• Proceedings of the KIEE Conference
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• 2003.07d
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• pp.2453-2455
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• 2003

We propose a path planning method to reduce the inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.35-40
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• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.3
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• pp.130-134
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• 2018

In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

• Journal of the Semiconductor & Display Technology
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• v.15 no.3
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• pp.18-23
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• 2016

QFN (Quad Flat No-leads Package) is one of the SMD (Surface Mount Device). Since there is no lead in QFN, there are many defects on solder. Therefore, we propose an efficient mechanism for QFN solder defect detection at this paper. For this, we employ Convolutional Neural Network (CNN) of the Machine Learning algorithm. QFN solder's color multi-layer images are used to train CNN. Since these images are 3-channel color images, they have a problem with applying to CNN. To solve this problem, we used each 1-channel grayscale image (Red, Green, Blue) that was separated from 3-channel color images. We were able to detect QFN solder defects by using this CNN. In this paper, it is shown that the CNN is superior to the conventional multi-layer neural networks in detecting QFN solder defects. Later, further research is needed to detect other QFN.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.3
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• pp.8-14
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• 2016

Medical bed head consoles (BHC) are generally used to increase the efficiency of medical equipment and speed the medical treatment response time. The BHC design has been consistently improved including a movable shelf unit that is embedded to mount stably medical instruments on the lower part of the main console. The cost of a BHC can be reduced through design optimization to limit the overall weight. However, as the size of a head console might decrease due to design optimization, the BHC deflection could be increased. In this study, multi-objective optimal design was adopted to consider this BHC design problem. In order to reduce the cost of optimization planning, an approximate model was applied for the design optimization. In the context of approximate optimization, we used the response surface method and non-dominant sorting genetic algorithm developed from various fields. Multi-objective optimal solutions were also compared with a single objective optimal design.

• Journal of Korea Foundry Society
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• v.34 no.1
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• pp.14-21
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• 2014

Magnesium and its alloys are being applied to various kinds of industrial fields, especially their use on automotive parts and electronic part. These parts are manufactured mainly through diecasting process and magnesium ingots are used as raw materials. In the case that ingot quality is not secured, massive casting defects can occur and some manufactures can be damaged by the defects. This study is to evaluate ingots' cleanliness of magnesium alloys. It includes composition analysis by spectrometer, measurement of inclusion contents by SEM, brightness test on fractured surface and etc. Especially, the brightness test is a very easy and quick evaluation method. The brightness becomes low when the amount of oxides or inclusions on the surface increases. The brightness test data have been compared with those obtained from other methods for measuring the mount of impurities, which showed good relationship between the brightness and the others. Thus, the brightness test could be a promising method to measure the cleanliness of magnesium alloys.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.1
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• pp.64-68
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• 2014

This paper introduces the use of a crown-shaped (CR) lens to effectively diffuse the light from a light-emitting diode (LED) without any loss in the light intensity, in contrast to polymer-bulb-type diffusers. The diffusion lens was designed based on the Snell's law, which describes the physical path of a ray passing through the boundary between different media. CR lenses were fabricated by polydimethylsiloxane (PDMS) casting and UV-embossing processes, which used a pre-designed metal mold and UV-curable resin, respectively. Through experiments and optical evaluations, it was verified that the newly proposed CR lens not only decreased the vertical light strength and glare effect from an LED light source but also improved the diffusion characteristics while maintaining the quality of the LED's light intensity.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.43-48
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• 2001

Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power losses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out in Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of such domain of hybrid circuits are also discussed.