• Title/Summary/Keyword: Surface Inspection

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Deep Learning Based Real-Time Painting Surface Inspection Algorithm for Autonomous Inspection Drone

  • Chang, Hyung-young;Han, Seung-ryong;Lim, Heon-young
    • Corrosion Science and Technology
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    • v.18 no.6
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    • pp.253-257
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    • 2019
  • A deep learning based real-time painting surface inspection algorithm is proposed herein, designed for developing an autonomous inspection drone. The painting surface inspection is usually conducted manually. However, the manual inspection has a limitation in obtaining accurate data for correct judgement on the surface because of human error and deviation of individual inspection experiences. The best method to replace manual surface inspection is the vision-based inspection method with a camera, using various image processing algorithms. Nevertheless, the visual inspection is difficult to apply to surface inspection due to diverse appearances of material, hue, and lightning effects. To overcome technical limitations, a deep learning-based pattern recognition algorithm is proposed, which is specialized for painting surface inspections. The proposed algorithm functions in real time on the embedded board mounted on an autonomous inspection drone. The inspection results data are stored in the database and used for training the deep learning algorithm to improve performance. The various experiments for pre-inspection of painting processes are performed to verify real-time performance of the proposed deep learning algorithm.

The Development of Surface Inspection System Using the Real-time Image Processing (실시간 영상처리를 이용한 표면흠검사기 개발)

  • 이종학;박창현;정진양
    • 제어로봇시스템학회:학술대회논문집
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    • 2000.10a
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    • pp.171-171
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    • 2000
  • We have developed m innovative surface inspection system for automated quality control for steel products in POSCO. We had ever installed the various kinds of surface inspection systems, such as a linear CCD and a laser typed surface inspection systems at cold rolled strips production lines. But, these systems cannot fulfill the sufficient detection and classification rate, and real time processing performance. In order to increase detection and classification rate, we have used the Dark, Bright and Transition Field illumination and area type CCD camera, and fur the real time image processing, parallel computing has been used. In this paper, we introduced the automatic surface inspection system and real time image processing technique using the Object Detection, Defect Detection, Classification algorithms and its performance obtained at the production line.

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A Study on the Detection of Surface Defect Using Image Modeling (영상모델링을 이용한 표면결함검출에 관한 연구)

  • 목종수;사승윤;김광래;유봉환
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.444-449
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    • 1996
  • The semiconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip affect on the functions of the semiconductors. The defects of the chip surface are cracks or voids. As general inspection method requires many inspection procedure, the inspection system which searches immediately and precisely the defects of the semiconductor chip surface is required. We suggest the detection algorithm for inspecting the surface defects of the semiconductor surface. The proposed algorithm first regards the semiconductor surface as random texture and point spread function, and secondly presents the character of texture by linear estimation theorem. This paper assumes that the gray level of each pixel of an image is estimated from a weighted sum of gray levels of its neighbor pixels by linear estimation theorem. The weight coefficients are determined so that the mean square error is minimized. The obtained estimation window(two-dimensional estimation window) characterizes the surface texture of semiconductor and is used to discriminate the defects of semiconductor surface.

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Hybrid Illumination System Design based on Illuminance Uniformity for Surface Inspection (표면 검사를 위한 조도 균제도 기반 하이브리드 조명계 설계)

  • Cho, Eun Deok;Kim, Gyung Bum
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.3
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    • pp.60-65
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    • 2019
  • In this paper, the hybrid illumination system for effectively detecting surface defects in steel plate with lowcontrast, non-uniformity and featureless is designed based on illuminance uniformity. First of all, characteristics of steel plate defects were considered and typical inspection illumination system is implemented. Optimum illumination parameters for uniformly illuminating an inspection area in the typical illumination system are selected based on the illuminance uniformity and illuminance distribution measurement. The illuminance uniformity and illuminance distribution are measured using an illuminometer based on the arduino. Through illuminance distribution analysis of the typical illumination, an hybrid illumination is designed by fusing bi-directional illumination and coaxial illumination. The hybrid illumination showed higher uniformity ratio and illuminance distribution than the typical illuminations. The hybrid illumination system showed the ability to uniformly illuminate the entire inspection region of steel plate surface.

