• Journal of Surface Science and Engineering
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• v.53 no.1
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• pp.29-35
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• 2020

In this study, five different specimen preparation methods were introduced and their advantages and disadvantages were presented. One of them, an epoxy mounting method has advantages of constant exposure area, ease of surface preparation without touching the specimen surface during polishing or cleaning, use of small amount of material and ease of specimen reuse by polishing or etching. However, in order to eliminate unexpected errors resulting from preferable reaction at the specimen/epoxy interface and contact resistance between the specimen and copper conducting line for electrical connection, it is recommended to cover the wall side of the specimen with porous anodic oxide films and to remain the contact resistance lower than 1 ohm. The increased contact resistance between the specimen and Cu conducting line appeared to result in increases of anodizing voltage and solution temperature during anodizing by which thickness and hardness of anodizing film on Al2024 alloy were drastically decreased and color of the films became more brightened.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3187-3189
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• 1999

A novel wide-tunable quadratic gamma corrector for HDTV camera applications is proposed. The new gamma corrector controls gamma value in a wide range by simple electrical adjustment of multipliers' gain. It has wide signal bandwidth of 30MHz sufficient for HDTV applications. It also simplifies the circuit design, resulting in a compact surface mounting board implementation with reduced power consumption. Simulation and experimental results confirm these characteristics.

• Journal of Korea Society of Digital Industry and Information Management
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• v.15 no.2
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• pp.63-70
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• 2019

To increase the efficiency of task on the desk, this paper proposes a reconfigurable desk. The proposed reconfigurable desk is based on the Pin Art technology. For the design of the proposed desk, the upper surface of the desk is divided into small units, and then the user easily controls the height of the divided pieces to make desk a desired shape by using the proposed user interface. The Arduino module controls the hardware and the user interface is configured by using Android applications, making it easy for anyone to use. Through extensive experiments, the proposed system shows that various types of deformations are possible and thus the utilization is very high by mounting diverse devices.

• Biotechnology and Bioprocess Engineering:BBE
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• v.9 no.2
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• pp.127-131
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• 2004

A low-cost, simple strip reader system using a linear movement mechanism of CD-ROM deck has been developed to characterize a lateral flow membrane-based immunochromatographic assay. The test strip reader was assembled by a CD-ROM deck and home-made optical head especially designed for immunoassays. The optical head for detecting reflected light from the test strip surface consists of green light-emitting diode, large area silicon photodiode, and anodized aluminum mounting block providing a slit structure for cutting light from the LED. The stepping motor of the deck was operated in the full step mode, whose distance of each reading point is about 0.15mm. The performance of the strip reader was tested by analysis of HBV(hepatitis B virus) antigen test kit. This strip reader can be useful for inexpensive, disposable, and membrane-based assays that provide visual evidence of the presence of an analyte in a liquid sample.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.48-51
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• 1997

This paper presents the algorithm of FIC inspection in chip mounter. When device is mounted on the PCB, it is impossible to get zero defects since there are many problems which can not be predicted. Of these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). In this paper, we proposed a new algorithm based on the Radon transform which uses a projection to inspect the FIC(Flat Integrated Circuit) device and compared this method with other algorithms. We measured the position error and applied this algorithm to our image processing board which is characterized by line scan camera. We compared speed and accuracy in our board.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.729-734
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• 2005

One of the important research issues in mobile robot is how to detect the 3D environment fast and accurately, and recognize it. Sensing methods of utilizing laser structured light and/or stereo vision are representatively used among a number of methodologies developed to date. However, the methods are still in need of achieving high accuracy and reliability to be used for real world environments. In this paper to implement a new robotic environmental sensing algorithm is presented by combining the information between intensity image and that of laser structured light image. To see how effectively the algorithm applied to real environments, we developed a sensor system that can be mounted on a mobile robot and tested performance for a series of environments.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.561-564
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10b
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• pp.923-928
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• 1990

This paper describes the design and implementation of a real-time, high-precision vision system and its application to SMT(surface mounting technology) automation. The vision system employs a 32 bit MC68030 as a main processor, and consists of image acquisition unit. DSP56001 DSP based vision processor, and several algorithmically dedicated hardware modules. The image acquisition unit provides 512*480*8 bit image for high-precision vision tasks. The DSP vision processor and hardware modules, such as histogram extractor and feature extractor, are designed for a real-time excution of vision algorithms. Especially, the implementation of multi-processing architecture based on DSP vision processors allows us to employ more sophisticated and flexible vision algorithms for real-time operation. The developed vision system is combined with an Adept Robot system to form a complete SMD system. It has been found that the vision guided SMD assembly system is able to provide a satisfactory performance for SND automation.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.