 지님을 알 수 있었다. 또한, 에폭시 수지에 의하여 코팅된 MCMB는 코팅되지 않은 MCMB보다 더 높은 BET비 표면적을 나타내었으며, 더 우수한 충방전 용량과 싸이클 특성을 나타내었다. 카본표면에 코팅된 에폭시 수지가 얇은 비정질 막으로 표면에 존재함으로서 전해질과 카본결정과의 반응을 억제시키는 방지막 역할을 하기 때문에 전지특성이 개선된 것으로 해석된다.

• 한국진공학회지
• /
• 제13권3호
• /
• pp.120-126
• /
• 2004

트렌치 소자 제조시 게이트 산화막 성장과 내압 강하의 원인이 되는 식각손상 회복과 코너 영역의 구조를 개선하기 위해 수소 분위기 열처리를 하였다. 열처리시 수소 원자에 의한 환원 반응을 이용하여 표면 에너지가 높은 코너 영역에서는 원자들의 이동에 의한 결정면 재배열, 산화막 측벽에서의 실리콘 원자 적층, 표면 거칠기의 개선 효과 등을 전자현미경 관찰을 통해 확인하였다. 실리콘 원자의 이동을 방해하는 식각 후 잔류 산화막을 수소 가스의 환원성 분위기에서 열처리함으로써 표면 에너지를 낮추는 방향으로 원자의 이동이 일어나 concave 영역, 즉 트렌치 bottom corner에서는 (111), (311) 결정면 재분포 현상이 일어남을 확인할 수 있었다. 또한 convex comer에서의 원자 이동으로 인해 corner 영역에서는 (1111) 면의 step 들이 존재하게 되고 원자 이동에 의해 산화막 측벽에 이르러 이동된 원자의 적층이 일어나며, 이는 열처리시 표면 손상 회복이 원자이동에 의함을 나타낸다. 이러한 적층은 표면 상태가 깨끗할수록 정합성을 띄어 기판과 일치하는 에피 특성을 나타내고 열처리 온도가 높을수록 표면 세정 효과가 커져 식각손상 회복효과가 커지며, 이를 이용하여 이후의 산화막 성장시 균일한 두께를 코너영역에서 얻을 수 있었다

• 한국재료학회지
• /
• 제25권7호
• /
• pp.336-340
• /
• 2015

For rear metallization with Al paste, Al back contacts require good passivation, high reflectance, and a processing temperature window compatible with the front metal. In this paper, the effect of the firing ambient during the metallization process on the formation of Al rear metal was investigated. We chose three different gases as ambient gases during the firing process. Using SEM, we observed the formation of a back surface field in $N_2$, $O_2$, and Air ambients. To determine the effect of the ambient on Voc, the suns-Voc tool was used. In this study, we described the mechanism of burn-out of organic materials in Al paste during the firing process. The oxygen ambient plays an important role in the burn-out process. We calculated the efficiency with obtained the back surface recombination velocities using PC1D simulation. It was found that the presence of oxygen during the firing process influenced the uniform back surface field because the organic materials in the Al paste were efficiently burned out during heating. The optimized temperature with oxygen flow shows an absolute efficiency of 19.1% at PC1D simulation.