• 마이크로전자및패키징학회지
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• 제25권1호
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• pp.23-28
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• 2018

최근 4차 산업혁명의 조류 하에 표면 실장 분야에서도 Smart Factory 구현을 위한 노력이 활발히 이루어지고 있다. 표면 실장 분야에서도 이러한 변화와 발 맞추어 많은 연구가 진행되고 있으며, 그중 핵심 공정이라 할 수 있는 솔더 인쇄 공정의 최적화에 대한 방법과 인쇄 효율에 영향을 미치는 인쇄 외적 요소에 대한 영향도를 분석하였다. 이 분석에는 설비에서 제공하는 Big Data를 활용하여 통계적 방법으로 접근하였고, 신뢰성 높은 결과와 함께 시뮬레이션을 통해 결과을 예측할 수 있는 가능성을 확인하였다. 이 연구가 실장 분야의 Smart Factory 구현에 조금이나마 기여가 되었으면 하는 바람이다.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2004년도 제22회 춘계학술대회논문집
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• pp.699-702
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• 2004

In this study, the affect of mounting axisymmetrical supersonic inlet to airfoil, which has 65 degree swept angle was numerically investigated. The parameter for this calculation are tree stream Mach number M=2.0 and 2.5, the distance between inlet spike and airfoil lower surface $L_{sw}$/$R_{cowl}$ = 1.21-1.54 and angle of attack to the airfoil 0-4. The mass capture ratio improved 3points in M=2.0 condition and 1points in M=2.5 while the mass capture ratio without airfoil surface was 57% and 71 % for each case. These are the result from increase of density and change of velocity deflection by the shock wave structure formed between inlet and airfoil surface. On the other hand, the distortion of Mach number at cowl lip plane increased by 13% in M=2.0, 3% in M=2.5 condition. The effects of the angle attack on the mass capture ratio is greater than that of the shock wave interaction between inlet and cowl, but the effects to the distortion is smaller in the range of this calculation condition. In the condition of M=2.0 with 4 degrees of angle of attack, inlet distortion of Mach number is mainly caused by the affects of the shock wave interaction between inlet and airfoil surface, while the largest angle of the velocity vector in the radial direction at cowl lip plane is caused by the affect of angle of attack. This large velocity vector made the flow inside the cowl subsonic and caused spillage, which interfere with the boundary layer of airfoil surface.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.218-221
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• 2007

The surface mounting technology of 0402 electric chip part is necessary to fabricate a high density and multi-functional module, but there is a limitation of the technology, like as a bridge and self-alignement. This work estimated SMT processing factors of 0402 chip. To obtain optimum SMT process, we evaluated effects of stencil thickness, shape of hole on printability and mountability. Printability shows best results under the thickness of $80{mu}m$ with circle hole shape and 90% square hole shape. In case of chip mounting process, chip mis-alignment and bridge was occurred rarely in same conditions. In more thin stencil thickness, $50{mu}m$, strength of 1005 chip parts was poor, because of amount of printed solder was insufficient.

• 반도체디스플레이기술학회지
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• 제13권1호
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• pp.13-17
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• 2014

Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.

• 청정기술
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• 제22권3호
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• pp.203-207
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• 2016

Here, we report a novel fabrication technique for patchable organic lasing sheet based on non-volatile liquid organic semiconductors and freestanding polymeric film with high flexibility and patchability. For this work, we have fabricated the second-order DFB grating structure, which leads to surface emission, embedded in the freestanding polymeric film. Using an ultra-violet (UV) curable polyurethaneacrylate (PUA) mixture, the periodic DFB grating structure can be easily prepared on the freestanding polymeric film via a simple UV curing process. Due to unsaturated acrylate remained in the PUA mixture after UV curing, the freestanding PUA film provides adhesive properties, which enable mounting of the patchable organic lasing sheet onto non-flat surfaces with conformal contact. To achieve laser actions in the freestanding resonator structure, a composite material of liquid 9-(2-ethylhexyl)carbazole (EHCz) and organic laser dyes was used as the laser medium. Since the degraded active materials can be easily refreshed by a simple injection of the liquid composite, such a non-volatile liquid organic semiconducting medium has degradation-free and recyclable characteristics in addition to other strong advantages including tunable optoelectronic responses, solvent-free processing, and ultimate mechanical flexibility and uniformity. Lasing properties of the patchable organic lasing sheet were also investigated after mounting onto non-flat surfaces, showing a mechanical tunability of laser emission under variable surface curvature. It is anticipated that these results will be applied to the development of various patchable optoelectronic applications for light-emitting displays, sensors and data communications.