결함검출을 위한 실험적 연구

  • 목종수
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1996.03a
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    • pp.24-29
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    • 1996
  • The seniconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip effect on the functions of the semiconductors. The defects of the chip surface is crack or void. Because general inspection method requires many inspection processes, the inspection system which searches immediately and preciselythe defects of the semiconductor chip surface. We propose the inspection method by using the computer vision system. This study presents an image processing algorithm for inspecting the surface defects(crack, void)of the semiconductor test samples. The proposed image processing algorithm aims to reduce inspection time, and to analyze those experienced operator. This paper regards the chip surface as random texture, and deals with the image modeling of randon texture image for searching the surface defects. For texture modeling, we consider the relation of a pixel and neighborhood pixels as noncasul model and extract the statistical characteristics from the radom texture field by using the 2D AR model(Aut oregressive). This paper regards on image as the output of linear system, and considers the fidelity or intelligibility criteria for measuring the quality of an image or the performance of the processing techinque. This study utilizes the variance of prediction error which is computed by substituting the gary level of pixel of another texture field into the two dimensional AR(autoregressive model)model fitted to the texture field, estimate the parameter us-ing the PAA(parameter adaptation algorithm) and design the defect detection filter. Later, we next try to study the defect detection search algorithm.

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Development of Inspection System for Surface of a Shock Absorber Rod using Machine vision (머신비전을 이용한 업쇼버 로드의 표면검사 시스템 개발)

  • Kim, Seong-Jin;Lee, Seong-Cheol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.6
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    • pp.3416-3422
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    • 2014
  • A shock absorber rod is located in the center of the absorber piston and is responsible for the reciprocating movement portion. If it has surface defects, the damping performance of product will be adversely affected. A rod surface has gloss by heat treatment. Therefore, it is difficult to find a defect, such as dust, imprints, and blowholes. Because a total inspection is achieved by visual inspection by workers, it causes eyestrain and the quality of the product is not constant. In this paper, a machine vision system was developed to find a defect using a line-scan camera. The machine can detect surface defects than 0.3mm. To minimize the occurrence probability of defects on the inspection process, the developed auto inspection system had an automatic feeding system and incorporated a protection system. Through the development of this system, which relies on the operator's visual inspection of the surface of the shock absorber, the Rod inspection system constructed quality inspection standards and standardized tests to ensure improved reliability.

Development of Touch Probe Collision Avoidance Algorithm for OMM Using Offset Surface and Dynamic Error Compensation (OMM 에서 Offset Surface 를 이용한 접촉식 Probe 의 충돌회피 알고리즘 개발 및 동적 에러 보정)

  • 정석현;김동우;조명우;서태일
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.10a
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    • pp.323-326
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    • 2004
  • In this study, the inspection path which is considered to free collision is generated by offset surface. When the inspection is executed, the consideration of machine dynamic error increases a precision. Dynamic error is measured on CNC machine bed changing of weight work price. Offset surface is safety space about collision. Because the danger of probe-collision is excluded in Offset surface, it is possible to rapid feed of probe and reduced inspection time. The Program which is possible to simulate using CAIP and is confirmed through actual experiment.

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Development of Real-Time COF Film Complex Inspection System using Color Image (컬러영상을 이용한 실시간 COF 필름 복합 검사시스템 개발)

  • Kim, Yong-Kwan;Lee, In Hwan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.10
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    • pp.112-118
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    • 2021
  • In this study, an inspection method using a color image is proposed to conduct a real-time inspection of covalent organic framework (COF) films to detect defects, if any. The COF film consists of an upper pattern SR and a lower PI. The proposed system detects the defects of more than 20 ㎛ on the SR surface owing to the characteristics of the pattern, whereas on the PI surface, it detects defects of more than 4 ㎛ by utilizing a micro-optical system. In the existing system, it is difficult for the operator to conduct a full inspection through a high-performance microscope. The proposed inspection algorithm performs the inspection by separating each color component using the color contrast of the pattern on the SR side, and on the PI surface it inspects the bonding state of the mounted chip. As a result, it is possible to confirm the exact location of the defects through the SR and PI surface inspections in the implemented inspection.

3-D Solder Paste Inspection Based on B-spline Surface Approximation (B-spline 표면 근사화 기반의 3차원 솔더 페이스트 검사)

  • Lee, Joon-Jae;Lee, Byoung-Gook;Yoo, Jae-Chil
    • Journal of the Korean Society for Industrial and Applied Mathematics
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    • v.10 no.1
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    • pp.31-45
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    • 2006
  • Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.

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A Study on the Optimal Condition Determination of Laser Scattering Using the Design of Experiment (실험계획법을 이용한 레이저 산란의 최적 조건 결정에 대한 연구)

  • Han, Jae-Chul;Kim, Gyung-Bum
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.7
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    • pp.58-64
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    • 2009
  • In this paper, an inspection mechanism based on laser scattering has been developed for the surface evaluation of infrared cut-off filters, and optimum conditions of laser scattering are determined using the design of experiment. First of all, attributes and influence factors of laser scattering are investigated and then a laser scattering inspection mechanism is newly designed based on analyses of laser scattering parameters. Also, Taguchi method, one of experimental designs, is used for the optimum condition selection of laser scattering parameters and the optimum condition is determined in order to maximize the detection capability of surface defects. Experiments show that the proposed method is useful in a consistent and effective defect detection and can be applied to surface evaluation processes in manufacturing.