• 마이크로전자및패키징학회지
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• 제31권2호
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• pp.69-77
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• 2024

최근 전자기기의 소형화, 다기능화 등으로 인한 전자부품 실장 영역의 한계치를 극복하고 플라스틱 사출물에 직접 회로를 인쇄하고 소자 및 부품을 실장하는 molded interconnect device (MID) 형태의 패키징 기법이 도입되고 있다. 다만 열 안정성이 낮은 플라스틱 사출물을 사용하는 경우, 종래의 리플로우 공정을 통한 부품 실장에 어려움이 있다. 본 연구에서는 특정 부위 혹은 소재만을 가열할 수 있는 유도가열 현상을 이용하여 플라스틱에 어떠한 열 데미지 없이 솔더를 용융시켜 실장하는 공정을 개발하였다. 가열하고자 하는 부위에 자속을 집중시킬 수 있는 유도가열용 Cu 코일 형상을 설계하고, 유한요소해석을 통해 패드부 자속 집중 및 가열 정도를 검증하였다. Polycarbonate 기판 위에 실장공정 검증을 위한 LED, capacitor, resistor, connector를 각각 유도가열을 통해 실장하고 작동여부를 확인하였다. 본 연구를 통해 리플로우 공법의 한계를 극복가능한 자기유도를 통한 선택적 가열 공정의 적용 가능성을 제시하였다.

• Journal of Welding and Joining
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• 제27권1호
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• pp.85-89
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• 2009

Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengos were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under $5^{\circ}$ and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.

• 전자공학회논문지B
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• 제29B권1호
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• pp.76-84
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• 1992

The vision system is essential for SMT(Surface Mounting Technology) automation. The system plays the role of matching the positions betweem SMD and PCB, and inspecting SMD in the final stage of mounting. Real-time processing and high-precision are indispensable for practical purpose. In this paper, a new algorithm for position matching and inspection of SMD is proposed, and which is implemented on the DSP board using DSP board using DSP5600. Experimental results show mean matching error within 0.1 mm in the direction of x,y and execution time within 300msec. Therefore, we could attain high-speed and high-precision of the vision system for SMT automation.

• Structural Engineering and Mechanics
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• 제65권5호
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• pp.535-546
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• 2018

The objective of this study is to understand the behaviour of hollow core slabs strengthened with FRP and hybrid techniques through numerical and analytical studies. Different strengthening techniques considered in this study are (i) External Bonding (EB) of Carbon Fiber Reinforced Polymer (CFRP) laminates, (ii) Near Surface Mounting (NSM) of CFRP laminates, (iii) Bonded Overlay (BO) using concrete layer, and (iv) hybrid strengthening which is a combination of bonded overlay and NSM or EB. In the numerical studies, three-dimensional Finite Element (FE) models of hollow core slabs were developed considering material and geometrical nonlinearities, and a phased nonlinear analysis was carried out. The analytical calculations were carried out using Response-2000 program which is based on Modified Compression Field Theory (MCFT). Both the numerical and analytical models predicted the behaviour in agreement with experimental results. Parametric studies indicated that increase in the bonded overlay thickness increases the peak load capacity without reducing the displacement ductility. The increase in FRP strengthening ratio increased the capacity but reduced the displacement ductility. The hybrid strengthening technique was found to increase the capacity of the hollow core slabs by more than 100% without compromise in ductility when compared to their individual strengthening schemes.

• 제어로봇시스템학회논문지
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• 제4권3호
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• pp.384-391
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• 1998

When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.